JPS6316648A - 集積回路パツケ−ジ温度検出構造 - Google Patents

集積回路パツケ−ジ温度検出構造

Info

Publication number
JPS6316648A
JPS6316648A JP61161145A JP16114586A JPS6316648A JP S6316648 A JPS6316648 A JP S6316648A JP 61161145 A JP61161145 A JP 61161145A JP 16114586 A JP16114586 A JP 16114586A JP S6316648 A JPS6316648 A JP S6316648A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit package
cold plate
temperature
temperature sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61161145A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0573261B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Tsukasa Mizuno
司 水野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61161145A priority Critical patent/JPS6316648A/ja
Publication of JPS6316648A publication Critical patent/JPS6316648A/ja
Publication of JPH0573261B2 publication Critical patent/JPH0573261B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP61161145A 1986-07-08 1986-07-08 集積回路パツケ−ジ温度検出構造 Granted JPS6316648A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61161145A JPS6316648A (ja) 1986-07-08 1986-07-08 集積回路パツケ−ジ温度検出構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61161145A JPS6316648A (ja) 1986-07-08 1986-07-08 集積回路パツケ−ジ温度検出構造

Publications (2)

Publication Number Publication Date
JPS6316648A true JPS6316648A (ja) 1988-01-23
JPH0573261B2 JPH0573261B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-10-14

Family

ID=15729447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61161145A Granted JPS6316648A (ja) 1986-07-08 1986-07-08 集積回路パツケ−ジ温度検出構造

Country Status (1)

Country Link
JP (1) JPS6316648A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011208932A (ja) * 2010-03-29 2011-10-20 Hamilton Sundstrand Corp コールドプレートアセンブリ
JP2013098468A (ja) * 2011-11-04 2013-05-20 Showa Denko Kk パワー半導体モジュール冷却装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011208932A (ja) * 2010-03-29 2011-10-20 Hamilton Sundstrand Corp コールドプレートアセンブリ
JP2013098468A (ja) * 2011-11-04 2013-05-20 Showa Denko Kk パワー半導体モジュール冷却装置

Also Published As

Publication number Publication date
JPH0573261B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-10-14

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