CN113423261B - Automatic chip mounter and chip mounting process - Google Patents

Automatic chip mounter and chip mounting process Download PDF

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Publication number
CN113423261B
CN113423261B CN202110707891.4A CN202110707891A CN113423261B CN 113423261 B CN113423261 B CN 113423261B CN 202110707891 A CN202110707891 A CN 202110707891A CN 113423261 B CN113423261 B CN 113423261B
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storage pipe
rotating frame
storage
circuit board
driving
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CN202110707891.4A
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CN113423261A (en
Inventor
游泉生
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Shenzhen Haoshengda Industrial Co ltd
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Shenzhen Haoshengda Industrial Co ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0417Feeding with belts or tapes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting
    • H05K13/0465Surface mounting by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The application relates to an automatic chip mounter and a chip mounting process, which comprise a rack and a conveying belt, wherein the rack is provided with a mounting plate positioned right above the conveying belt and a first driving assembly used for driving the mounting plate to move up and down; the lower port of the storage pipe is provided with a rotating frame, the rotating frame is rotationally arranged in the vertical circumferential surface, and the storage pipe is also provided with a second driving assembly for driving the rotating frame to rotate; the rotating frame is provided with two suction nozzles symmetrically arranged along the rotating axis of the rotating frame, and the suction nozzles are used for sucking and releasing elements in the material storage pipe. This application takes out the intraductal component of storage through the suction nozzle, then moves down through a drive assembly's disposable drive for each component voltage-sharing pastes on the circuit board, once only accomplishes the paster of all components promptly, has greatly improved machining efficiency.

Description

Automatic chip mounter and chip mounting process
Technical Field
The application relates to the field of chip component production, in particular to an automatic chip mounter and a chip mounting process.
Background
SMT is Surface mount Technology (abbreviation for Surface Mounted Technology) which is one of the most popular techniques and processes in the electronic assembly industry. The surface mount technology is a Circuit mounting technology in which a surface mount device (SMC/SMD, a chip component in chinese) having no pins or short leads is mounted on the surface of a Printed Circuit Board (PCB) or other substrate by a chip mounter, and then soldered and mounted by a method such as reflow soldering or dip soldering.
The automatic chip mounter is equipment for realizing full-automatic component mounting at high speed and high precision, is the most critical and complex equipment in the whole SMT production, and is the main equipment in the SMT production line.
In the prior art, the automatic chip mounter has the following chip mounting processes: the suction nozzle mechanism firstly sucks the components on the material tray, then the suction nozzle mechanism moves to a proper position on the surface of the circuit board, the components are pressed to the surface of the circuit board, then the suction nozzle mechanism moves to the material tray to suck the components again, and the operation is repeated until all the components are attached.
In view of the above-mentioned related art, the inventor believes that the patch efficiency is low because the pressing element needs to be sucked many times.
Disclosure of Invention
In order to improve the chip mounting efficiency, the application provides an automatic chip mounter and a chip mounting process.
The application provides an automatic chip mounter adopts following technical scheme:
an automatic chip mounter comprises a rack and a conveying belt, wherein the rack is provided with a mounting plate positioned right above the conveying belt and a first driving assembly used for driving the mounting plate to move up and down, the lower surface of the mounting plate is provided with a plurality of vertically arranged storage pipes, the arrangement positions of the storage pipes correspond to positions to be subjected to chip mounting on a circuit board on the conveying belt, and elements are sequentially stacked in the storage pipes in the vertical direction; the lower port of the storage pipe is provided with a rotating frame, the rotating frame is rotatably arranged in the vertical circumferential surface, and the storage pipe is also provided with a second driving assembly for driving the rotating frame to rotate; the rotating rack is provided with two suction nozzles symmetrically arranged along the rotating axis of the rotating rack, and the suction nozzles are used for sucking and placing elements in the material storage pipe.
By adopting the technical scheme, the components in the material storage pipe are taken out through the suction nozzle, and then are driven to move downwards through the first driving component in one step, so that all the components are pasted on the circuit board in a pressure-equalizing manner, namely, the pasting of all the components is completed in one step, the processing efficiency is greatly improved, and the gravity of the components is used for moving downwards to supplement the components at the position to be adsorbed for the suction nozzle again so as to facilitate repeated adsorption; and, can realize the preliminary transportation of component through setting up the rotating turret for the component is in and treats the paster state, has further improved paster efficiency.
Optionally, a limiting ring is arranged on the circumferential direction of the rotating frame, and an avoidance groove for avoiding the limiting ring is arranged at the lower port of the storage pipe; the outer peripheral wall of the limiting ring is provided with a groove for accommodating a single element.
