JPS6315145B2 - - Google Patents
Info
- Publication number
- JPS6315145B2 JPS6315145B2 JP58182739A JP18273983A JPS6315145B2 JP S6315145 B2 JPS6315145 B2 JP S6315145B2 JP 58182739 A JP58182739 A JP 58182739A JP 18273983 A JP18273983 A JP 18273983A JP S6315145 B2 JPS6315145 B2 JP S6315145B2
- Authority
- JP
- Japan
- Prior art keywords
- aln
- polytype
- functional
- thermal conductivity
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W40/259—
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
-
- H10W72/00—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
- Y10T428/24537—Parallel ribs and/or grooves
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
- Y10T428/24545—Containing metal or metal compound
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Ceramic Products (AREA)
- Die Bonding (AREA)
- Laminated Bodies (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58182739A JPS6073843A (ja) | 1983-09-30 | 1983-09-30 | 機能性セラミツクス |
| EP84306563A EP0141526B1 (en) | 1983-09-30 | 1984-09-26 | Ceramic with anisotropic heat conduction |
| DE8484306563T DE3463376D1 (en) | 1983-09-30 | 1984-09-26 | Ceramic with anisotropic heat conduction |
| US07/082,992 US4756976A (en) | 1983-09-30 | 1987-08-07 | Ceramic with anisotropic heat conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58182739A JPS6073843A (ja) | 1983-09-30 | 1983-09-30 | 機能性セラミツクス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6073843A JPS6073843A (ja) | 1985-04-26 |
| JPS6315145B2 true JPS6315145B2 (OSRAM) | 1988-04-04 |
Family
ID=16123587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58182739A Granted JPS6073843A (ja) | 1983-09-30 | 1983-09-30 | 機能性セラミツクス |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4756976A (OSRAM) |
| EP (1) | EP0141526B1 (OSRAM) |
| JP (1) | JPS6073843A (OSRAM) |
| DE (1) | DE3463376D1 (OSRAM) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0177194A3 (en) * | 1984-09-05 | 1988-04-20 | Kabushiki Kaisha Toshiba | Apparatus for production of compound semiconductor single crystal |
| US4906511A (en) * | 1987-02-12 | 1990-03-06 | Kabushiki Kaisha Toshiba | Aluminum nitride circuit board |
| US4950558A (en) * | 1987-10-01 | 1990-08-21 | Gte Laboratories Incorporated | Oxidation resistant high temperature thermal cycling resistant coatings on silicon-based substrates and process for the production thereof |
| US5035923A (en) * | 1987-10-01 | 1991-07-30 | Gte Laboratories Incorporated | Process for the deposition of high temperature stress and oxidation resistant coatings on silicon-based substrates |
| US5017434A (en) * | 1988-01-27 | 1991-05-21 | Enloe Jack H | Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite |
| US5258218A (en) * | 1988-09-13 | 1993-11-02 | Kabushiki Kaisha Toshiba | Aluminum nitride substrate and method for producing same |
| JP2774560B2 (ja) * | 1989-03-31 | 1998-07-09 | 株式会社東芝 | 窒化アルミニウムメタライズ基板 |
| JP2968539B2 (ja) * | 1989-06-30 | 1999-10-25 | 株式会社東芝 | 窒化アルミニウム構造物の製造方法 |
| GB2236020A (en) * | 1989-09-12 | 1991-03-20 | Plessey Co Plc | Electronic circuit package |
| US5135814A (en) * | 1990-10-31 | 1992-08-04 | Raytheon Company | Articles and method of strengthening aluminum oxynitride |
| US6207288B1 (en) * | 1991-02-05 | 2001-03-27 | Cts Corporation | Copper ink for aluminum nitride |
| GB2259408A (en) * | 1991-09-07 | 1993-03-10 | Motorola Israel Ltd | A heat dissipation device |
| US5217589A (en) * | 1991-10-03 | 1993-06-08 | Motorola, Inc. | Method of adherent metal coating for aluminum nitride surfaces |
| US5629067A (en) * | 1992-01-30 | 1997-05-13 | Ngk Insulators, Ltd. | Ceramic honeycomb structure with grooves and outer coating, process of producing the same, and coating material used in the honeycomb structure |
| JP3593707B2 (ja) * | 1993-03-19 | 2004-11-24 | 住友電気工業株式会社 | 窒化アルミニウムセラミックスとその製造方法 |
| US6696103B1 (en) | 1993-03-19 | 2004-02-24 | Sumitomo Electric Industries, Ltd. | Aluminium nitride ceramics and method for preparing the same |
| US7481267B2 (en) * | 2003-06-26 | 2009-01-27 | The Regents Of The University Of California | Anisotropic thermal and electrical applications of composites of ceramics and carbon nanotubes |
| US6976532B2 (en) * | 2003-06-26 | 2005-12-20 | The Regents Of The University Of California | Anisotropic thermal applications of composites of ceramics and carbon nanotubes |
| GB2435918B (en) * | 2006-03-10 | 2008-05-14 | Siemens Magnet Technology Ltd | Thermal diffusion barrier |
| DE102008031587A1 (de) * | 2008-07-03 | 2010-01-07 | Eos Gmbh Electro Optical Systems | Vorrichtung zum schichtweisen Herstellen eines dreidimensionalen Objekts |
| US10107560B2 (en) | 2010-01-14 | 2018-10-23 | University Of Virginia Patent Foundation | Multifunctional thermal management system and related method |
| US9187815B2 (en) * | 2010-03-12 | 2015-11-17 | United Technologies Corporation | Thermal stabilization of coating material vapor stream |
| FR3028050B1 (fr) * | 2014-10-29 | 2016-12-30 | Commissariat Energie Atomique | Substrat pre-structure pour la realisation de composants photoniques, circuit photonique et procede de fabrication associes |
| CN116835990B (zh) * | 2023-08-29 | 2023-11-24 | 合肥阿基米德电子科技有限公司 | 复合陶瓷基板、覆铜陶瓷基板及制备方法和应用 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3716759A (en) * | 1970-10-12 | 1973-02-13 | Gen Electric | Electronic device with thermally conductive dielectric barrier |
| JPS54153756A (en) * | 1978-05-25 | 1979-12-04 | Toshiba Tungaloy Co Ltd | Hard surfaceecoated products |
| JPS5913475B2 (ja) * | 1978-12-19 | 1984-03-29 | 日本特殊陶業株式会社 | セラミツク・スロ−アウエイチツプとその製造法 |
| US4336304A (en) * | 1979-05-21 | 1982-06-22 | The United States Of America As Represented By The United States Department Of Energy | Chemical vapor deposition of sialon |
| DE2940629A1 (de) * | 1979-10-06 | 1981-04-16 | Daimler-Benz Ag, 7000 Stuttgart | Verfahren zur erzeugung oxidationsbestaendiger siliciumnitrid-sinterkoerper mit verbesserter mechanischer festigkeit |
| US4256792A (en) * | 1980-01-25 | 1981-03-17 | Honeywell Inc. | Composite electronic substrate of alumina uniformly needled through with aluminum nitride |
| US4492765A (en) * | 1980-08-15 | 1985-01-08 | Gte Products Corporation | Si3 N4 ceramic articles having lower density outer layer, and method |
| JPS5811390A (ja) * | 1981-07-13 | 1983-01-22 | Teizaburo Miyata | 湯沸器内の通水吸熱方法とその装置 |
| FR2534246B1 (fr) * | 1982-10-11 | 1986-09-26 | Armines | Materiau ceramique a base d'alumine et son procede de fabrication |
| JPS59101889A (ja) * | 1982-12-03 | 1984-06-12 | 株式会社東芝 | 半導体装置 |
-
1983
- 1983-09-30 JP JP58182739A patent/JPS6073843A/ja active Granted
-
1984
- 1984-09-26 EP EP84306563A patent/EP0141526B1/en not_active Expired
- 1984-09-26 DE DE8484306563T patent/DE3463376D1/de not_active Expired
-
1987
- 1987-08-07 US US07/082,992 patent/US4756976A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US4756976A (en) | 1988-07-12 |
| DE3463376D1 (en) | 1987-06-04 |
| EP0141526A1 (en) | 1985-05-15 |
| EP0141526B1 (en) | 1987-04-29 |
| JPS6073843A (ja) | 1985-04-26 |
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