JPS63155651U - - Google Patents
Info
- Publication number
- JPS63155651U JPS63155651U JP4961787U JP4961787U JPS63155651U JP S63155651 U JPS63155651 U JP S63155651U JP 4961787 U JP4961787 U JP 4961787U JP 4961787 U JP4961787 U JP 4961787U JP S63155651 U JPS63155651 U JP S63155651U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- bent
- resin
- angle
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987049617U JPH0642348Y2 (ja) | 1987-03-31 | 1987-03-31 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987049617U JPH0642348Y2 (ja) | 1987-03-31 | 1987-03-31 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63155651U true JPS63155651U (US06265458-20010724-C00056.png) | 1988-10-12 |
JPH0642348Y2 JPH0642348Y2 (ja) | 1994-11-02 |
Family
ID=30872235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987049617U Expired - Lifetime JPH0642348Y2 (ja) | 1987-03-31 | 1987-03-31 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0642348Y2 (US06265458-20010724-C00056.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016039213A (ja) * | 2014-08-06 | 2016-03-22 | ローム株式会社 | 基板内蔵パッケージ、半導体装置およびモジュール |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59188928A (ja) * | 1983-04-11 | 1984-10-26 | Toshiba Corp | 半導体装置の外装処理方法 |
JPS606241U (ja) * | 1983-06-27 | 1985-01-17 | 日本電気株式会社 | 混成集積回路装置 |
JPS60137443U (ja) * | 1984-02-23 | 1985-09-11 | 日本電気株式会社 | フラツトパツケ−ジ |
JPS60200553A (ja) * | 1984-03-26 | 1985-10-11 | Nec Corp | 半導体装置の製造方法 |
JPS61157337A (ja) * | 1984-12-29 | 1986-07-17 | New Japan Chem Co Ltd | 陰イオン性界面活性剤の製造方法 |
-
1987
- 1987-03-31 JP JP1987049617U patent/JPH0642348Y2/ja not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59188928A (ja) * | 1983-04-11 | 1984-10-26 | Toshiba Corp | 半導体装置の外装処理方法 |
JPS606241U (ja) * | 1983-06-27 | 1985-01-17 | 日本電気株式会社 | 混成集積回路装置 |
JPS60137443U (ja) * | 1984-02-23 | 1985-09-11 | 日本電気株式会社 | フラツトパツケ−ジ |
JPS60200553A (ja) * | 1984-03-26 | 1985-10-11 | Nec Corp | 半導体装置の製造方法 |
JPS61157337A (ja) * | 1984-12-29 | 1986-07-17 | New Japan Chem Co Ltd | 陰イオン性界面活性剤の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016039213A (ja) * | 2014-08-06 | 2016-03-22 | ローム株式会社 | 基板内蔵パッケージ、半導体装置およびモジュール |
Also Published As
Publication number | Publication date |
---|---|
JPH0642348Y2 (ja) | 1994-11-02 |