By adopting the technical scheme, the suction nozzle can conveniently adsorb a single element, and the single element is smoothly taken out of the storage pipe along with the rotation of the rotating frame; and due to the limit of the limit ring, other elements cannot fall from the lower port of the storage pipe due to gravity.
Optionally, the second driving assembly comprises a servo motor fixed on the mounting plate, an output shaft of the servo motor is fixed with a first belt wheel, a rotating axis of the rotating frame is fixed with a second belt wheel, and the first belt wheel and the second belt wheel are connected through a transmission belt.
Through adopting above-mentioned technical scheme, through servo motor's drive, utilize the band pulley transmission to drive the rotating turret and rotate, thereby realize the dislocation of two suction nozzles.
Optionally, the second driving assembly comprises a driving cylinder and a traction rope, a plurality of groups of guide rods corresponding to the storage pipes one by one are vertically fixed on the lower surface of the mounting plate, the storage pipes are provided with guide holes for the guide rods to be connected in a sliding manner, and the driving cylinder drives the storage pipes to move in a sliding manner along the length direction of the guide rods; the rotating shaft center of the rotating frame is provided with a sleeve, one end of the traction rope is fixed with the guide rod, the other end of the traction rope is wound and fixed with the sleeve, and the sleeve is further provided with a reset elastic piece for driving the sleeve to rotate and reset.
By adopting the technical scheme, during processing, the driving cylinder drives each material storage pipe to downwards slide for a short distance relative to the guide rod, during the period, the sleeve downwards moves relative to the traction rope, the traction rope is tightened to drive the sleeve to rotate 180 degrees, the reset elastic part accumulates elastic potential energy, and thus the rotating frame is driven to rotate 180 degrees, and the displacement of the two suction nozzles is realized; when the driving cylinder drives the material storage pipes to slide upwards for resetting, the sleeve moves upwards relative to the traction rope, the traction rope is loosened, the sleeve has a rotational degree of freedom, and the resetting elastic piece releases elastic potential energy to drive the sleeve to reset and rotate, so that the rotational resetting of the two suction nozzles is realized.
Optionally, the outer wall of the storage pipe is provided with two through grooves which extend along the length direction of the storage pipe and are symmetrically arranged, the through grooves are communicated with the inner cavity of the storage pipe, the outer wall of the storage pipe is provided with at least two first elastic sheets which are symmetrically arranged along the axis of the storage pipe, one side of each first elastic sheet is fixedly connected with the outer wall of the storage pipe, a deviation rectifying sheet which extends into the inner cavity of the storage pipe through the through grooves is formed on the free side of each first elastic sheet in a bending mode, and the deviation rectifying sheet is used for abutting against the side wall of an element; the surface of the first elastic sheet is convexly provided with a first convex block, the upper end and the lower end of the first convex block are respectively provided with a first guide surface, the outer wall of the guide rod is fixedly provided with a second convex block, the second convex block is positioned on the moving path of the first convex block, and the upper end and the lower end of the second convex block are respectively provided with a second guide surface.
By adopting the technical scheme, when the driving cylinder drives each material storage pipe to slide downwards for a small distance relative to the guide rod, the first lug on the first elastic sheet slides downwards relative to the guide rod, during the period, the first guide surface of the first lug is abutted with the second guide surface of the second lug until the first lug is abutted with the surface of the second lug, so that the first elastic sheet elastically avoids displacement outwards along the direction away from the guide rod, the deviation correcting sheet is not abutted with the side wall of the element, and when the first lug on the first elastic sheet slides downwards relative to the guide rod again, the first lug loses the abutment of the second lug, the first elastic sheet elastically resets to drive the deviation correcting sheet to move close to the element through the through groove, so that the deviation correcting sheet is abutted with the side wall of the element; the correcting sheet can be driven to move back and forth in the direction close to or far away from the component by utilizing the downward movement of the storage pipe, so that when the correcting sheet is not abutted to the component, a certain degree of freedom is provided for the component, the component can easily fall down for material supplement only under the action of gravity, and when the correcting sheet is abutted to the component, the stacking regularity of the component is improved, and the precision of the adsorption position of the suction nozzle is improved.
Optionally, the free side of the deviation rectifying sheet is provided with a rubber strip.
By adopting the technical scheme, the impact force of the element from the deviation rectifying sheet is reduced.
Optionally, the inner cavity of the storage tube is divided into an upper part and a lower part, wherein the upper part is a main accommodating area, the lower part is a temporary storage area, the temporary storage area is used for accommodating only the lowest elements except the elements in the groove, and the size in the temporary storage area is equal to that of the elements; the main accommodating area is used for accommodating other elements, the size of the main accommodating area is larger than that of the elements, and the through groove is only communicated with the main accommodating area.
