JPS6314355Y2 - - Google Patents
Info
- Publication number
- JPS6314355Y2 JPS6314355Y2 JP14307683U JP14307683U JPS6314355Y2 JP S6314355 Y2 JPS6314355 Y2 JP S6314355Y2 JP 14307683 U JP14307683 U JP 14307683U JP 14307683 U JP14307683 U JP 14307683U JP S6314355 Y2 JPS6314355 Y2 JP S6314355Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- temperature sensor
- opening
- packing
- cylindrical portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 45
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 238000012856 packing Methods 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 235000014676 Phragmites communis Nutrition 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000005389 magnetism Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14307683U JPS6050455U (ja) | 1983-09-13 | 1983-09-13 | 温度センサのリ−ド線固定機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14307683U JPS6050455U (ja) | 1983-09-13 | 1983-09-13 | 温度センサのリ−ド線固定機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6050455U JPS6050455U (ja) | 1985-04-09 |
| JPS6314355Y2 true JPS6314355Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-04-22 |
Family
ID=30319481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14307683U Granted JPS6050455U (ja) | 1983-09-13 | 1983-09-13 | 温度センサのリ−ド線固定機構 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6050455U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1983
- 1983-09-13 JP JP14307683U patent/JPS6050455U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6050455U (ja) | 1985-04-09 |