JPS5832437A - セラミックケ−スの製造方法 - Google Patents

セラミックケ−スの製造方法

Info

Publication number
JPS5832437A
JPS5832437A JP12272782A JP12272782A JPS5832437A JP S5832437 A JPS5832437 A JP S5832437A JP 12272782 A JP12272782 A JP 12272782A JP 12272782 A JP12272782 A JP 12272782A JP S5832437 A JPS5832437 A JP S5832437A
Authority
JP
Japan
Prior art keywords
lead frame
ceramic
frame
jig
stopper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12272782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6316904B2 (enrdf_load_stackoverflow
Inventor
Seiichi Nishino
西野 誠一
Masashi Yamamoto
雅志 山本
Kazuichi Tsunoda
角田 和市
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON DENKI SHINKU GLASS KK
NEC Corp
Original Assignee
NIPPON DENKI SHINKU GLASS KK
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON DENKI SHINKU GLASS KK, NEC Corp, Nippon Electric Co Ltd filed Critical NIPPON DENKI SHINKU GLASS KK
Priority to JP12272782A priority Critical patent/JPS5832437A/ja
Publication of JPS5832437A publication Critical patent/JPS5832437A/ja
Publication of JPS6316904B2 publication Critical patent/JPS6316904B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Ceramic Products (AREA)
JP12272782A 1982-07-14 1982-07-14 セラミックケ−スの製造方法 Granted JPS5832437A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12272782A JPS5832437A (ja) 1982-07-14 1982-07-14 セラミックケ−スの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12272782A JPS5832437A (ja) 1982-07-14 1982-07-14 セラミックケ−スの製造方法

Publications (2)

Publication Number Publication Date
JPS5832437A true JPS5832437A (ja) 1983-02-25
JPS6316904B2 JPS6316904B2 (enrdf_load_stackoverflow) 1988-04-11

Family

ID=14843087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12272782A Granted JPS5832437A (ja) 1982-07-14 1982-07-14 セラミックケ−スの製造方法

Country Status (1)

Country Link
JP (1) JPS5832437A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6316904B2 (enrdf_load_stackoverflow) 1988-04-11

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