JPH029072B2 - - Google Patents
Info
- Publication number
- JPH029072B2 JPH029072B2 JP59190265A JP19026584A JPH029072B2 JP H029072 B2 JPH029072 B2 JP H029072B2 JP 59190265 A JP59190265 A JP 59190265A JP 19026584 A JP19026584 A JP 19026584A JP H029072 B2 JPH029072 B2 JP H029072B2
- Authority
- JP
- Japan
- Prior art keywords
- whiskers
- adhesive
- strength
- adhesives
- resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 37
- 230000001070 adhesive effect Effects 0.000 claims description 37
- 239000000919 ceramic Substances 0.000 claims description 19
- 229910052581 Si3N4 Inorganic materials 0.000 description 10
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 10
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical class [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 9
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 6
- 239000005060 rubber Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- LULCPJWUGUVEFU-UHFFFAOYSA-N Phthiocol Natural products C1=CC=C2C(=O)C(C)=C(O)C(=O)C2=C1 LULCPJWUGUVEFU-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000004826 Synthetic adhesive Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- -1 vinyl resins, acrylic Chemical compound 0.000 description 2
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 230000002301 combined effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、セラミツクウイスカーを含有した接
着剤に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an adhesive containing ceramic whiskers.
（従来技術）
昨今、接着剤はプラスチツクスの発展につれ
て、種々の合成系接着剤が開発されるに至り、急
速な進歩を遂げており、特に、航空機、自動車用
構造用部の接合においては、溶接やボルト止めに
代わる方法として被接着部材に近い強度を得るも
のまで出現している。(Prior Art) Adhesives have recently made rapid progress with the development of plastics and the development of various synthetic adhesives.Especially in joining structural parts for aircraft and automobiles, adhesives have made rapid progress. As an alternative to welding or bolting, methods have even emerged that provide strength close to that of the bonded parts.
従来より、接着剤の熱伝導性、電気絶縁性およ
び耐熱性、改善する目的で、窒化アルミニウム粒
の表面に耐食性の高い絶縁層（セラミツク）を被
覆し、これを熱硬化型合成樹脂に含有させた耐熱
性接着剤が知られている（特開昭59―22961号）。
また、耐圧縮強度ならびに耐引張強度の改善を目
的として、接着剤としてガラス繊維を混入した接
着剤を使用する技術も知られている（特開昭54―
59307号）。さらにまた、接着強度、張り合わせ強
度、折れ強度などの機械的強度、ならびに導電性
を改善するために、金属粉末とガラス粉末を耐熱
硬化性樹脂に配合した導電性接着剤が知られてい
る（特開昭49―97845号）。 Conventionally, in order to improve the thermal conductivity, electrical insulation, and heat resistance of adhesives, the surface of aluminum nitride grains has been coated with a highly corrosion-resistant insulating layer (ceramic), and this has been incorporated into thermosetting synthetic resin. A heat-resistant adhesive is known (Japanese Patent Application Laid-Open No. 59-22961).
Furthermore, for the purpose of improving compressive strength and tensile strength, it is also known to use an adhesive mixed with glass fiber (Japanese Unexamined Patent Application Publication No. 1989-1999).
No. 59307). Furthermore, in order to improve mechanical strength such as adhesive strength, laminating strength, and bending strength, as well as electrical conductivity, conductive adhesives are known in which metal powder and glass powder are blended with heat-resistant hardening resin (especially No. 97845).
（発明が解決しようとする問題点）
しかしながら、これまでの合成系接着剤には特
に、耐熱性、耐クリープ性などの点で問題があ
り、かつ、接着強度においても接合部材の強度に
比べ、一般に劣るものが多かつた。(Problems to be Solved by the Invention) However, conventional synthetic adhesives have problems in terms of heat resistance, creep resistance, etc., and their adhesive strength is also inferior to the strength of the bonding members. There were many that were generally inferior.
