JPS6314517B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip-shaped electronic component mounting machine for mounting chip-shaped electronic components without lead wires onto a printed circuit board one by one.

The present applicant has previously proposed a chip-shaped electronic component mounting machine that uses a suction cup to suck a large number of chip-shaped electronic components and transfers and mounts them onto a printed circuit board.

However, if the structure uses a suction cup,
This is inconvenient when it is desired to attach a chip-shaped electronic component after inserting a leaded electronic component onto a printed circuit board.

In view of the above points, the present invention aims to provide a chip-shaped electronic component mounting machine that can reliably mount chip-shaped electronic components even on printed circuit boards on which other electronic components have already been mounted. It is. The present invention provides a supply unit that simultaneously supplies a plurality of types of chip-shaped electronic components from a plurality of chip-shaped electronic component discharging trucks of a parts feeder, and a supply unit that simultaneously supplies chip-shaped electronic components of a plurality of types from a plurality of chip-shaped electronic component discharging trucks of a parts feeder, and a chip-shaped electronic component discharging unit that simultaneously supplies chip-shaped electronic components of a plurality of types from a plurality of chip-shaped electronic component discharging trucks of a parts feeder. The pallet is capable of arranging electronic components and has a pallet that is intermittently transferred linearly in a fixed direction along the front end of each truck, and a plurality of suction pins that suction and hold chip-shaped electronic components at the arrangement interval P. A sequence head that transfers the chip-shaped electronic components from the truck onto the pallet, an XY table that receives the supply of substrates, and an index disk that rotates intermittently at predetermined angles to hold the chip-shaped electronic components by suction. The mounting head has a configuration in which mounting heads having suction pins are arranged radially at equal intervals, and a mounting mechanism for mounting the chip-shaped electronic component onto the board on the XY table by the mounting head, and a mounting mechanism for mounting the chip-shaped electronic component onto the board on the XY table by the mounting head. The present invention is characterized in that it includes a transfer head that has suction pins for holding and transfers chip-shaped electronic components on the pallet to the mounting head.

Embodiments of the chip-shaped electronic component mounting machine according to the present invention will be described below with reference to the drawings.

1 and 2 show the overall structure of a chip-shaped electronic component mounting machine. In these figures, base 1
An XY table (NC table) 2 is installed above, and a loader 4 supplies the substrate 3 to the right side of the XY table 2, and a loader 4 supplies the substrate 3 to the left side of the XY table 2.
Unloaders 5 are respectively arranged to take out the material. Further, a supply unit 6 having a parts feeder is provided at a position higher than the surface of the XY table 2, and the parts feeder is provided with a plurality of tracks 7 for discharging chip-shaped electronic components. A pallet transfer 9 is provided to intermittently move the pallet 8 along the front end of each track 7, and the chip-shaped electronic components taken out to the track 7 are transferred onto the pallet along the pallet transfer 9. A plurality of sequence heads 10 are provided for transferring the data. Further, a return conveyor 11 is disposed behind the supply unit 6 in parallel with the pallet transfer 9, and the pallets 8 that have reached the left end of the pallet transfer 9 are transferred to the return conveyor 11 by a pallet traversing mechanism 12A. The pallet 8, which is then returned to the left end by the return conveyor 11, is transferred onto a pallet transfer 9 by a pallet traversing mechanism 12B. Said
At the rear of the XY table 2, a frame 13 that stands upright on the base 1 is fixed, and on the front side of the frame 13 are a dispenser 14 for applying adhesive to the substrate 3 on the XY table 2, and a dispenser 14 for applying adhesive to the substrate 3 on the XY table 2. A mounting mechanism 16 having a mounting head 15 for mounting a chip-shaped electronic component at an adhesive application position, and a checker 1 for detecting the presence or absence of a mounting error in the chip-shaped electronic component.
7 are arranged. Furthermore, a transfer head 18 is provided above the frame 13 for transferring the chip-shaped electronic components on the pallet 8 to the mounting head 15.