By adopting the technical scheme, the friction between the element and the inner wall of the material storage pipe is reduced by arranging the main containing area with larger size, so that the element can fall conveniently; the temporary storage area with matched size is arranged, so that the components in the area can be conveniently positioned, and the suction nozzle can be conveniently and accurately sucked.
Optionally, the rack is provided with two groups of lifting cylinders which are symmetrically arranged by taking the conveying belt as a central axis, the output ends of the lifting cylinders are fixed with horizontal support bars, and the horizontal support bars are used for abutting against the lower surface of one side of the circuit board on the conveying belt; be equipped with first horizontal cylinder on the horizontal support bar, the output of first horizontal cylinder is equipped with the corner block that is used for butt joint circuit board right angle department, and the plane central point of circuit board is crossed to the extension line of the movement track of two first horizontal cylinders.
By adopting the technical scheme, the circuit board can be positioned, so that the precision of multiple elements in simultaneous chip mounting is improved.
Optionally, the horizontal support bar is equipped with movable strip, the upper surface of activity strip with the horizontal support bar parallel and level, the one end of activity strip with the horizontal support bar is articulated to be connected, just the horizontal support bar is equipped with second horizontal cylinder, second horizontal cylinder is used for driving the swing of activity strip.
Through adopting above-mentioned technical scheme, through setting up the activity strip, activity strip and horizontal support bar can support the bottom of circuit board simultaneously to the circuit board deformation that causes when reducing many components paster simultaneously is crooked, and then has ensured the paster precision.
The application further provides a surface mounting process, which adopts the following technical scheme:
a process of die bonding comprising the steps of: arranging the positions of the storage tubes on the mounting plate according to preset positions of elements on a circuit board to be processed; one suction nozzle adsorbs the lowest component in the material storage pipe, then the rotating frame rotates through the second driving assembly, the suction nozzle adsorbing the component rotates to the lower part, and the other suction nozzle rotates to the upper part to wait for component adsorption again; when the circuit board is conveyed to the position right below the mounting plate, the first driving assembly drives the mounting plate to move downwards, so that the lowermost suction nozzles of all the storage pipes move downwards, and elements on the lowermost suction nozzles are adhered to the corresponding positions of the circuit board in a pressure-equalizing manner; then the first driving component drives the mounting plate to move upwards, and the operation is repeated to carry out surface mounting on the next circuit board.
In summary, the present application includes at least one of the following beneficial technical effects:
the components in the material storage pipe are taken out through the suction nozzle, and then are driven to move downwards at one time through the first driving assembly, so that all the components are pasted on the circuit board in a pressure-sharing manner, namely, the pasting of all the components is finished at one time, and the processing efficiency is greatly improved;
the linear driving of the driving cylinder is utilized to convert the driving force into the driving force for driving the rotating frame to rotate and the driving force for driving the material storage pipe to move downwards, so that the two suction nozzles are rotated and reset, and meanwhile, the vertical distance between the material storage pipe and the circuit board is shortened, so that the displacement distance of the first driving assembly is reduced in a phase-changing manner, and the processing efficiency is further improved;
the straight line driving of the driving cylinder can drive the deviation rectifying sheet to move back and forth in the direction close to or far away from the component, when the deviation rectifying sheet is not abutted to the component, the component is given a certain degree of freedom, so that the component can easily fall for material supplement only under the action of gravity, and when the deviation rectifying sheet is abutted to the component, the stacking regularity of the component is improved, and the precision of the adsorption position of the suction nozzle is improved.
Drawings
Fig. 1 is a schematic view of the entire structure of embodiment 1.
Fig. 2 is a schematic view of the positioning apparatus of embodiment 1.
Fig. 3 is a schematic view of another perspective of the positioning device of embodiment 1.
Fig. 4 is a schematic view of the patch device of example 1.
Fig. 5 is a schematic structural view of the turret according to embodiment 1.
Fig. 6 is a schematic diagram of embodiment 1 for showing the matching relationship between the rotating frame and the lower end of the storage pipe.
Fig. 7 is a partially enlarged view of a portion a in fig. 4.
Fig. 8 is a schematic structural view of the patch device of example 2.
Fig. 9 is a schematic structural view of the stock pipe of embodiment 2.
Fig. 10 is a schematic structural view of the turret according to embodiment 2.
Fig. 11 is a schematic diagram of embodiment 2 for showing the matching relationship between the rotating frame and the lower end of the magazine.
Fig. 12 is a partial enlarged view at B in fig. 9.
Fig. 13 is a schematic diagram for showing a positional relationship between the first bump and the second bump in embodiment 2.