（問題点を解決するための手段）
本発明は上述の点に鑑み、発明されたものであ
つて、従来の接着剤に用いられている熱硬化性樹
脂、熱可塑性樹脂、天然または合成ゴム系、さら
に、これらの混合物などの接着剤成分に窒化珪素
ウイスカーもしくは炭化珪素ウイスカーなどのセ
ラミツクウイスカーを所定割合で添加配合してお
くことにより接合部材間の強固な接着強度及び耐
熱性、耐クリープ特性などを向上せしめた接着剤
を提供しようとするものである。(Means for Solving the Problems) The present invention was invented in view of the above-mentioned points, and is based on thermosetting resins, thermoplastic resins, natural or synthetic rubbers, which are used in conventional adhesives. Furthermore, by adding and blending ceramic whiskers such as silicon nitride whiskers or silicon carbide whiskers in a predetermined ratio to the adhesive component such as a mixture of these, strong adhesive strength, heat resistance, creep resistance, etc. between bonding members can be achieved. The aim is to provide an adhesive with improved properties.
以下、本発明の構成について説明する。 The configuration of the present invention will be explained below.
すなわち、本発明の構成要旨とするところはセ
ラミツクウイスカーを接着剤成分
に対して0.1〜50重量部添加配合したことを特徴
とするセラミツクウイスカーを含有する接着剤で
ある。 That is, the gist of the present invention is an adhesive containing ceramic whiskers, characterized in that 0.1 to 50 parts by weight of ceramic whiskers are added to the adhesive component.
ここで、接着剤成分として使用する樹脂として
は、たとえば、熱硬化性合成樹脂として、フエノ
ール樹脂、レゾルシノール樹脂、ユリア樹脂、メ
ラミン樹脂、ポリエステル樹脂、アルキド樹脂、
エポキシ樹脂、フラン樹脂、ポリウレタン樹脂、
シリコーン樹脂などがあり、また、熱可塑性合成
樹脂として、たとえば、ビニル系樹脂、アクリル
系樹脂、繊維素系樹脂、クマロンインデン樹脂、
ポリイソブチレン樹脂、ポリアミド樹脂、アスフ
アルト樹脂などで、熱硬化性樹脂と熱可望性樹脂
の混合系もある。さらに、ゴム系として天然ゴ
ム、再生ゴム、塩化ゴム、環化ゴム、ブタジエ
ン・アクリロニトリルゴム、ブタジエン・スチレ
ンゴム、ブチルゴム、ネオプレンゴム、チオコー
ル、チオコール・エポキシなどとその混合物、ま
た、瞬間接着剤としてシアノアクリレート、嫌気
性接着剤としてポリエチレングリコールジメタク
リレートなどがある。 Here, examples of resins used as adhesive components include thermosetting synthetic resins such as phenol resin, resorcinol resin, urea resin, melamine resin, polyester resin, alkyd resin,
Epoxy resin, furan resin, polyurethane resin,
There are silicone resins, and thermoplastic synthetic resins such as vinyl resins, acrylic resins, cellulose resins, coumaron indene resins,
There are polyisobutylene resins, polyamide resins, asphalt resins, etc., and there are also mixed systems of thermosetting resins and thermoplastic resins. Furthermore, as rubber-based materials, natural rubber, recycled rubber, chlorinated rubber, cyclized rubber, butadiene/acrylonitrile rubber, butadiene/styrene rubber, butyl rubber, neoprene rubber, thiocol, thiocol/epoxy, etc., and mixtures thereof, and instant adhesives such as cyano Examples of acrylate and anaerobic adhesives include polyethylene glycol dimethacrylate.
一方、セラミツクウイスカーとしては耐熱衝撃
性、耐熱膨脹性、耐熱性、耐化学性など種々の特
性のある窒化珪素もしくは炭化珪素よりなり、ア
スペクト比の非常に大きい針状単結晶であるセラ
ミツクウイスカーが最適であり、このほか、アル
ミナウイスカーも使用可能である。なお、本発明
において使用する窒化珪素もしくは炭化珪素のウ
イスカーとしては、たとえば、出願人がすでに出
願済の特願昭56―83095号（特開昭57―196711
号）、特願昭56―118878号、特願昭57―55196号、
特願昭57―96791号、及び特願昭57―233349号に
より得られる窒化珪素ウイスカーあるいは炭化珪
素ウイスカーを用いるのがもつとも好ましい。 On the other hand, ceramic whiskers are made of silicon nitride or silicon carbide, which have various properties such as thermal shock resistance, thermal expansion resistance, heat resistance, and chemical resistance, and are acicular single crystals with a very large aspect ratio. In addition to this, aluminum whiskers can also be used. The silicon nitride or silicon carbide whiskers used in the present invention include, for example, Japanese Patent Application No. 56-83095 (Japanese Unexamined Patent Publication No. 57-196711), which the applicant has already filed.
