JPS63158103A - Production of hollow yarn type module - Google Patents

Abstract

PURPOSE:To protect the interface of a bonding part of hollow yarn in the outermost layer by making the height of an annular body for inserting the end part of hollow yarn higher than the height of an adhesive layer in the production of a polysulfone and polyether sulfone-base hollow yarn type module. CONSTITUTION:An annular body 4 having outer diameter smaller than the inner diameter of a cylindrical case 1 is inserted into the end part of the cylindrical case 1 consisting of acryl resin and polysulfone resin or the like so that the height of the annular body is made to be 2-10mm higher than the final height of an adhesive 5. After inserting the terminal part of hollow yarn 3 into the annular body 4, the end parts of the terminal part of the hollow yarn 3 and the annular body 4, the end parts of the annular body 4 and the cylindrical case 1, and the end parts of each terminal parts of hollow yarn 3 are bonded and sealed with the adhesive 5 respectively. In the hollow yarn module produced in such a way, since the outermast layer of the bundle of hollow yarn in protected by the annular body 4, troubles resulting from the breaking of hollow yarn hardly occur.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for producing polysulfone and polyethersulfone hollow fiber modules.

(Prior Art) Epoxy-based adhesives have traditionally been used to adhesively seal the ends of hollow fiber type modules.

(Problems to be Solved by the Invention) However, since this adhesive generates a large amount of self-heating during curing, when used in large quantities, temperature distribution occurs, resulting in uneven curing. At this time, strain will be accumulated inside the cured adhesive. In addition, epoxy adhesives have a relatively high shrinkage rate during curing, and when making large-diameter hollow prefectural police modules, large amounts of adhesive are used, which causes large internal distortions and causes damage to the edges of the case. There has been a problem in that peeling between the fiber and the adhesive or cracks occurring at the interface between the hollow fiber end and the adhesive portion may cause leakage in the module. In order to solve this problem, in Japanese Patent Application Laid-open No. 61-93803, a cylindrical case is filled with a bundle of hollow fibers, and a gap is formed between the end of the bundle of hollow fibers and the end of the case, and between the ends of the hollow fibers. In the manufacturing method of hollow fiber type Modineal, which is adhesive-sealed with an adhesive, an annular body having an outer diameter smaller than the inner diameter of the case is fitted into the end of the case, and the end of the hollow fiber bundle is inserted into the annular body. After that, the problem was solved by adhesively sealing between the ends of the hollow fiber bundle and the annular body, between the annular body and the case end, and between the ends of the hollow fiber bundle with an adhesive.

However, this method has additional problems. The epoxy adhesive has the effect of partially swelling or dissolving the polysulfone or polyethersulfone hollow fibers.

This will be explained specifically. Breaking strength of one piece: 130g
A force of 20.9% was applied to a polyethersulfone hollow fiber, and the middle part of the hollow fiber was soaked in epoxy base material Epicoat S28@(manufactured by Yuka Shell Co., Ltd.) K at 70°C for about 10 minutes. I cut it from the point where it was pickled. Same thing [Approx.
Cut in minutes. Next, a similar experiment was carried out on Epikote 815■, which was cut in about 2 minutes at 50°C. Similar experiments were conducted with polysulfone hollow fibers, which broke several times faster than polyethersulfone hollow fibers. Considering the above, polysulfone and polyethersulfone are swollen by epoxy, and the rate of swelling is slower as the temperature is higher, and over a long period of time they will be dissolved by epoxy. However, epoxy adhesives are commonly used because they have high heat resistance and strong adhesive strength, but the swelling effect described above is only a problem when the adhesive is in liquid form; The current practice is to cure the adhesive before the hollow fibers swell and deteriorate to create hollow fiber membrane modules. However, this method partially degrades the hollow fibers. The biggest problem in this case occurs at the interface of the adhesive part. In the adhesive part, the hollow fibers are firmly supported by the adhesive, so there is no problem, but deterioration at the interface of the adhesive part becomes a problem when force is applied to the hollow fibers.

Another problem when using epoxy adhesives is the inflexibility of epoxy adhesives. At the interface of the adhesive part, the adhesive creeps up between the hollow fibers due to capillary action as shown in FIG. This height is inversely proportional to the distance between the hollow fibers. At the tip of the hollow fiber, there is an interface between the part surrounded by adhesive from the outside and the hollow fiber alone. If a lateral force acts on the hollow fibers above this interface, the ends of the hollow fiber bundle will break due to a very weak force. This is thought to be because the epoxy adhesive is inflexible and has little ability to deform and release force. This causes the hollow fiber module to become very weak.

That is, a lateral force is applied to the hollow fiber when water is passed through the module, and a problem also occurs when the module is dropped on the hollow fiber due to carelessness and a shock is applied. Furthermore, in steam sterilization performed by aeration of live steam, a gas-liquid interface between water and steam may occur, resulting in a state of severe bubbling, which causes the yarn to be violently shaken. As described above, there is a risk that the hollow fibers will break at the adhesive interface due to use, leading to leakage.

The problem of reduced strength at the interface of the bonded portion is most severe in the outermost layer of the yarn bundle. This is because the thread has a high degree of freedom in this location. Therefore, the present inventors conducted extensive studies with the aim of reinforcing the outermost layer of the yarn bundle, and as a result, completed the present invention.

(Structure of the Invention) That is, the present invention fills a cylindrical case with a hollow fiber bundle, and adhesively seals between the ends of the hollow fiber bundle and the case end and between the ends of the hollow fibers. In a method for manufacturing a hollow fiber module, an annular body having an outer diameter smaller than the inner diameter of the case and 2 to 10 m taller than the final adhesive height is fitted into the end of the case, and the end of the hollow fiber bundle is Insert into the annular body 1
- a hollow fiber type module characterized in that after the hollow fiber bundle ends and the annular body, between the annular body and the case end, and between the hollow fiber bundle ends are adhesively sealed with an adhesive; This is a manufacturing method.

The point of the present invention is that the height of the annular body is made higher than the adhesive layer to protect the adhesive interface of the outermost hollow fibers.

Next, the present invention will be explained using FIG.

FIG. 2 is a diagram showing an embodiment of the present invention. Reference numeral 1 denotes a cylindrical case, which is usually made of acrylic resin, polysulfone resin, vinyl chloride resin, FRP, or the like.

2 is a reservoir of permeated water in the module, 3 is a hollow fiber made of polysulfone or polyethersulfone, 4 is an annular body of the present invention, and 5 is an epoxy adhesive.

The annular ring used in the present invention is suitably a molded plastic product or a cut pipe product, and the plastic material may be either thermosetting or thermoplastic. In particular, it is convenient if it is a molded product made of the same material as the adhesive used.

The difference in height between the adhesive interface and the annular body is preferably 2 to 10 ffil.

(Effects of the Invention) By protecting the outermost layer of the hollow fiber bundle with an annular body, the hollow fiber module according to the present invention almost eliminates troubles caused by bending of the hollow fibers, compared to conventional hollow fiber modules.

(Example) The effects of the present invention will be explained below using examples.

Example 1 An annular body made of epoxy adhesive with an inner diameter of 7511 mm, an outer diameter of 85 mm, and a height of 30 mm was inserted into the adhesive part of a polysulfone case with an inner diameter of 891 mm, an outer diameter of 97 mm, and a length of 3201111 mm. F) A bundle of 400 polyether sulfone hollow fibers with a diameter of 500 μm and an outer diameter of 700 μm was inserted through the annular body, set in a centrifugal sealing machine, and epoxy-based at a temperature of 55°C and a rotation speed of 1000 rpm. Centrifugal sealing was performed using adhesive so that the adhesive length on one side was 25 positive.

After completing this as a module, 120℃ steam and 2
Water at 5° C. was passed through the tube alternately 10 times. At this time, the hollow fibers were shaking quite violently, but even after inspection, there were no leaks caused by the adhesive interface.

[Brief explanation of the drawing]

1 is an explanatory view of the interface of the adhesive portion at the east end of the hollow fiber, and FIG. 2 is a view showing an embodiment of the present invention. 1... Cylindrical case, 2... Permeated water reservoir, 3
...Hollow fiber, 4...Annular body, 5...Adhesive ・Patent applicant Daicel Chemical Industries, Ltd. Agent Patent attorney
Cho-Kiryu Diagram 1 drawing (8: Ko: no changes) Diagram 2 procedure supplement, orthographic method), February 2, 1986

Claims (1)

[Claims] In a method for manufacturing a hollow fiber module, a cylindrical case is filled with a hollow fiber bundle, and the ends of the hollow fiber bundle and the case end and the ends of the hollow fibers are sealed with an adhesive. A ring-shaped body having an outer diameter smaller than the inner diameter of the case and 2 to 10 mm taller than the final adhesive height is fitted into the end of the case, and the hollow fiber bundle end is inserted into the ring-shaped body. A method for manufacturing a hollow fiber module, characterized in that the ends of the fiber bundle and the annular body, the annular body and the case end, and the ends of the hollow fiber bundle are sealed with an adhesive.