JPS6316904B2 - - Google Patents
Info
- Publication number
- JPS6316904B2 JPS6316904B2 JP12272782A JP12272782A JPS6316904B2 JP S6316904 B2 JPS6316904 B2 JP S6316904B2 JP 12272782 A JP12272782 A JP 12272782A JP 12272782 A JP12272782 A JP 12272782A JP S6316904 B2 JPS6316904 B2 JP S6316904B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- ceramic
- jig
- ceramic base
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 53
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 10
- 238000002844 melting Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12272782A JPS5832437A (ja) | 1982-07-14 | 1982-07-14 | セラミックケ−スの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12272782A JPS5832437A (ja) | 1982-07-14 | 1982-07-14 | セラミックケ−スの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5832437A JPS5832437A (ja) | 1983-02-25 |
| JPS6316904B2 true JPS6316904B2 (enrdf_load_stackoverflow) | 1988-04-11 |
Family
ID=14843087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12272782A Granted JPS5832437A (ja) | 1982-07-14 | 1982-07-14 | セラミックケ−スの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5832437A (enrdf_load_stackoverflow) |
-
1982
- 1982-07-14 JP JP12272782A patent/JPS5832437A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5832437A (ja) | 1983-02-25 |
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