(No.), Japanese Patent Application No. 118878-1987, Special Application No. 55196-1987,
It is also preferable to use silicon nitride whiskers or silicon carbide whiskers obtained according to Japanese Patent Application No. 57-96791 and Japanese Patent Application No. 57-233349.
更に、接着剤成分とセラミツクウイスカーの添
加配合割合は、接着剤成分（100wt％）に対して
セラミツクウイスカーを0.1〜50wt％、好ましく
は１〜20wt％であるが、この際、この接着剤成
分とセラミツクウイスカーを充分に混合してセラ
ミツクウイスカーを接着剤成分中に均一に分散す
るようにする。ここで、接着剤成分（100wt％）
に対するセラミツクウイスカーの配合量が1wt％
以下ではセラミツクウイスカーの添加効果がきわ
めて低くなり、50wt％以上では接着剤の特性が
変わる。要するに、上述数値限定のごとくセラミ
ツクウイスカー配合量が0.1〜50wt％、好ましく
は１〜20wt％、さらに、好ましくは３〜10wt％
であれば、接着剤成分の特性とセラミツクウイス
カーの特性がいずれも損なわれることなく、もつ
とも理想的な複合効果が発揮される。 Furthermore, the additive blending ratio of the adhesive component and ceramic whiskers is 0.1 to 50 wt%, preferably 1 to 20 wt%, of ceramic whiskers to the adhesive component (100 wt%). Thoroughly mix the ceramic whiskers to ensure uniform dispersion of the ceramic whiskers throughout the adhesive component. Here, adhesive component (100wt%)
The blending amount of ceramic whiskers is 1wt%
If the content is below 50wt%, the effect of adding ceramic whiskers will be extremely low, and if it exceeds 50wt%, the properties of the adhesive will change. In short, as stated above, the content of ceramic whiskers is 0.1 to 50 wt%, preferably 1 to 20 wt%, more preferably 3 to 10 wt%.
If so, the properties of the adhesive component and the properties of the ceramic whiskers will not be impaired, and an ideal combined effect will be exhibited.
このように、本発明によれば、既存の接着剤に
対し、セラミツクウイスカーの具備するより優れ
た特性が付与されるが、製品として提供される接
着剤の最終形態としては、液状（溶剤系、及び無
溶剤系）、ホツトメルトタイプ（フイルム状、テ
ープ状、粉体、棒状など）、ペースト状など製品
用途に応じて適宜、決定すればよく、接着剤成分
とセラミツクウイスカーの配合比、ならびに接着
剤成分における溶剤の添加量、その他必要に応じ
て添加剤の量などを適宜、選択することにより、
所望の最終形態をとることが可能である。 As described above, according to the present invention, properties superior to those of ceramic whiskers are imparted to existing adhesives, but the final form of the adhesive provided as a product is liquid (solvent-based, Hot melt type (film, tape, powder, rod, etc.), paste type, etc. can be determined as appropriate depending on the product application, and the blending ratio of adhesive components and ceramic whiskers, as well as adhesion By appropriately selecting the amount of solvent added in the agent component and the amount of other additives as necessary,
It is possible to take the desired final form.
（実施例） つぎに、本発明の実施例について説明する。(Example) Next, examples of the present invention will be described.
実施例 １
ウレタン変性エポキシ樹脂EPU―６（旭電化工
業(株)製）100重量部、硬化剤として変性脂肪族ポ
リアミン系EH―220（旭電化工業(株)製）35重量部
にあらかじめシランカツプリング処理（信越化学
(株)製KBM403をウイスカーに対し２重量部添加）
された窒化珪素ウイスカー15重量部を添加し、
JISK―6850に基づき引張せん断強度を、また、
JISK―6854に基づきＴ―剥離強度を測定した。
なお、対照として窒化珪素ウイスカー無添加のも
のの引張せん断強度、剥離強度を測定した。Example 1 100 parts by weight of urethane-modified epoxy resin EPU-6 (manufactured by Asahi Denka Kogyo Co., Ltd.) and 35 parts by weight of modified aliphatic polyamine EH-220 (manufactured by Asahi Denka Kogyo Co., Ltd.) as a curing agent were added with a silane cup in advance. Ring treatment (Shin-Etsu Chemical)
2 parts by weight of KBM403 manufactured by Co., Ltd. is added to the whisker)
Adding 15 parts by weight of silicon nitride whiskers,
Tensile shear strength based on JISK-6850,
T-peel strength was measured based on JISK-6854.
