JPS63153869A - Transfer molding equipment for optical semiconductor device - Google Patents

Abstract

PURPOSE:To lessen extremely the short bubble residue and the short shot of the lens-shaped part in the resin package of an optical semiconductor device by a method wherein both of the top force and the bottom force of a metal mold are each provided with a runner and the top force only is provided with a subrunner and gates. CONSTITUTION:A top force U and a bottom force D are provided with a top force runner 11 and a bottom force runner 12, respectively; the top force U only is provided with a subrunner 13 and gates 14 and 14 and the gates 14 are slanted toward a lens-shaped part 8 being provided in the bottom force D. The bubbles on the upper sides of the runners are first guided into cavities 17a and 17b by the subrunner 13 provided on the top force U and, moreover, are escaped outside of the cavities through air vents. Then, a bubble-free resin on the lower sides of the runners is guided into the cavities 17a and 17b through the gates 14.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an apparatus for molding and packaging optical conductor devices with resin by transfer molding. The present invention relates to a resin molding device using transfer molding that causes fewer defects.

C. Prior Art] In the case of optical conductor devices such as light emitting diodes and light receiving diodes, transparent resin is used as the resin for the package.
And if there are bubbles, etc. in the optical path.

Since this affects its optical properties, devices have been developed that are less prone to bubbles and unfilled defects.

In a conventional resin molding apparatus using a transfer mold for an optical conductor device, as shown in FIG. 3, an upper mold runner 31 is provided only in the upper mold U of the mold, and a sub-runner 32 and gates 33 and 33 are pulled out from the runner 31. Alternatively, as shown in FIG. 4, a lower mold runner 41 is provided only on the lower mold of the mold, and from the runner 41 a sub-runner 42. There is a structure in which the gate 43.43 is pulled out.

In FIGS. 3 and 4, the external shapes of the upper mold U and the lower mold are omitted, and the runners 31, 41 . . . formed inside i are omitted.
Subrunner 32, 42. The gates 33 and 43 are shown, and the resin parts, including the package parts 34, 35, 44. The resin parts are shown with diagonal lines in opposite directions.

[Problem that the invention seeks to solve]

As mentioned above, in the case of optical conductor devices, transparent resin is used for resin molding, and if there are air bubbles inside the resin that serves as the optical path or unfilling on the resin surface, the optical properties will be affected. It is necessary to minimize the occurrence of air bubbles and unfilled defects. In addition, since optical conductor devices condense light due to their optical properties, it is often necessary to make a part of the resin surface of the package into a convex lens shape. This tends to occur and is one of the major causes of yield decline.

Therefore, the following methods are conventionally known as molding methods that do not cause unfilling of the lens portion during transfer molding.

For example, as shown in FIG. 3, a lens-shaped portion is provided on the lower mold of the mold, and a runner 31. A sub-runner 32 and a gate 33 are provided on the upper mold U, and the angle of the gate 33 is set at an angle toward a lens-shaped portion (not shown) provided on the lower mold so that the resin flows toward the lens portion. This makes it difficult to cause unfilled defects in the lens portion.

By the way, in transfer molding, when the plunger first forces the resin into the mold, so-called when the resin runs on the runner 31, first many air bubbles gather on the upper side of the runner 31, the lower part of the runner becomes a resin layer with few air bubbles, and then The bubbles are crushed or reduced in size by the injection pressure and remain as they are. Or it is forced out of the mold by an air vent.

As a method that utilizes this property to prevent bubbles from remaining in the semiconductor device after resin molding, there is a method of configuring runners, sub-runners, and gates as shown in FIG. 4. That is, a runner, a sub-runner, and a gate are provided in the lower mold. According to this method, during molding, the air bubbles on the upper side of the runner first enter the cavity 46a of the mold corresponding to the resin package part 44, 45 of the semiconductor device. , guided to 46b,
Furthermore, air vents create cavities 46a and 46b.
Then, the bubble-free resin is guided into the cavities 46a, 46b, and the resin is cured, thereby completing the resin molding of the semiconductor device with very few remaining bubbles.

In the method of providing a runner, a sub-runner, and a gate in the upper mold shown in FIG. 3, during molding, the resin with few air bubbles on the lower side of the runner is first guided into the cavity 36b, and then the air bubbles on the upper side of the runner are guided into the cavity 36a. will be guided to. Therefore, when the bubbles are guided into the cavity, the guided resin has already begun to harden, and since the air vent is blocked, the bubbles have no place to escape and ultimately remain in the resin package portion of the semiconductor device.

In short, in the case of optical conductor devices that have a lens shape on the resin surface, it is better to provide a runner, sub-runner, and gate on the upper mold to prevent unfilled defects in the lens part, but inside the resin package This is contradictory because the best way to avoid leaving bubbles in the mold is to provide a runner, sub-runner, and gate in the lower mold.

SUMMARY OF THE INVENTION An object of the present invention is to provide a transfer molding apparatus in which an optical conductor device having a lens shape has extremely few unfilled defects in the lens portion and defects in which air bubbles remain inside the resin package.

[Differences between the invention and the prior art]

In contrast to the conventional transfer molding equipment described above,
The present invention takes into consideration the arrangement of runners, sub-runners, and gates to prevent unfilling in the lens portion.

It has an original content that solves the problem of remaining bubbles.

[Means for solving problems]

The present invention provides a transfer molding apparatus for performing resin molding using a mold consisting of at least an upper mold and a lower mold.
This is a transfer molding apparatus for an optical conductor device, characterized in that runner parts are provided in both the upper mold and the lower mold, and the sub-runner part and the gate part are provided only in the upper mold.

[Effect]

According to the present invention, as shown in FIG. 1, air bubbles on the upper side of the runner are first guided into the cavities 17a and 17b by the sub-runner 13° gate 14 provided in the upper mold, and then guided to the outside of the cavities 17a and 17b by an air vent. is forced to escape. Next, the bubble-free resin of the runner is guided into the cavities 17a and 17b and cured to complete the molding process.A gate 14 is provided on the upper mold U, and a lens-shaped portion 18 is provided on the lower mold. Since the angle of the gate 14 can be set toward , it is extremely unlikely that the lens-shaped portion 18 will be unfilled.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 and FIG. 2 show an embodiment of the present invention,
In Figures 1 and 2, the external shapes of the upper and lower molds are omitted, and the runners, sub-runners, gates, and cavities formed inside are illustrated, and the resin parts are shown in the upper and lower molds. The diagram is shown with the diagonal lines in the opposite direction.

In FIG. 1, the present invention has an upper mold runner 11. Lower mold runners 12 are provided, and sub-runners 13 and gates 14 and 14 are provided only on the upper mold U, and the gate 14 is inclined toward the lens-shaped portion 18 provided on the lower mold.

In the embodiment, air bubbles on the upper side of the runner are first moved into cavities 17a,
The resin without air bubbles under the runner is guided into the cavities 17a and 17b through the gate 14, and then released to the outside of the cavity by an air vent.
Since the gate 14 is guided inward, no air bubbles remain in the end, and since the gate 14 is set at an angle toward the lens-shaped portion 18 provided on the upper mold U and the lower mold, the lens shape is Unfilled portion 18 is unlikely to occur.

〔Effect of the invention〕

As explained above, the present invention provides a resin molding apparatus for transfer molding an optical conductor device. This has the effect that it is possible to extremely reduce defects in which air bubbles remain in the resin package of the conductor device and defects in which the lens-shaped portion is not filled, and an improvement in yield can be expected.

[Brief explanation of the drawing]

FIG. 1 is a block diagram showing an embodiment of the present invention, FIG. 2 is a sectional view thereof, and FIGS. 3 and 4 are block diagrams showing a conventional transfer molding apparatus.

Claims (1)

[Claims] (1) In a transfer molding device that performs resin molding using a mold consisting of at least an upper mold and a lower mold, a runner part is provided in both the upper mold and the lower mold, and a sub-runner part and a gate part are provided. A transfer molding device for an optical conductor device, characterized in that it is provided only on the upper mold.