Description of reference numerals: 1. a horizontal support bar; 2. mounting a plate; 3. a storage pipe; 4. a rotating frame; 5. a second drive assembly; 10. a frame; 101. a conveyor belt; 102. a circuit board; 103. an element; 11. a lifting cylinder; 12. a second horizontal cylinder; 121. a round block; 13. a movable bar; 131. a chute; 14. a first horizontal cylinder; 15. a corner block; 20. a positioning device; 21. a first drive assembly; 22. a driving cylinder; 23. a support; 24. a guide bar; 241. a second bump; 242. a second guide surface; 25. a guide hole; 30. a patch device; 31. rotating the rod; 311. a strut; 32. an avoidance groove; 33. a first elongated slot; 34. a primary accommodation area; 35. a temporary storage area; 36. a through groove; 37. a second elongated slot; 41. a sleeve; 42. a branch pipe; 43. a limiting ring; 431. a groove; 44. a suction nozzle; 45. an air tube; 51. a servo motor; 511. a first pulley; 512. a second pulley; 513. a transmission belt; 52. a hauling rope; 521. a connecting ring; 53. a restoring elastic member; 54. a first spring plate; 541. a first bump; 542. a first guide surface; 55. a deviation rectifying sheet; 56. a rubber strip.
Detailed Description
The present application is described in further detail below with reference to figures 1-13.
The embodiment 1 of the application discloses an automatic chip mounter. Referring to fig. 1, the automatic die bonder includes a frame 10, a conveyor 101, a positioning device 20, and a die bonding device 30.
During processing, the conveyer belt 101 conveys the circuit board 102 to a position to be processed, the positioning device 20 positions and reinforces the circuit board 102, and the chip mounting device 30 presses down the multiple elements 103 onto the circuit board 102 simultaneously to complete chip mounting operation.
As shown in fig. 2, the positioning device 20 includes two sets of lifting cylinders 11 symmetrically disposed about the conveyor belt 101, wherein horizontal support bars 1 are simultaneously fixed to output ends of the sets of lifting cylinders 11, the horizontal support bars 1 are parallel to the length direction of the conveyor belt 101, and the horizontal support bars 1 are used for supporting the circuit board 102 upward.
As shown in fig. 2, the horizontal support bar 1 is further provided with a movable bar 13, the upper surface of the movable bar 13 is flush with the upper surface of the horizontal support bar 1, one end of the movable bar 13 is hinged with one end of the horizontal support bar 1, and the lower surface of the movable bar 13 is provided with a chute 131 arranged along the length direction of the movable bar 13; the lower surface of horizontal support bar 1 still is fixed with second horizontal cylinder 12, the output of second horizontal cylinder 12 is fixed with circle piece 121, circle piece 121 slides with spout 131 and is connected, feed through second horizontal cylinder 12 can drive movable strip 13 swing certain angle promptly, make movable strip 13 support circuit board 102's bottom surface, movable strip 13 and horizontal support bar 1 can support circuit board 102's bottom simultaneously, thereby reduce circuit board 102 deformation bending that causes when many components 103 paster simultaneously, and then ensured the paster precision.
As shown in fig. 3, the horizontal support bar 1 is further fixed with a first horizontal cylinder 14, the feeding directions of the two first horizontal cylinders 14 are arranged along the diagonal direction of the circuit board 102, the output end of the first horizontal cylinder 14 is fixed with a corner block 15, and the inner right-angle surface of the corner block 15 is used for matching with the right-angle edge of the circuit board 102, that is, the corner blocks 15 on both sides simultaneously move close to each other by the feeding of the first horizontal cylinder 14, so that the position of the circuit board 102 is corrected simultaneously, and the positioning accuracy is improved.
As shown in fig. 4, the patch device 30 includes a mounting plate 2, a first driving assembly 21, a stock tube 3, a rotating frame 4, and a second driving assembly 5; wherein 2 levels of mounting panel set up, and mounting panel 2 is located conveyer belt 101 directly over, and first drive assembly 21 can be for straight line drive structures such as cylinder, electric jar, and first drive assembly 21 is used for driving mounting panel 2 and reciprocates.
As shown in fig. 4, the storage tubes 3 have upper and lower ports, the upper ends of the storage tubes 3 are vertically and fixedly connected to the lower surface of the mounting plate 2, the arrangement positions of the storage tubes 3 correspond to positions to be mounted on the circuit board 102, and the inner cavities of the storage tubes 3 are used for stacking the storage elements 103.
As shown in fig. 5 and 6, the rotating frame 4 includes a sleeve 41 and two branch pipes 42 arranged along the radial direction of the sleeve 41, the sleeve 41 is located right below the storage pipe 3, the storage pipe 3 is fixed with a horizontally arranged rotating rod 31, and the sleeve 41 is rotatably sleeved on the rotating rod 31; the branch pipes 42 are communicated and fixed with the inner cavity of the sleeve 41, the tail ends of the two branch pipes 42 are jointly fixed with a limiting ring 43, the limiting ring 43 and the sleeve 41 are coaxially arranged, and the lower port of the storage pipe 3 is provided with an avoiding groove 32 for avoiding the limiting ring 43; a groove 431 is formed in the outer wall of the limiting ring 43, a suction nozzle 44 is fixed at the tail end of the branch pipe 42, and a suction head of the suction nozzle 44 is positioned at the bottom of the groove 431; an air pipe 45 is further arranged in the sleeve 41, the air pipe 45 is communicated with an external air path, and the air pipe 45 is used for sucking air into the sleeve 41, so that the suction nozzle 44 has suction force.
As shown in fig. 7, the second driving assembly 5 includes a servo motor 51 disposed corresponding to the storage tube 3, the servo motor 51 is fixed on the upper surface of the mounting plate 2, a first pulley 511 is fixed on an output shaft of the servo motor 51, a second pulley 512 is fixed on the sleeve 41, and the first pulley 511 and the second pulley 512 are connected by a transmission belt 513.
The embodiment 1 of the application further discloses a chip mounting process of the automatic chip mounter, which comprises the following steps: the arrangement of the positions of the storage tubes 3 on the mounting plate 2 is carried out according to preset point positions of the elements 103 on the circuit board 102 to be processed, the arrangement of the positions of the elements 103 on the circuit board 102 corresponds to the arrangement of the positions of the storage tubes 3, and the arrangement of the positions of the storage tubes 3 is determined without replacement, so that the circuit board 102 can be continuously produced in large batch.
Depending on the type of component 103 in different positions, the component 103 is filled into the upper port of the magazine pipe 3 in the corresponding position, whereupon the lowermost component 103 in the magazine pipe 3 falls by gravity into a recess 431 in the stop collar 43, which recess 431 is intended to receive only a single component 103.
The suction nozzle 44 corresponding to the recess 431 is made to suck the lowest component 103 in the storage tube 3, and then the servo motor 51 is started to drive the rotating rack 4 to rotate by using the transmission of the belt wheel, so that the suction nozzle 44 originally located above is made to rotate to the lower side, and the other suction nozzle 44 is made to rotate to the upper side to suck a new component 103.
The conveying belt 101 conveys the circuit board 102 to a position right below the mounting plate 2, the lifting cylinder 11 drives the horizontal supporting bar 1 to move upwards to support the circuit board 102, and the second horizontal cylinder 12 is started to drive the movable bar 13 to swing by a certain angle, so that the movable bar 13 supports the bottom surface of the circuit board 102, namely the movable bar 13 and the horizontal supporting bar 1 can support the bottom of the circuit board 102 at the same time; the first horizontal cylinder 14 is then actuated so that the corner blocks 15 on both sides simultaneously move closer together, thereby simultaneously locating the position of the circuit board 102.
The first driving assembly 21 drives the mounting plate 2 to move downwards, so that the lowermost suction nozzles 44 of all the storage pipes 3 move downwards, and the components 103 on the lowermost suction nozzles 44 are adhered to the corresponding positions of the circuit board 102 in a pressure-equalizing manner; then the first driving assembly 21 drives the mounting plate 2 to move upwards, and the above operations are repeated to perform the next circuit board 102.
The implementation principle of the embodiment 1 is as follows: through setting up the storage pipe 3 of arranging in advance to and the rotating turret 4 transports the component 103 in the storage pipe 3, make the component 103 of treating the paster realize the position of paster in advance arrange, then once only make the component 103 in each storage pipe 3 move down, make each component 103 all quick and accurate press paste on circuit board 102, once only accomplish the paster of all components 103 promptly, greatly improved machining efficiency.
Embodiment 2, as shown in fig. 8 and 9, is different from embodiment 1 in that a plurality of sets of guide rods 24 corresponding to the storage pipes 3 one by one are fixed on the lower surface of the mounting plate 2, the guide rods 24 are vertically arranged downward, the guide rods 24 include four guide rods 24, the storage pipes 3 are separately arranged from the mounting portion, the storage pipes 3 are provided with guide holes 25, and the storage pipes 3 are vertically slidably arranged by matching the guide rods 24 with the guide holes 25.
As shown in fig. 8, the second driving assembly 5 includes a driving cylinder 22, a pulling rope 52 and a return elastic member 53, the cylinder body of the driving cylinder 22 is fixed to the upper surface of the mounting plate 2, the output end of the driving cylinder 22 vertically passes through the mounting plate 2, and the output end of the driving cylinder 22 is fixedly connected to each storage tube 3 through a bracket 23, that is, each storage tube 3 can be driven to ascend and descend for a certain distance through the driving cylinder 22.
As shown in fig. 9 and 10, a section of first long groove 33 is formed in the outer wall of the storage pipe 3 along the length direction, a connecting ring 521 located in the first long groove 33 is fixed to one of the guide rods 24, the upper end of the pulling rope 52 is bound and fixed with the connecting ring 521, and the lower end of the pulling rope 52 is wound and fixed with the sleeve 41; the elastic restoring member 53 can be a spring plate, a torsion spring or a spiral spring, the support rod 311 is fixed at the position of the rotating rod 31 located at the axle center of the sleeve 41, one end of the elastic restoring member 53 is fixedly connected with the support rod 311, and the other end of the elastic restoring member 53 is fixedly connected with the inner wall of the sleeve 41.
When the driving cylinder 22 drives each storage tube 3 to slide downwards for a short distance relative to the guide rod 24, during the period, the sleeve 41 moves downwards relative to the traction rope 52, the traction rope 52 is tightened to drive the sleeve 41 to rotate 180 degrees, the reset elastic piece 53 accumulates elastic potential energy, and thus the rotating frame 4 is driven to rotate 180 degrees, so that the displacement of the two suction nozzles 44 is realized; when the driving cylinder 22 drives each material storage tube 3 to slide upwards for resetting, the sleeve 41 moves upwards relative to the traction rope 52, the traction rope 52 is loosened, the sleeve 41 has a rotational degree of freedom, and the resetting elastic piece 53 releases elastic potential energy to drive the sleeve 41 to reset and rotate, so that the rotational resetting of the two suction nozzles 44 is realized, that is, the driving cylinder 22 can simultaneously drive the rotating frames 4 on each material storage tube 3 to rotate through the transmission structure.
As shown in fig. 11, the inner cavity of the storage tube 3 is divided into an upper part and a lower part, wherein the upper part is a main accommodating area 34, and the lower part is a temporary storage area 35; the size of the temporary storage area 35 is equal to the size of the component 103, the temporary storage area 35 is used for accommodating only the lowest component 103 except the component 103 in the recess 431, that is, the component 103 in the storage tube 3 needs to enter the temporary storage area 35 for temporary storage, and when no component 103 exists in the recess 431, the component 103 in the temporary storage area 35 can enter the recess 431 and be adsorbed by the suction nozzle 44; the main receiving area 34 is used for receiving the remaining components 103, and since the size of the main receiving area 34 is larger than that of the components 103, the friction between the components 103 and the inner wall of the main receiving area 34 is small, the flexibility of the components 103 is high, and the components 103 are more prone to fall into the temporary storage area 35 due to gravity.
As shown in fig. 12, through grooves 36 are formed in two opposite outer walls of the storage pipe 3, the through grooves 36 are formed along the length direction of the storage pipe 3, and the through grooves 36 are only communicated with the main accommodating area 34. The outer wall of the storage pipe 3 is provided with four first elastic sheets 54, wherein every two first elastic sheets 54 are respectively located on the outer wall with the through groove 36, the first elastic sheets 54 are arranged with equal length to the through groove 36, one side of each first elastic sheet 54 is fixedly connected with the outer wall of the storage pipe 3, the other side of each first elastic sheet 54 is bent and formed to be provided with a deviation rectifying sheet 55, the deviation rectifying sheet 55 extends into the main accommodating area 34 through the through groove 36, and a rubber strip 56 is fixed on the free side of the deviation rectifying sheet 55.
As shown in fig. 13, a second long groove 37 is formed through the outer wall of the storage tube 3, the second long groove 37 is arranged along the length direction of the storage tube 3, a first protruding block 541 located in the second long groove 37 is fixed on the surface of the first elastic sheet 54, first guide surfaces 542 are respectively arranged at the upper end and the lower end of the first protruding block 541, a second protruding block 241 located in the second long groove 37 is fixed on the outer wall of the guide rod 24, the second protruding block 241 is located on the moving path of the first protruding block 541, and second guide surfaces 242 are respectively arranged at the upper end and the lower end of the second protruding block 241.
When the driving cylinder 22 drives each storage tube 3 to slide downwards for a short distance relative to the guide rod 24, the first protruding block 541 on the first elastic sheet 54 slides downwards relative to the guide rod 24, during which, the first guiding surface 542 of the first protruding block 541 abuts against the second guiding surface 242 of the second protruding block 241, so that the first elastic sheet 54 moves outwards and elastically, away from the guide rod 24, i.e. the deviation rectifying sheet 55 does not abut against the side wall of the element 103, and when the first protruding block 541 on the first elastic sheet 54 slides downwards relative to the guide rod 24 again, the first protruding block 541 loses the abutment of the second protruding block, the first elastic sheet 54 elastically resets to drive the deviation rectifying sheet 55 to move close to the element 103 through the through groove 36, so that the deviation rectifying sheet 55 abuts against the side wall of the element 103.
That is, the deviation rectifying sheet 55 is moved back and forth in a direction approaching or separating from the component 103 by the downward movement of the material storage tube 3, so that when the deviation rectifying sheet 55 is not abutted to the component 103, a certain degree of freedom is provided to the component 103, so that the component 103 can easily fall down for material supplement only by gravity, and when the deviation rectifying sheet 55 is abutted to the component 103, the stacking regularity of the component 103 is improved, so as to improve the precision of the suction position of the suction nozzle 44.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (10)

1. The utility model provides an automatic chip mounter, includes frame (10) and conveyer belt (101), its characterized in that: the automatic mounting device is characterized in that the rack (10) is provided with a mounting plate (2) positioned right above the conveyer belt (101) and a first driving assembly (21) used for driving the mounting plate (2) to move up and down, the lower surface of the mounting plate (2) is provided with a plurality of vertically arranged storage pipes (3), the arrangement positions of the storage pipes (3) correspond to positions of to-be-mounted chips on a circuit board (102) on the conveyer belt (101), and elements (103) are sequentially stacked in the storage pipes (3) along the vertical direction; a rotating frame (4) is arranged at the lower port of the storage pipe (3), the rotating frame (4) is rotatably arranged in a vertical circumferential surface, and a second driving assembly (5) for driving the rotating frame (4) to rotate is further arranged on the storage pipe (3); the rotating frame (4) is provided with two suction nozzles (44) which are symmetrically arranged along the rotating axis of the rotating frame (4), and the suction nozzles (44) are used for sucking and discharging elements (103) in the material storage pipe (3).
2. The robotic placement machine of claim 1, wherein: a limiting ring (43) is arranged on the circumferential direction of the rotating frame (4), and an avoiding groove (32) for avoiding the limiting ring (43) is formed in the lower port of the storage pipe (3); the outer peripheral wall of the limiting ring (43) is provided with a groove (431) for accommodating the single element (103).
3. The automatic placement machine according to claim 1, wherein: the second driving assembly (5) comprises a servo motor (51) fixed on the mounting plate (2), an output shaft of the servo motor (51) is fixed with a first belt wheel (511), a second belt wheel (512) is fixed at the rotating shaft center of the rotating frame (4), and the first belt wheel (511) is connected with the second belt wheel (512) through a transmission belt (513).
4. The automatic placement machine according to claim 1, wherein: the second driving assembly (5) comprises a driving cylinder (22) and a traction rope (52), a plurality of groups of guide rods (24) which correspond to the storage pipes (3) one by one are vertically fixed on the lower surface of the mounting plate (2), the storage pipes (3) are provided with guide holes (25) for the guide rods (24) to be connected in a sliding mode, and the driving cylinder (22) drives the storage pipes (3) to move in a sliding mode along the length direction of the guide rods (24); the rotating shaft center of the rotating frame (4) is provided with a sleeve (41), one end of the traction rope (52) is fixed to the guide rod (24), the other end of the traction rope (52) is wound and fixed to the sleeve (41), and the sleeve (41) is further provided with a reset elastic piece (53) used for driving the sleeve (41) to rotate and reset.
5. The automatic placement machine according to claim 4, wherein: the outer wall of the storage pipe (3) is provided with two through grooves (36) which extend along the length direction of the storage pipe and are symmetrically arranged, the through grooves (36) are communicated with the inner cavity of the storage pipe (3), the outer wall of the storage pipe (3) is provided with at least two first elastic sheets (54) which are symmetrically arranged along the axis of the storage pipe, one side of each first elastic sheet (54) is fixedly connected with the outer wall of the storage pipe (3), the free side of each first elastic sheet (54) is bent and formed with a deviation rectifying sheet (55) which extends into the inner cavity of the storage pipe (3) through the corresponding through groove (36), and the deviation rectifying sheet (55) is used for abutting against the side wall of an element (103); the surface of the first elastic sheet (54) is convexly provided with a first convex block (541), the upper end and the lower end of the first convex block (541) are respectively provided with a first guide surface (542), the outer wall of the guide rod (24) is fixedly provided with a second convex block (241), the second convex block (241) is positioned on the moving path of the first convex block (541), and the upper end and the lower end of the second convex block (241) are respectively provided with a second guide surface (242).
6. The automatic placement machine according to claim 5, wherein: and a rubber strip (56) is arranged on the free side of the deviation rectifying sheet (55).
7. The robotic placement machine of claim 5, wherein: the inner cavity of the material storage pipe (3) is divided into an upper part and a lower part, wherein the upper part is a main accommodating area (34), the lower part is a temporary storage area (35), the temporary storage area (35) is used for accommodating only the lowest element (103) except the element (103) in the groove (431), and the size in the temporary storage area (35) is equal to that of the element (103); the main accommodating area (34) is used for accommodating the rest of the elements (103), the size of the main accommodating area (34) is larger than that of the elements (103), and the through groove (36) is only communicated with the main accommodating area (34).
8. The automatic placement machine according to claim 1, wherein: the automatic conveying device is characterized in that the rack (10) is provided with two groups of lifting cylinders (11) which are symmetrically arranged by taking the conveying belt (101) as a central axis, the output ends of the lifting cylinders (11) are fixed with horizontal supporting strips (1), and the horizontal supporting strips (1) are used for abutting against the lower surface of one side of a circuit board (102) on the conveying belt (101); be equipped with first horizontal cylinder (14) on horizontal support bar (1), the output of first horizontal cylinder (14) is equipped with corner block (15) that are used for butt circuit board (102) right angle department, and the plane central point of circuit board (102) is crossed to the extension line of the motion trail of two first horizontal cylinders (14).
9. The robotic placement machine of claim 8, wherein: horizontal support bar (1) is equipped with activity strip (13), the upper surface of activity strip (13) with horizontal support bar (1) parallel and level, the one end of activity strip (13) with horizontal support bar (1) is articulated to be connected, just horizontal support bar (1) is equipped with second horizontal cylinder (12), second horizontal cylinder (12) are used for driving activity strip (13) swing.
10. A die bonding process using the automatic die bonder of claim 1, wherein: arranging the positions of the storage pipes (3) on the mounting plate (2) according to preset point positions of elements (103) on a circuit board (102) to be processed; one suction nozzle (44) sucks the lowest component (103) in the storage pipe (3), then the second driving assembly (5) enables the rotating frame (4) to rotate, the suction nozzle (44) sucking the component (103) rotates to the lower side, and the other suction nozzle (44) rotates to the upper side to wait for the component (103) to be sucked again; when the circuit board (102) is conveyed to the position right below the mounting plate (2), the first driving assembly (21) drives the mounting plate (2) to move downwards, so that the lowermost suction nozzles (44) of all the storage pipes (3) move downwards, and the elements (103) on the lowermost suction nozzles (44) are adhered to the corresponding positions of the circuit board (102) in a pressure-equalizing manner; then the first driving component (21) drives the mounting plate (2) to move upwards, and the operations are repeated to carry out surface mounting on the next circuit board (102).
CN202110707891.4A 2021-06-24 2021-06-24 Automatic chip mounter and chip mounting process Active CN113423261B (en)

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Application Number Priority Date Filing Date Title
CN202110707891.4A CN113423261B (en) 2021-06-24 2021-06-24 Automatic chip mounter and chip mounting process

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Application Number Priority Date Filing Date Title
CN202110707891.4A CN113423261B (en) 2021-06-24 2021-06-24 Automatic chip mounter and chip mounting process

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CN113423261B true CN113423261B (en) 2022-08-12

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000091789A (en) * 1998-09-16 2000-03-31 Taiyo Yuden Co Ltd Electronic parts feeder
US6195876B1 (en) * 1998-03-05 2001-03-06 Taiyo Yuden Co., Ltd. Electronic component placing apparatus
CN1736134A (en) * 2003-01-15 2006-02-15 松下电器产业株式会社 Electronic parts mounting apparatus and electronic parts mounting method
CN210959329U (en) * 2019-12-12 2020-07-07 惠州市联创丽声电子有限公司 Chip mounting device of chip mounter

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6195876B1 (en) * 1998-03-05 2001-03-06 Taiyo Yuden Co., Ltd. Electronic component placing apparatus
JP2000091789A (en) * 1998-09-16 2000-03-31 Taiyo Yuden Co Ltd Electronic parts feeder
CN1736134A (en) * 2003-01-15 2006-02-15 松下电器产业株式会社 Electronic parts mounting apparatus and electronic parts mounting method
CN210959329U (en) * 2019-12-12 2020-07-07 惠州市联创丽声电子有限公司 Chip mounting device of chip mounter

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