As a control, the tensile shear strength and peel strength of a sample without silicon nitride whiskers were measured.
引張せん断強度についてはウイスカー無添加の
ものは23℃においては151Kg／cm2、100℃において
は117Kg／cm2であつたのに対し、ウイスカー添加
による本発明品では23℃において353Kg／cm2、100
℃においては303Kg／cm2と対照のものに比べ、格
段に優れ、ウイスカー添加効果が確認できた。 The tensile shear strength of the product without whiskers was 151Kg/cm 2 at 23℃ and 117Kg/cm 2 at 100℃, while the product of the present invention with whiskers added had a strength of 353Kg/cm 2 at 23℃ and 117Kg/cm 2 at 100℃. 100
℃, 303Kg/cm 2 , which was much better than the control, confirming the effect of whisker addition.
Ｔ―剥離強度についてはウイスカー無添加の対
照のものでは23℃においては９Kg／25mm、100℃
においては７Kg／25mmであつたのに対し、ウイス
カー添加による本発明品では23℃において26Kg／
25mm、100℃において23Kg／25mmと対照のものに
比べ、格段に優れており、ウイスカー添加効果が
確認できた。 Regarding T-peel strength, the control without whisker added had 9Kg/25mm at 23℃ and 100℃.
At 23℃, the weight was 7Kg/25mm, while the product of the present invention with whiskers added had a weight of 26Kg/25mm at 23℃.
At 25mm and 100℃, it was 23Kg/25mm, which was much better than the control, confirming the effect of whisker addition.
実施例 ２
アクリル樹脂系Ｃ―314（電気化学工業(株)製）
100重量部にあらかじめシランカツプリング処理
（日本ユニカー(株)製Ａ―187をウイスカーに対し２
重量部添加）された炭化珪素ウイスカー25重量部
を添加し、前述の方法にて測定を行つた。Example 2 Acrylic resin C-314 (manufactured by Denki Kagaku Kogyo Co., Ltd.)
100 parts by weight was pretreated with silane coupling treatment (A-187 manufactured by Nippon Unicar Co., Ltd.) on the whiskers.
25 parts by weight of silicon carbide whiskers (added in parts by weight) were added, and measurements were carried out by the method described above.
引張せん断強度についてはウイスカー無添加の
もの（対照）は23℃においては252Kg／cm2、100℃
において195Kg／cm2であつたのに対し、ウイスカ
ー添加による本発明品では、23℃においては623
Kg／cm2、100℃においては501Kg／cm2であつた。 Regarding the tensile shear strength, the one without whisker addition (control) was 252Kg/cm 2 at 23℃ and 100℃
The weight was 195Kg/cm 2 at 23℃, while the product of the present invention with whiskers added had a weight of 623Kg/cm 2 at 23℃.
Kg/cm 2 and 501 Kg/cm 2 at 100°C.
Ｔ―剥離強度についてはウイスカー無添加のも
のは、23℃においては10Kg／25mm、100℃におい
ては８Kg／25mmであるのに対し、ウイスカー添加
のものでは23℃において28Kg／25mm、100℃にお
いて24Kg／25mmであり、対照のものに比べ、ウイ
スカー添加効果が確認できた。 Regarding T-peel strength, the peel strength of the one without whiskers is 10Kg/25mm at 23℃ and 8Kg/25mm at 100℃, while the one with whiskers is 28Kg/25mm at 23℃ and 24Kg at 100℃. /25 mm, and compared to the control, the effect of whisker addition was confirmed.
また、実施例１および２ともに、温度上昇にと
もなう引張せん断強度ならびにＴ―剥離強度の低
下率がウイスカー添加よる本発明品のほうが低い
ことから、耐熱性などの点において優れているこ
とも判明した。 In addition, in both Examples 1 and 2, the reduction rate of tensile shear strength and T-peel strength with increasing temperature was lower in the products of the present invention due to the addition of whiskers, so it was found that the products of the present invention were superior in terms of heat resistance, etc. .
さらに、瞬間接着剤、嫌気性接着剤、熱可塑性
樹脂接着剤（ホツトメルトタイプ）についても前
記実施例と同様、窒化珪素ウイスカー、炭化珪素
ウイスカーを加えた場合、無添加の接着剤と比較
して接着強度及び耐熱性が数倍向上した結果が得
られた。 Furthermore, regarding instant adhesives, anaerobic adhesives, and thermoplastic resin adhesives (hot melt type), as in the previous example, when silicon nitride whiskers and silicon carbide whiskers were added, the results were compared to adhesives without additives. The results showed that the adhesive strength and heat resistance were improved several times.
（効 果）
以上の結果から理解できるように、本発明によ
れば窒化珪素あるいは炭化珪素のウイスカー添加
により既存接着剤の接着強度の向上、耐熱性など
の向上がはかられ、さらに、接着剤成分ならびに
窒化珪素ウイスカーもしくは炭化珪素ウイスカー
などのセラミツクウイスカーの両者の特性を損な
うことなく配合されているので、窒化珪素ウイス
カーあるいは炭化珪素ウイスカー自体の具備する
種々の特性もそのまま接着剤に付与される。(Effects) As can be understood from the above results, according to the present invention, by adding silicon nitride or silicon carbide whiskers, it is possible to improve the adhesive strength and heat resistance of existing adhesives. Since it is blended without impairing the properties of both the components and the ceramic whiskers such as silicon nitride whiskers or silicon carbide whiskers, the various properties of the silicon nitride whiskers or silicon carbide whiskers themselves are imparted to the adhesive as they are.
Claims (1)
0.1〜50重量部添加配合したことを特徴とするセ
ラミツクウイスカーを含有した接着剤。1 Add ceramic whiskers to adhesive components
An adhesive containing ceramic whiskers, characterized in that 0.1 to 50 parts by weight are added.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19026584A JPS6166772A (en) | 1984-09-10 | 1984-09-10 | Adhesive containing needle-like ceramic fiber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19026584A JPS6166772A (en) | 1984-09-10 | 1984-09-10 | Adhesive containing needle-like ceramic fiber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6166772A JPS6166772A (en) | 1986-04-05 |
| JPH029072B2 true JPH029072B2 (en) | 1990-02-28 |
Family
ID=16255265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19026584A Granted JPS6166772A (en) | 1984-09-10 | 1984-09-10 | Adhesive containing needle-like ceramic fiber |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6166772A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6366278A (en) * | 1986-09-08 | 1988-03-24 | Sumitomo Metal Mining Co Ltd | Electrically conductive adhesive |
| JPH02124990A (en) * | 1988-11-02 | 1990-05-14 | Kitagawa Kogyo Kk | Sealant composition having carbon fiber incorporated therein |
| WO2003022600A1 (en) | 2001-09-07 | 2003-03-20 | General Co., Ltd. | Transfer device |
| JP4079617B2 (en) * | 2001-10-01 | 2008-04-23 | ゼネラル株式会社 | Transfer tape, transfer tool, and method for cutting adhesive layer of transfer tape |
| JP5343335B2 (en) * | 2006-09-29 | 2013-11-13 | 東レ株式会社 | Adhesive sheet for electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4997845A (en) * | 1972-12-28 | 1974-09-17 | ||
| JPS5459307A (en) * | 1977-10-20 | 1979-05-12 | Emu Bii Koushiya Kk | Plywood producing method |
| JPS5922961A (en) * | 1982-07-29 | 1984-02-06 | Toshiba Corp | Heat-resistant adhesive |
-
1984
- 1984-09-10 JP JP19026584A patent/JPS6166772A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4997845A (en) * | 1972-12-28 | 1974-09-17 | ||
| JPS5459307A (en) * | 1977-10-20 | 1979-05-12 | Emu Bii Koushiya Kk | Plywood producing method |
| JPS5922961A (en) * | 1982-07-29 | 1984-02-06 | Toshiba Corp | Heat-resistant adhesive |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6166772A (en) | 1986-04-05 |
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