As shown in FIG. 3, the tracks 7 of the supply unit 6 supply specific chip-shaped electronic components 20 predetermined by a chip-shaped electronic component mounting program, and each track 7 supplies, for example, a chip-shaped electronic component. It is equipped with a groove having a width approximately equal to the width of the components, and can sequentially send out chip-shaped electronic components in an aligned state. The pallet 8 has a length 10 times that of the intermittent feed pitch P of the pallet transfer 9, that is, 10P, and is dimensioned so that ten chip-shaped electronic components 20 can be arranged at intervals P. The chip-shaped electronic component placement surface of the pallet 8 is provided with means such as an adhesive surface, positioning pins, and positioning recesses for holding the chip-shaped electronic components in a constant posture. The sequence head 10 has a length equivalent to two pallets 8, and has 20 suction pins 21 arranged at intervals P. The pallet transfer 9 uses, for example, a ratchet mechanism to intermittently transfer the pallets 8.

As shown in FIGS. 4 and 5, the sequence head 10 is fixed to a horizontal rod 31 that is supported by a ball bushing 30 so as to be slidable in the horizontal direction, and the ball bush 30 is fixed to a vertical shaft 32. It is fixed to the frame 33. Furthermore, a cam lever 34 is connected to the sequence head 10 to drive it in the horizontal direction. As a result, the sequence head 10 can be moved up and down as the upper and lower frames 33 move up and down, and can be moved horizontally by the movement of the cam lever 34. Note that the suction pins 21 arranged equally at the intermittent feed pitch P (also the arrangement interval of chip-shaped electronic components) of the pallet transfer 9 are hollow pipe-shaped like air tweezers, etc., and the inside is vacuumed. By doing so, the chip-shaped electronic component 20 is held by suction.

Such a sequence head 10 suctions the chip-shaped electronic component 20 on the track 7 of the supply unit 6 with the suction pin 21, rises, moves horizontally onto the pallet 8, and then descends to pick up the chip-shaped electronic component 20.
The chip-shaped electronic component 20 is placed on the pallet 8 by stopping suction and releasing it. Note that the suction pin 21 corresponds to the truck 7 that supplies chip-shaped electronic components of types that are not required to be transferred to the pallet side.
Leave it in a non-adsorbed state. By repeating this operation at regular intervals, editing is performed so that various types of chip-shaped electronic components are arranged in the order in which they are mounted on the board.

The pallet 8 is intermittently transferred to the left at intervals P by the pallet transfer 9.
When the chips reach the front of the transfer head 18, the chip-shaped electronic components 20 on the pallet 8 are sequentially transferred to the mounting head 15 of the mounting mechanism 16 by the transfer head 18.

As shown in FIG. 6, the mounting mechanism 16 has eight mounting heads 15 arranged at 45-degree intervals on an index disc 40, and as shown in FIGS. The index disk 40 is fixed to a rotary drive shaft 41 and rotates 45 degrees at a time. In the mounting head 15, bearings 43A and 43B are fixed to a mounting member 42 fixed to the index disc 40.
A mounting head shaft 45 having a suction pin 44 at its tip is slidably supported in the radial direction of the index disk 40 by A and 43B. A gear 46 is fitted on the outer periphery of the mounting head shaft 45, and a keyway 47 allows the two to rotate together and does not interfere with the axial sliding movement of the mounting head shaft 45. Further, a spring mounting block 48 is fitted onto the mounting head shaft 45 so as to move together in the axial direction, and an extension spring 50 is inserted between this block 48 and a spring stopper 49 protruding from the index disc 40.
is provided. As a result, the suction pin 44 is urged in the retracting direction. In addition, the suction pin 44
has a hollow pipe shape, and holds chip-shaped electronic components by suction by vacuuming the inside.

As the index disk 40 rotates, the mounting head 15 moves to points A, B, C, D, etc. in FIG.
The chip-shaped electronic component 20 is sequentially moved to points E, F, G, and H, but the chip-shaped electronic component 20 is received from the transfer head 18 when the mounting head 15 faces upward, that is, at point A, as shown in FIG. It's time. In FIG. 7, the transfer head 18 has one suction pin 60.
The suction pin 60 has a hollow pipe shape similar to the sequence head 10, and suctions and holds the chip-shaped electronic component 20 by vacuuming the inside. This transfer head 18 first descends from a position above the pallet 8, picks up the chip-shaped electronic component 20 on the pallet, and then rises.
The chip-like electronic component 20 is moved horizontally onto the mounting head 15 and then lowered to the suction pin 4 of the mounting head 15.
4 Transfer to the top. After the transfer is complete, the transfer head 18 releases the chip-shaped electronic components and rises to return to its position above the pallet. The transferred chip-shaped electronic component is sucked and held by the suction pin 44 of the mounting head 15.

As shown in FIG. 8, when the mounting head 15 is positioned sideways, that is, at point C, the mounting direction of the chip-shaped electronic component 20 is switched. That is, a mounting plate 70 is fixed to the frame 13 so as to cross the front of the index disk 40, and a motor mounting plate 71 is mounted vertically to the mounting plate 70 so as to be slidable in the lateral direction. A pulse motor 72 is fixed to this motor mounting plate 71, and a gear 74 that meshes with a gear 73 of the pulse motor 72 is pivotally mounted. When the index disc 40 rotates, the motor mounting plate 71 moves in the direction of arrow J so as not to interfere with the rotation, and disengages the gear 74 from the gear 46 of the mounting head 15. When the disk 40 is stopped, the gear 74 and the gear 46 are brought into mesh with each other as shown in FIG. 8 to set the mounting direction of the chip-shaped electronic component 20. In this case, one operation of the pulse motor 72 rotates the mounting head shaft 45 of the mounting head 15 by 15 degrees.

When the mounting head 15 faces downward, that is, when it is located at point E in FIG. 6, the cam follower 80, which is vertically movably provided on the mounting plate 70 shown in FIG. , thereby placing the chip-shaped electronic component 20 on the board 3.
.

By the way, after the board 3 is supplied to the right position R of the XY table 2 by the loader 4 as shown in FIG. 1, it is preliminarily coated with adhesive 90 by a dispenser 14 as shown in FIG. It's getting old. In FIG. 9, the dispenser 14 is pivotally connected to the frame 13 by parallel links 91A and 91B so as to be movable up and down, and is driven by a lever 92 interlocking with the links 91A. In this case, the dispenser 14 sequentially applies the adhesive 90 to the programmed mounting positions on the board 3 as shown in FIG. 10 while repeating vertical movements.

Next, the overall operation of the above embodiment will be explained. First, when starting the chip-shaped electronic component mounting machine, the XY table 2 is at the origin position, and in this state, the loader 4 moves the XY table 2 to the right position R.
The substrate 3 is supplied.

Adhesive is applied by a dispenser 14 to a preprogrammed position on the board 3 for mounting a chip-shaped electronic component. After the coating is completed, the XY table 2 returns to its original position. During this time, sequence head 1
0, the transfer head 18 and the mounting head 15 are running idle.

After the application of the adhesive to the substrate 3 is completed, editing of the chip-shaped electronic component is performed while the XY table 2 is stopped at the origin position. That is, the chip-shaped electronic components 20 are placed on the pallet 8 by the sequence head 10 in the order of installation according to preprogrammed signals.

Then, the pallet 8 is intermittently sent to the left side by the pallet transfer 9, and the chip-shaped electronic components 20 on the pallet 8 are sequentially transferred to the mounting head 15 by the transfer head 18. Then, when the mounting head 15 holding the first chip-shaped electronic component reaches the mounting position (point E in FIG. 6), the operation is temporarily stopped.

During this temporary stop period, the substrate 3, which was at the right position R on the XY table 2, is sent to the center position CT,
A new substrate is supplied from the loader 4 to the right position R.

After that, the center position CT is set by the mounting head 15.
Attachment of the chip-shaped electronic component 20 to the board 3 located at the position R and application of adhesive to the board at the right position R are started. In this case, the mounting head 15 at point E in FIG.
The mounting head shaft 45 is pushed down by the cam follower 80, which causes the suction pin 44 to descend and press the chip-shaped electronic component 20 held onto the adhesive application position on the board 3, thereby performing the mounting operation. Execute. Incidentally, since the vacuum suction by the suction pin 44 is stopped when the mounting head shaft 45 is pushed down, mounting is performed reliably.

After the above operation is completed, the XY table 2 returns to its original position, and the board 3 at the center position CT moves to the left position L.
The substrate at the right position R is sent to the center position CT, and the new substrate is sent to the right position R, respectively.

Then, at the right position R, an adhesive application operation is performed, at the center position CT, a chip-shaped electronic component mounting operation is performed, and at the left position L, a mounting error detection operation is performed by the checker 17. Boards with no mounting errors are taken out from the XY table 2 by the unloader 5.

According to the above embodiment, since the chip-shaped electronic component 20 is mounted on the board 3 using the mounting head 15 having the suction pin 44, it is possible to mount the chip-shaped electronic component 20 onto the board 3. Chip-shaped electronic components can also be installed later in the empty space. Furthermore, the sequence head 10 can be used to arrange various kinds of chip-shaped electronic components 20 on the pallet 8 in the order of mounting, and as a result, mounting of many kinds of chip-shaped electronic components can be realized.

In addition, in the mounting mechanism 16, the mounting head 15
The gear 46 is locked in a fixed direction by a locking mechanism except when changing the mounting direction of the chip-shaped electronic component.

As described above, according to the present invention, there is obtained a chip-shaped electronic component mounting machine that can reliably mount chip-shaped electronic components even on a printed circuit board with a small empty space.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing the overall configuration of an embodiment of the chip-shaped electronic component mounting machine according to the present invention, and FIG.
The figure is a front view of the same, and Figure 3 is a plan view showing the positional relationship of the supply unit, pallet, and sequence head.
4 is a partially sectional plan view showing the sequence head portion, FIG. 5 is a sectional view of the same side, FIG. 6 is a front view showing the mounting mechanism portion including the mounting head, and FIG. 7 is the mounting mechanism, Fig. 8 is a plan sectional view showing the mechanism for setting the mounting direction of the mounting head, Fig. 9 is a side sectional view showing the dispenser portion, and Fig. 10 is the board. FIG. 3 is a plan view showing a state in which an adhesive is applied to the substrate. 1... Base, 2... XY table, 3... Board, 4... Loader, 5... Unloader, 6...
...Supply unit, 7...Track for discharging chip-shaped electronic components, 8...Pallet, 9...Pallet transfer, 10...Sequence head, 11...
Return conveyor, 12A, 12B...Pallet lateral feeding mechanism, 13...Frame, 14...Dispenser, 15...Mounting head, 16...Mounting mechanism, 17...Checker, 18...Transferring head, 20... Chip-shaped electronic components, 21, 44, 6
0... Suction pin, 40... Index disc, 4
1...Rotation drive shaft, 45...Mounting head shaft, 72
...Pulse motor, 80...Cam follower, 90
……glue.

Claims (1)

[Scope of Claims] 1. A supply unit that simultaneously supplies a plurality of types of chip-shaped electronic components from a plurality of chip-shaped electronic component discharge trucks of a parts feeder, and an interval equal to the interval between chip-shaped electronic components between adjacent trucks ( The chip-shaped electronic components can be arranged at the arrangement interval (P), and the pallets are intermittently transferred linearly in a fixed direction along the front end of each track, and the suction pins that suck and hold the chip-shaped electronic components are arranged at the arrangement interval (P). ), which has a plurality of sequence heads that transfer chip-shaped electronic components from the track onto the pallet; an XY table that receives the supply of substrates; and an index disk that rotates intermittently at predetermined angles. It has a structure in which mounting heads each having suction pins for suctioning and holding a chip-shaped electronic component are arranged radially at equal intervals, and the mounting head allows the above-mentioned
A transfer head that has a mounting mechanism for mounting a chip-shaped electronic component onto a board on an XY table, and a suction pin for sucking and holding the chip-shaped electronic component, and that transfers the chip-shaped electronic component on the pallet to the mounting head. A chip-shaped electronic component mounting machine characterized by comprising: