DE3463376D1 - Ceramic with anisotropic heat conduction - Google Patents

Ceramic with anisotropic heat conduction

Info

Publication number
DE3463376D1
DE3463376D1 DE8484306563T DE3463376T DE3463376D1 DE 3463376 D1 DE3463376 D1 DE 3463376D1 DE 8484306563 T DE8484306563 T DE 8484306563T DE 3463376 T DE3463376 T DE 3463376T DE 3463376 D1 DE3463376 D1 DE 3463376D1
Authority
DE
Germany
Prior art keywords
ceramic
heat conduction
anisotropic heat
anisotropic
conduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484306563T
Other languages
German (de)
English (en)
Inventor
Katsutoshi Komeya
Akihiko Tsuge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3463376D1 publication Critical patent/DE3463376D1/de
Expired legal-status Critical Current

Links

Classifications

    • H10W40/259—
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
    • H10W72/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y10T428/24537—Parallel ribs and/or grooves
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y10T428/24545—Containing metal or metal compound

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
  • Die Bonding (AREA)
  • Laminated Bodies (AREA)
DE8484306563T 1983-09-30 1984-09-26 Ceramic with anisotropic heat conduction Expired DE3463376D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58182739A JPS6073843A (ja) 1983-09-30 1983-09-30 機能性セラミツクス

Publications (1)

Publication Number Publication Date
DE3463376D1 true DE3463376D1 (en) 1987-06-04

Family

ID=16123587

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484306563T Expired DE3463376D1 (en) 1983-09-30 1984-09-26 Ceramic with anisotropic heat conduction

Country Status (4)

Country Link
US (1) US4756976A (OSRAM)
EP (1) EP0141526B1 (OSRAM)
JP (1) JPS6073843A (OSRAM)
DE (1) DE3463376D1 (OSRAM)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0177194A3 (en) * 1984-09-05 1988-04-20 Kabushiki Kaisha Toshiba Apparatus for production of compound semiconductor single crystal
US4906511A (en) * 1987-02-12 1990-03-06 Kabushiki Kaisha Toshiba Aluminum nitride circuit board
US4950558A (en) * 1987-10-01 1990-08-21 Gte Laboratories Incorporated Oxidation resistant high temperature thermal cycling resistant coatings on silicon-based substrates and process for the production thereof
US5035923A (en) * 1987-10-01 1991-07-30 Gte Laboratories Incorporated Process for the deposition of high temperature stress and oxidation resistant coatings on silicon-based substrates
US5017434A (en) * 1988-01-27 1991-05-21 Enloe Jack H Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite
US5258218A (en) * 1988-09-13 1993-11-02 Kabushiki Kaisha Toshiba Aluminum nitride substrate and method for producing same
JP2774560B2 (ja) * 1989-03-31 1998-07-09 株式会社東芝 窒化アルミニウムメタライズ基板
JP2968539B2 (ja) * 1989-06-30 1999-10-25 株式会社東芝 窒化アルミニウム構造物の製造方法
GB2236020A (en) * 1989-09-12 1991-03-20 Plessey Co Plc Electronic circuit package
US5135814A (en) * 1990-10-31 1992-08-04 Raytheon Company Articles and method of strengthening aluminum oxynitride
US6207288B1 (en) * 1991-02-05 2001-03-27 Cts Corporation Copper ink for aluminum nitride
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
US5217589A (en) * 1991-10-03 1993-06-08 Motorola, Inc. Method of adherent metal coating for aluminum nitride surfaces
US5629067A (en) * 1992-01-30 1997-05-13 Ngk Insulators, Ltd. Ceramic honeycomb structure with grooves and outer coating, process of producing the same, and coating material used in the honeycomb structure
JP3593707B2 (ja) * 1993-03-19 2004-11-24 住友電気工業株式会社 窒化アルミニウムセラミックスとその製造方法
US6696103B1 (en) 1993-03-19 2004-02-24 Sumitomo Electric Industries, Ltd. Aluminium nitride ceramics and method for preparing the same
US7481267B2 (en) * 2003-06-26 2009-01-27 The Regents Of The University Of California Anisotropic thermal and electrical applications of composites of ceramics and carbon nanotubes
US6976532B2 (en) * 2003-06-26 2005-12-20 The Regents Of The University Of California Anisotropic thermal applications of composites of ceramics and carbon nanotubes
GB2435918B (en) * 2006-03-10 2008-05-14 Siemens Magnet Technology Ltd Thermal diffusion barrier
DE102008031587A1 (de) * 2008-07-03 2010-01-07 Eos Gmbh Electro Optical Systems Vorrichtung zum schichtweisen Herstellen eines dreidimensionalen Objekts
US10107560B2 (en) 2010-01-14 2018-10-23 University Of Virginia Patent Foundation Multifunctional thermal management system and related method
US9187815B2 (en) * 2010-03-12 2015-11-17 United Technologies Corporation Thermal stabilization of coating material vapor stream
FR3028050B1 (fr) * 2014-10-29 2016-12-30 Commissariat Energie Atomique Substrat pre-structure pour la realisation de composants photoniques, circuit photonique et procede de fabrication associes
CN116835990B (zh) * 2023-08-29 2023-11-24 合肥阿基米德电子科技有限公司 复合陶瓷基板、覆铜陶瓷基板及制备方法和应用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3716759A (en) * 1970-10-12 1973-02-13 Gen Electric Electronic device with thermally conductive dielectric barrier
JPS54153756A (en) * 1978-05-25 1979-12-04 Toshiba Tungaloy Co Ltd Hard surfaceecoated products
JPS5913475B2 (ja) * 1978-12-19 1984-03-29 日本特殊陶業株式会社 セラミツク・スロ−アウエイチツプとその製造法
US4336304A (en) * 1979-05-21 1982-06-22 The United States Of America As Represented By The United States Department Of Energy Chemical vapor deposition of sialon
DE2940629A1 (de) * 1979-10-06 1981-04-16 Daimler-Benz Ag, 7000 Stuttgart Verfahren zur erzeugung oxidationsbestaendiger siliciumnitrid-sinterkoerper mit verbesserter mechanischer festigkeit
US4256792A (en) * 1980-01-25 1981-03-17 Honeywell Inc. Composite electronic substrate of alumina uniformly needled through with aluminum nitride
US4492765A (en) * 1980-08-15 1985-01-08 Gte Products Corporation Si3 N4 ceramic articles having lower density outer layer, and method
JPS5811390A (ja) * 1981-07-13 1983-01-22 Teizaburo Miyata 湯沸器内の通水吸熱方法とその装置
FR2534246B1 (fr) * 1982-10-11 1986-09-26 Armines Materiau ceramique a base d'alumine et son procede de fabrication
JPS59101889A (ja) * 1982-12-03 1984-06-12 株式会社東芝 半導体装置

Also Published As

Publication number Publication date
US4756976A (en) 1988-07-12
EP0141526A1 (en) 1985-05-15
EP0141526B1 (en) 1987-04-29
JPS6073843A (ja) 1985-04-26
JPS6315145B2 (OSRAM) 1988-04-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee