JPS63136640A - Ball formation device for wire bonding - Google Patents

Ball formation device for wire bonding

Info

Publication number
JPS63136640A
JPS63136640A JP61281897A JP28189786A JPS63136640A JP S63136640 A JPS63136640 A JP S63136640A JP 61281897 A JP61281897 A JP 61281897A JP 28189786 A JP28189786 A JP 28189786A JP S63136640 A JPS63136640 A JP S63136640A
Authority
JP
Japan
Prior art keywords
discharge
wire
ball diameter
ball
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61281897A
Other languages
Japanese (ja)
Other versions
JPH0317377B2 (en
Inventor
Hiroshi Miura
三浦 浩史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Mechatronics Co Ltd
Original Assignee
Toshiba Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Seiki Co Ltd filed Critical Toshiba Seiki Co Ltd
Priority to JP61281897A priority Critical patent/JPS63136640A/en
Publication of JPS63136640A publication Critical patent/JPS63136640A/en
Publication of JPH0317377B2 publication Critical patent/JPH0317377B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009Pre-treatment of the connector or the bonding area
    • H01L2224/8503Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512Aligning
    • H01L2224/85148Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518Translational movements
    • H01L2224/85181Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve the discriminating accuracy of a ball diameter by providing ball diameter discriminating means for comparing the integrated value of an integrator with a good level when the set discharge command time of discharge condition setting means is elapsed to discriminate whether the ball diameter arrives at a predetermined value or not. CONSTITUTION:A discharge generator 12 contains a constantcurrent power source circuit to generate a discharge between the end 21A of a wire 21 and an electrode 22 on the basis of a discharge command to form a ball at the wire end 21A. A ball diameter discriminator 17 compares the integrated value of an integrator 15 with a good level L set in advance at a normal discharge state setter 16 when a discharge command time T set at a discharge condition setter 11 is elapsed to discriminate whether the ball diameter arrives at a predetermined value or not and to output a good signal G or a discrimination regulate to a bonding unit. When a discharge current detected by a discharge current detector 13 is binarized and integrated, the increasing rate of the integrated value becomes constant. This characteristic is utilized to judge whether the ball diameter arrives at a predetermined value or not.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、半導体製造装置におけるワイヤボンディング
用のボール形成装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a ball forming device for wire bonding in semiconductor manufacturing equipment.

[従来の技術] 第5図はワイヤボンディング?L置を示す模式図であり
、ワイヤlは、クランパー2およびポンディングツール
3を通して、ヒーター4の上に載置されたベレット5お
よびリードフレーム6にポンディングされる。続いて、
クランパー2によってワイヤ1をもち上げると、リード
フレーム6にポンディングした部分でワイヤlが切断さ
れ、その先端部は破線で示す位置に戻される。また、ワ
イヤ先端部IAの側方には、電源を内蔵する放電発生装
置7とともに電気トーチを形成する電極8が配置され、
ワイヤ先端部IAと電極8との間に高電圧を印加するこ
とによって放電を発生させ、ワイヤ先端部IAにボール
IBを形成する。このボールIBはベレット5に対する
ポンディングを好適ならしめるものであるが、その前提
としてベレット5のポンディングパッド面積の変更、ワ
イヤ1の直径の変更等に応じて適正なボール径が要求さ
れる。
[Prior art] Is Fig. 5 wire bonding? FIG. 2 is a schematic diagram illustrating an L position, in which a wire L is bonded to a pellet 5 and a lead frame 6 placed on a heater 4 through a clamper 2 and a bonding tool 3. continue,
When the wire 1 is lifted up by the clamper 2, the wire 1 is cut at the portion where it is bonded to the lead frame 6, and its tip is returned to the position shown by the broken line. Further, on the side of the wire tip IA, an electrode 8 that forms an electric torch together with a discharge generator 7 containing a built-in power source is arranged.
By applying a high voltage between the wire tip IA and the electrode 8, a discharge is generated and a ball IB is formed at the wire tip IA. This ball IB is suitable for pounding the pellet 5, but as a premise, an appropriate ball diameter is required in accordance with changes in the area of the pounding pad of the pellet 5, changes in the diameter of the wire 1, etc.

そこで従来、ワイヤlと電極8の間に定電圧を印加した
り、定電流回路を付加して放電時の電流を一定制御する
等の放電発生方法の採用により、ボール径の適正化を図
っている。
Therefore, in the past, the ball diameter was optimized by adopting discharge generation methods such as applying a constant voltage between the wire l and the electrode 8, or adding a constant current circuit to control the current at the time of discharge. There is.

上記のように、ボール径の適正化を図るべく、放電発生
方法に改良が加えられたとしても、ポンディングに際し
ては適正なボールが形成されたことの確認、すなわちボ
ール径の良否判定を行なうとともに、適正ボール径のボ
ールをより確実に形成することが必要である。
As mentioned above, even if improvements are made to the discharge generation method in order to optimize the ball diameter, it is necessary to confirm that a proper ball has been formed when bonding, that is, to judge whether the ball diameter is good or bad. , it is necessary to more reliably form a ball with an appropriate ball diameter.

従来のボール径の良否判定方法は、放電中のある一瞬の
タイミングで電流が流れているか否か。
The conventional method for determining whether the ball diameter is good or bad is to check whether current is flowing at a certain instant during discharge.

あるいは放電ギャップ間にかかる電圧が異常でないかを
検出することにより、放電状態をモニターし、この放電
状態が異常であれば、ボール径も異常であるものと判定
している。しかし、この方法は放電状態の検出タイミン
グが放電中のある一瞬に限られるため、そのタイミング
以外での放電状態は無視されることとなり、判定精度が
悪い。
Alternatively, the discharge state is monitored by detecting whether the voltage applied across the discharge gap is abnormal, and if the discharge state is abnormal, it is determined that the ball diameter is also abnormal. However, in this method, the detection timing of the discharge state is limited to a certain instant during the discharge, and therefore the discharge state at other times is ignored, resulting in poor determination accuracy.

そこで従来、特開昭80−206145号公報に記載さ
れるように、放電状態の検出タイミングを無数に設定し
1判定績度の向上を図る方法も提案されている。
Therefore, as described in Japanese Patent Application Laid-Open No. 80-206145, a method has been proposed in which an infinite number of discharge state detection timings are set to improve the 1-judgment performance.

[発明が解決しようとする問題点] しかしながら、放電状態の検出タイミングを無数に設定
し、各タイミングの放電状7gを検出する場合には、無
数の検出タイミング信号を発生させる必要があり、複雑
な制御回路を必要とすることとなって、装置構成が極め
て複雑化する。
[Problems to be Solved by the Invention] However, when setting an infinite number of detection timings for the discharge state and detecting the discharge state 7g at each timing, it is necessary to generate an infinite number of detection timing signals, resulting in a complicated process. This requires a control circuit, making the device configuration extremely complicated.

本発明は、簡素な装置構成により、ボール径の判定精度
を向上可能とすることを目的とする。
An object of the present invention is to improve the accuracy of ball diameter determination with a simple device configuration.

[問題点を解決するための手段] 本発明の第1は、ワイヤの先端部と電極との間に放電を
発生さ゛せて、ワイヤの先端部にボールを形成するワイ
ヤボンディング用のボール形成装置において、ワイヤに
与えるべき放電電流と放電指令時間を設定する放電条件
設定手段と、放電条件設定手段が設定した上記設定放電
電流を上記設定放電指令時間だけワイヤに流す放電発生
手段と、放電時にワイヤを含む放電回路中に流れる放電
電流の有無を検出し、その検出結果を2値化信号として
出力する電流有無検出手段と、電流有無検出手段の出力
値を積分する積分器と、一定のボール径が形成されるべ
き状態下における上記積分器の積分値をグツドレベルと
して予め定める正常放電状態設定手段と、放電条件設定
手段の設定放電指今時間を経過した時点で積分器の積分
値を該グー2ドレベルと比較し、ボール径が一定値に達
したか否かを判定するボール径判定手段とを有してなる
ことを特徴とするものである。
[Means for Solving the Problems] A first aspect of the present invention is a ball forming device for wire bonding that generates a discharge between the tip of the wire and an electrode to form a ball at the tip of the wire. , a discharge condition setting means for setting a discharge current to be given to the wire and a discharge command time; a discharge generating means for causing the set discharge current set by the discharge condition setting means to flow through the wire for the set discharge command time; A current presence/absence detection means for detecting the presence or absence of a discharge current flowing in a discharge circuit and outputting the detection result as a binary signal, an integrator for integrating an output value of the current presence/absence detection means, and a ball having a constant diameter. A normal discharge state setting means which predetermines the integral value of the integrator under the condition to be formed as a good level, and a discharge finger of the discharge condition setting means sets the integral value of the integrator to the good level at the time when the current time has elapsed. The invention is characterized by comprising a ball diameter determining means for determining whether or not the ball diameter has reached a certain value.

本発明の第2は、ワイヤの先端部と電極との間に放電を
発生させて、ワイヤの先端部にボールを形成するワイヤ
ボンディング用のボール形成装置において、ワイヤに与
えるべき放電電流と放電指令時間を設定する放電条件設
定手段と、放電条件設定手段が設定した上記設定放電電
流を上記設定放電指令時間だけはワイヤに流し得る放電
発生手段と、放電時にワイヤを含む放電回路中に流れる
放電電流の有無を検出し、その検出結果を2値化信号と
して出力する電流有無検出手段と、電波有無検出手段の
出力値を積分する積分器と、一定のボール径が形成され
るべき状態下における上記積分器の積分値をグツドレベ
ルとして予め定める正常放電状態設定手段と、積分器の
積分値をグツドレベルと比較し、ボール径が一定値に達
したか否かを判定するボール径判定手段とを有し、ボー
ル径が一定値に達したことをボール径判定手段が判定し
たことを条件に、放電発生手段による放電を終了するこ
とを特徴としたものである。
The second aspect of the present invention is a ball forming device for wire bonding that generates a discharge between the tip of the wire and the electrode to form a ball at the tip of the wire, and the discharge current and discharge command to be given to the wire. discharge condition setting means for setting a time; discharge generating means for allowing the set discharge current set by the discharge condition setting means to flow through the wire for the set discharge command time; and discharge current flowing in a discharge circuit including the wire during discharge. a current detection means for detecting the presence or absence of a radio wave and outputting the detection result as a binary signal; an integrator for integrating the output value of the radio wave presence detection means; It has a normal discharge state setting means that predetermines the integral value of the integrator as a good level, and a ball diameter determining means that compares the integral value of the integrator with the good level and determines whether the ball diameter has reached a certain value. The present invention is characterized in that the discharge by the discharge generating means is terminated on condition that the ball diameter determining means determines that the ball diameter has reached a certain value.

〔作用] ボール径は放電時にワイヤに与えられる電荷量、すなわ
ち放電′:を流と放電時間の積によって決定される。そ
こで、本発明の第1によれば、一定のボール径を形成す
るためにワイヤに与えるべき電荷量が、放電電流と放電
指令時間として放電条件設定手段に設定されると、放電
発生手段が上記放電電流を設定放電指令時間だけワイヤ
に流す。
[Operation] The ball diameter is determined by the amount of charge given to the wire during discharge, ie, the product of the discharge time and the discharge time. Therefore, according to the first aspect of the present invention, when the amount of charge to be given to the wire in order to form a constant ball diameter is set in the discharge condition setting means as the discharge current and the discharge command time, the discharge generating means A discharge current is passed through the wire for the set discharge command time.

さらに、電流有無検出手段がワイヤを含む放電回路中に
流れる放電電流の有無を検出し、放電電流が流れている
間、論理レベル”1″′の信号を出力し、積分器は上記
”1”を積分する。これにより、ワイヤに形成されるボ
ール径の変更に対応して、放電電流を変化させて該ワイ
ヤに与えるべき電荷量を変化させた時にも、積分器が累
積する積分値の増加率は一定となる。したがって、設定
放電指令時間を経過した時点で積分器の積分値を正常放
電状態設定手段に予め設定したグツドレベルと比較する
ことにより、ボール径が当初定めた径に達しているか否
かを判定できる。これにより、複雑な制御回路を必要と
することなく簡素な装置構成により、また、各種のボー
ル径に応じたボール径判定基準、すなわちグツドレベル
の細かな調整を必要とすることなく、各種サイズのボー
ル径を高精度かつ容易に判定できる。
Furthermore, the current presence detection means detects the presence or absence of a discharge current flowing in the discharge circuit including the wire, and outputs a signal of logic level "1" while the discharge current is flowing, and the integrator outputs a signal of logic level "1". Integrate. As a result, even when the amount of charge to be applied to the wire is changed by changing the discharge current in response to a change in the diameter of the ball formed on the wire, the rate of increase in the integral value accumulated by the integrator remains constant. Become. Therefore, by comparing the integrated value of the integrator with the good level preset in the normal discharge state setting means at the time when the set discharge command time has elapsed, it can be determined whether the ball diameter has reached the initially determined diameter. This allows for a simple device configuration without the need for a complex control circuit, as well as the ability to produce balls of various sizes without the need for detailed adjustment of the ball diameter judgment criteria, that is, the ball diameter, according to the various ball diameters. The diameter can be determined easily and with high accuracy.

さらに本発明の第2によれば、上述した本発明の第1に
おけると比べ、ボール径が一定値に達したことをボール
径判定手段が判定したことを条件に、放電発生手段によ
る放電を終了するようにしたので、適正なボールが形成
された後すぐにボンディング作業が開始でき、全体とし
てのボンディングスピードを短縮することも可能となる
Furthermore, according to the second aspect of the present invention, compared to the first aspect of the present invention described above, the discharge by the discharge generating means is terminated on the condition that the ball diameter determining means determines that the ball diameter has reached a certain value. As a result, the bonding work can be started immediately after a proper ball is formed, and it is also possible to shorten the overall bonding speed.

[実施例] 第1図は本発明の第1実施例に係るボール形成装置を示
すブロック図、第2図はボール形成装置に用いられる制
御波形を示す波形図、第3図(A)、(B)は電荷量相
当値の積分状態を説明する模式図である。
[Embodiment] Fig. 1 is a block diagram showing a ball forming device according to a first embodiment of the present invention, Fig. 2 is a waveform diagram showing control waveforms used in the ball forming device, and Fig. 3 (A), ( B) is a schematic diagram illustrating the integration state of the charge amount equivalent value.

ボール形成装置10は、放電条件設定部(放電条件設定
手段)11、放電発生装置(放電発生手段)12、放電
電流検出部13.電流有無検出部(電流有無検出手段)
14、積分器15、正常放電状態設定部(正常放電状態
設定手段)1B、ボール径判定部(ボール径判定手段)
17を備えている。また、ボール形成装置10は、放電
電圧検出部18、電圧有無検出部19を備えている。
The ball forming device 10 includes a discharge condition setting section (discharge condition setting means) 11, a discharge generation device (discharge generation means) 12, a discharge current detection section 13. Current presence/absence detection section (current presence/absence detection means)
14, integrator 15, normal discharge state setting section (normal discharge state setting means) 1B, ball diameter determination section (ball diameter determination means)
It is equipped with 17. The ball forming device 10 also includes a discharge voltage detection section 18 and a voltage presence/absence detection section 19.

放電発生装置12は、定電流電源回路を内蔵しており、
放電指令A1〜A3に基づいて、ワイヤ21の先端部2
1Aと電極22の間に放電を発生させ、ワイヤ先端部2
1Aにボールを形成する。
The discharge generator 12 has a built-in constant current power supply circuit,
Based on the discharge commands A1 to A3, the tip end 2 of the wire 21
1A and the electrode 22, the wire tip 2
Form a ball at 1A.

この例では、放電指令A!による放電状態は正常、放電
指令A2による放電状態は放電ギャップが広すざる不良
状態(オープン)、放電指令A3による放電状態はワイ
ヤ21が7を極22に接触した不良状態(ショート)に
あるものとする。
In this example, discharge command A! The discharge state according to the discharge command A2 is normal, the discharge state according to the discharge command A2 is a defective state (open) where the discharge gap does not widen, and the discharge state according to the discharge command A3 is a defective state (short) where the wire 21 contacts the pole 22. shall be.

ここで、放電条件設定部11は、一定のボール径を形成
するためにワイヤ21に与えるべき電荷量を、放電電流
Iと放電指令時間Tとして設定し、上記放電発生装置1
2は、放電条件設定部11が設定した設定放電電流Iを
設定放電指令時間Tだけワイヤ21に流す、第3図(A
)。
Here, the discharge condition setting unit 11 sets the amount of charge that should be given to the wire 21 in order to form a constant ball diameter as the discharge current I and the discharge command time T, and
2, the set discharge current I set by the discharge condition setting unit 11 is caused to flow through the wire 21 for the set discharge command time T.
).

(B)は、ワイヤ21に与えるべき電荷量を、今放電指
令時間Tは一定TIとし、放電電流の変化によって変化
させる例であり、例えばボール径小の場合には放電電流
をIt、ボール径大の場合には放電電流をI2(>It
)という具合である。
(B) is an example in which the amount of charge to be given to the wire 21 is changed according to changes in the discharge current, with the current discharge command time T being constant TI. For example, in the case of a small ball diameter, the discharge current is It, the ball diameter is In case of large discharge current, I2(>It
).

もちろん放電指令時間Tも変化させ得る。Of course, the discharge command time T can also be changed.

電流有無検出部14は、各放電指令A1〜A3に対応し
、放電電流検出部13から放電電流+1〜i3を与えら
れ、その検出結果を2値化信号として出力する。すなわ
ち、電流有無検出部14は、放電状態が正常であって放
電電流i1が流れている時には電流布として論理レベル
”1”の信号を出力し、放電状態がオープンであって放
電電流I2が流れない時には電流筒として論理レベル”
0”の信号を出力する。
The current presence/absence detection unit 14 is given discharge currents +1 to i3 from the discharge current detection unit 13 in response to each of the discharge commands A1 to A3, and outputs the detection results as a binary signal. That is, the current presence/absence detection unit 14 outputs a signal of logic level "1" as a current cloth when the discharge state is normal and the discharge current i1 is flowing, and when the discharge state is open and the discharge current I2 is flowing. When there is no current cylinder, it functions as a logic level.”
Outputs a 0" signal.

積分器15は、電流有無検出部14の出力値を積分、す
なわちワイヤ21に与えられる電荷量の相当値を累積す
る。
The integrator 15 integrates the output value of the current presence/absence detection section 14, that is, accumulates a value equivalent to the amount of charge applied to the wire 21.

正常放電状態設定部16は、一定のボール径が形成され
るべき状態、すなわちワイヤ21に必要とされる最低の
電苅量が与えられた状態下における積分器15の積分値
を予め定めグツドレベルLとして設定するものである。
The normal discharge state setting unit 16 predetermines the integral value of the integrator 15 in a state in which a constant ball diameter is to be formed, that is, in a state in which the minimum amount of electric field required for the wire 21 is given, and sets it to a good level L. It is set as .

その設定の仕方については後述する。The setting method will be described later.

ボール径判定部17は、放電条件設定部11に設定され
る放電指令時間Tを経過した時点で積分器15の積分値
を正常放電状態設定部16に予め設定されるグツドレベ
ルLと比較し、ボール径が一定値に達したか否かを判定
し、グツド信号Gを出力する等、判定結果をボンディン
グ装置に出力する。
The ball diameter determination unit 17 compares the integral value of the integrator 15 with the good level L preset in the normal discharge state setting unit 16 at the time when the discharge command time T set in the discharge condition setting unit 11 has elapsed, and determines the ball diameter. It is determined whether the diameter has reached a certain value and outputs the determination result, such as outputting a good signal G, to the bonding device.

ところで、放電指令時間T1すべてにわたり正常な放電
が行なわれたと仮定し、放電電流検出部13が検出した
放電電流を2値化しないで積分器によって積分するもの
とすれば、積分値の増加率は第3図(A)に示すように
放電電流が変化する毎に変化し、それに応じてボール径
判定基準は11、見2に示すように細かな調整を必要と
する。これに対し、本実施例におけるように、放電電流
検出部13が検出した放電電流を2値化して積分する場
合には、放電電流11.12にかかわらず、積分値の増
加率は第3図(B)に示すように一定となる。この特性
を利用して、本実施例ではボール径が一定値に達したか
否かを判定するものである。
By the way, assuming that normal discharge is performed over the entire discharge command time T1, and if the discharge current detected by the discharge current detection section 13 is not binarized but is integrated by an integrator, the rate of increase in the integral value is As shown in FIG. 3(A), the ball diameter determination criterion changes every time the discharge current changes, and accordingly, the ball diameter determination criterion is 11, and as shown in FIG. 2, fine adjustment is required. On the other hand, when the discharge current detected by the discharge current detection unit 13 is binarized and integrated as in this embodiment, the rate of increase in the integral value is as shown in FIG. 3 regardless of the discharge current 11.12. It becomes constant as shown in (B). This characteristic is utilized in this embodiment to determine whether the ball diameter has reached a certain value.

ここで、放電条件設定部11に設定される放電電流、放
電指令時間ならびに正常放電状態設定部16に設定され
るグツドレベルLの設定の仕方の一例を説明する。
Here, an example of how to set the discharge current and discharge command time set in the discharge condition setting section 11 and the good level L set in the normal discharge state setting section 16 will be explained.

まず、初期設定の段階において、作業者は、実験的にあ
る放電電流lをワイヤ21に流し、ワイヤ21と電流2
2の間に正常放電を生じせしめながら形成されるボール
を観察する。そして今必要とするボール径の最低限の大
きさのボールが形成されるまでの時間が、ボンディング
スピード等の要素を考慮して適当かどうか判断し、適当
と判断できるまで放電電流iを加減して調整する。なお
、この作業はワイヤ径、必要とするボール径、放電電流
の関係を前もってデータとして有していれば極めて能率
的に行なえる。このようにしてまず放電電流11が決定
され、今必要とするボール径の最低限の大きさのボール
が第3図(B)における時間Taで形成されたとすると
、ここでグツドレベルLが決定される。
First, at the initial setting stage, the operator experimentally causes a certain discharge current l to flow through the wire 21 and connects the wire 21 with the current 2.
2. Observe the ball that is formed while causing normal discharge. Then, determine whether the time it takes to form a ball with the minimum ball diameter currently required is appropriate, taking into account factors such as bonding speed, and adjust the discharge current i until it is determined to be appropriate. Adjust. Note that this work can be carried out extremely efficiently if data on the relationship between the wire diameter, the required ball diameter, and the discharge current are available in advance. In this way, the discharge current 11 is first determined, and assuming that a ball of the minimum diameter required now is formed at time Ta in FIG. 3(B), the good level L is determined here. .

さて以上は時間Ta間全てにおいて正常放電が行なわれ
た場合を想定したが、実際の放電途中においては一時的
に何らかの理由で無放電になり得ることも考えられる。
The above description assumes that normal discharge occurs during the entire time period Ta, but it is conceivable that no discharge may occur temporarily for some reason during actual discharge.

これらを考慮して、先に決定した時間Taより長い、す
なわち放電指令時間T1を決定する。この放電指令時間
TIの決定には、先に述べたボンディングスピード等の
要素を考慮することとなる。
Taking these into consideration, the discharge command time T1, which is longer than the previously determined time Ta, is determined. In determining this discharge command time TI, factors such as the bonding speed mentioned above are taken into consideration.

また1次に必要とするボール径が大きい場合。Also, when the diameter of the ball required for the primary is large.

ワイヤに加える電荷量を多くする必要がある。このため
には、放電電流!、放電指令時間Tの少なくとも一方を
増加させればよいわけであり1本実施例では今までと同
じ放電指令時間T!を用いることとすると、放電電流I
を大きくすることが必要となる。このため、作業者は放
電電流を今までのIIから増加させ、正常放電状態にお
いて時間Taで次に必要とするボール径の最低限の大き
さのボールができるような電流を■2として放電条件設
定部11に設定することとなる。
It is necessary to increase the amount of charge applied to the wire. For this, discharge current! , and discharge command time T. In this embodiment, the discharge command time T! is the same as before. is used, the discharge current I
It is necessary to make it larger. For this reason, the operator increases the discharge current from the previous II, and sets the discharge condition to ■2, which is the current that will allow a ball with the minimum required ball diameter to be formed in time Ta under normal discharge conditions. This will be set in the setting section 11.

次に、実際のポンディング作業において、ボール径が一
定値に達したか否かを判定する判定方法について詳説す
る。
Next, a method for determining whether the ball diameter has reached a certain value in actual pounding work will be explained in detail.

まず、放電状態が正常である場合には、放電指令AIの
全発生期間中、放電電流11が流れ、放電指令時間T1
経過後における積分値S1はグツドレベルLを越えるた
め、グツド信号Gが出力され、ボール径長が判定される
First, when the discharge state is normal, the discharge current 11 flows during the entire generation period of the discharge command AI, and the discharge command time T1
Since the integral value S1 after the elapse of time exceeds the good level L, the good signal G is output, and the ball diameter length is determined.

なお、この場合、第3図CB)において2点鎖線で示す
ように、放電途中に無放電時が存在したとしても、放電
指令時間TI経過後における積分値St’がグツドレベ
ルLを越えている場合、ワイヤ21には必要電荷量が加
えられたものと判断し、ボール径長と判定される。
In this case, as shown by the two-dot chain line in Fig. 3 CB), even if there is a non-discharge period during the discharge, if the integral value St' after the elapse of the discharge command time TI exceeds the good level L. , it is determined that the necessary amount of charge has been added to the wire 21, and the ball diameter is determined to be the same.

しかしながら、放電状態がオープンとなる場合には、放
電指令A2の全発生期間中のうちで上記オープン状態に
至っていない間だけ放電電流12が流れても、積分値S
2はグツドレベルLに達することができず、ボール径不
良が判定される。
However, when the discharge state becomes open, even if the discharge current 12 flows only during the period when the discharge command A2 does not reach the open state, the integral value S
No. 2 cannot reach the good level L, and it is determined that the ball diameter is defective.

ところで、放電状態がショートとなる場合には、放電発
生装置12が定電流電源回路を用いているため、放電指
令A3の全発生期間中、はとんど同一レベルの放電電流
■3が流れる。したがって、この場合には、放電電圧検
出部18.電圧有無検出部19の存在により、シ、−ト
発生以後における電流有無検出部14の出力信号を積分
器15において累積させないものとする。すなわち、放
電電圧検出部18が検出する放電電圧v1〜v3は、予
め定められているショートレベルhより小なるv3とな
る。そこで、電圧有無検出部19は放電電圧がショート
レベルhより大なる時には電圧有として論理レベル”l
”の信号を出力し、放電電圧がショートレベルhより小
なる時には電圧無として論理レベル”0”の信号を出力
する。精分s15は、電流有無検出部14の出力信号と
、電圧有無検出部19の出力信号の論理積をとり、これ
によりショート状態にない時(電圧有)のみ電流有無検
出部14の出力信号を累積可能とする。
By the way, when the discharge state becomes short-circuited, since the discharge generating device 12 uses a constant current power supply circuit, the discharge current (3) at almost the same level flows during the entire period in which the discharge command A3 is generated. Therefore, in this case, the discharge voltage detection section 18. Due to the presence of the voltage detection section 19, the output signal of the current detection section 14 after the occurrence of a sheet is not accumulated in the integrator 15. That is, the discharge voltages v1 to v3 detected by the discharge voltage detection section 18 are v3, which is smaller than the predetermined short level h. Therefore, when the discharge voltage is higher than the short level h, the voltage presence/absence detection unit 19 determines that the voltage is present and the logic level is "l".
”, and when the discharge voltage is lower than the short level h, it outputs a signal of logic level “0” as no voltage. The output signals of the current detection unit 14 can be accumulated only when there is no short-circuit condition (voltage is present).

これにより、ショート発生時の積分器15による積分値
s3はグツドレベルLに達することができず、ボール径
不良が判定できる。
As a result, the integral value s3 by the integrator 15 when a short circuit occurs cannot reach the good level L, and it can be determined that the ball diameter is defective.

以下、上記実施例の作用について説明する。Hereinafter, the operation of the above embodiment will be explained.

まず、放電電流IIと放電指令時間とTIが前述のよう
にして放電条件設定部11に設定されると、放電発生装
置12が上記放電電流を設定放電指令時間だけワイヤ2
1に流す、さらに、電流有無検出部14がワイヤ21に
流れる放電電流の有無を検出し、放電電流が流れている
間、論理レベル”l”の信号を出力し、積分器15は上
記”l”を積分する。これにより、ワイヤ21に形成さ
れるボール径の変更に対応して、該ワイヤ21に与える
放電電流をX2に変化させた場合においても。
First, when the discharge current II, the discharge command time, and TI are set in the discharge condition setting section 11 as described above, the discharge generator 12 sets the discharge current to the wire 2 for the set discharge command time.
Further, the current presence/absence detection section 14 detects the presence or absence of a discharge current flowing through the wire 21, and outputs a signal of logic level "l" while the discharge current is flowing, and the integrator 15 ” is integrated. Thereby, even when the discharge current applied to the wire 21 is changed to X2 in response to a change in the diameter of the ball formed on the wire 21.

積分器15が累積する積分値の増加率は一定となり、放
電電流の大きさによらずボール径の判定に用いられるグ
ツドレベルLは同一とすることができる。したがって、
放電条件設定部11に予め設定した設定放電指令時間経
過後における積分器15の積分値をグツドレベルLと比
較することにより、ボール径が当初定めた一定値になっ
ているか否かをを判定できる。これにより、上記実施例
によれば、複雑な制御回路を必要とすることなく簡素な
装置構成により、また、各種のボール径に応じたボール
径判定基準の細かな調整を必要とすることなく、各種サ
イズのボール径を高精度かつ容易に判定できる。
The rate of increase of the integral value accumulated by the integrator 15 is constant, and the good level L used for determining the ball diameter can be made the same regardless of the magnitude of the discharge current. therefore,
By comparing the integrated value of the integrator 15 after the elapse of the set discharge command time preset in the discharge condition setting section 11 with the good level L, it can be determined whether the ball diameter is at the initially determined constant value. As a result, according to the above-mentioned embodiment, the device configuration is simple without requiring a complicated control circuit, and without the need for fine adjustment of the ball diameter determination criteria according to various ball diameters. Ball diameters of various sizes can be determined easily and with high precision.

次に、本発明の他の実施例について説明する。Next, other embodiments of the present invention will be described.

構成については先の実施例とほぼ同じであるため、第1
図を用いて説明する。この例では、放電発生装置12は
放電条件設定部!lに設定される放電電流Iを設定指令
放電時間Tだけはワイヤ21に流し得る簡力を有してい
る点は変わらないが、ボール径が一定値に達したことを
ボール径判定部17が判定したことを条件に放電を終了
させる点が相違する。このため、第1図において点線2
5で示したように、ボール径判定部17における判定信
号が放電終了信号として放電発生装置12に入力される
ようになっている。ボール径が一定値に達したことをボ
ール径判定部17が判定したことを条件に放電を終了さ
せる時期について、まず第1に、第4図(A)に示すよ
うに、積分器15の積分値がグツドレベルLに達した時
点、すなわちボール径が一定値に達したことをボール径
判定部17が判定した時点で直ちにということが考えら
れる。また第2に、第4図(B)に示すように、積分器
15の積分値がグツドレベルLに達してから一定時間(
ΔT)後にということも考えられる。いずれにしろ、先
の実施例の場合は、ボール形成にあたり、少なくとも放
電条件設定部11に設定した放電指令時間Tは必要とし
たのに対し、本実施例においては、ボール径が一定値に
達したことを条件に放電を終了させるようにしたため、
その後すぐにポンディング作業を行なうことができ、全
体としてのポンディングスピードを大幅に向上させるこ
とができるという効果をも有する。
Since the configuration is almost the same as the previous example, the first
This will be explained using figures. In this example, the discharge generating device 12 is a discharge condition setting section! The point remains that the discharge current I set at 1 can be easily passed through the wire 21 for the set command discharge time T, but the ball diameter determination unit 17 determines that the ball diameter has reached a certain value. The difference is that the discharge is terminated on the condition that the determination is made. Therefore, in Figure 1, the dotted line 2
As shown in 5, the determination signal from the ball diameter determining section 17 is input to the discharge generating device 12 as a discharge end signal. As for when to end the discharge on the condition that the ball diameter determination unit 17 determines that the ball diameter has reached a certain value, first, as shown in FIG. It is conceivable that the ball diameter determination section 17 determines that the ball diameter has reached a certain value, that is, immediately after the ball diameter reaches the good level L. Second, as shown in FIG. 4(B), a certain period of time (
ΔT) later. In any case, in the case of the previous embodiment, at least the discharge command time T set in the discharge condition setting section 11 was required to form the ball, whereas in the present embodiment, the ball diameter reaches a certain value. Since the discharge is terminated on the condition that the
It also has the effect that the pounding work can be performed immediately after that, and the overall pounding speed can be greatly improved.

なお、上記した2つの実施例において放電発生装置12
はワイヤ21と電極22の間に定電圧を印加する回路を
内蔵するものであってもよい、この時、放電状態がショ
ートとなる場合には、以下の方法によってボール径の不
良発生を判定する。
In addition, in the two embodiments described above, the discharge generator 12
may have a built-in circuit that applies a constant voltage between the wire 21 and the electrode 22. At this time, if the discharge state is short-circuited, the occurrence of a defective ball diameter is determined by the following method. .

定電圧制御状態下で、放電状態がショートになると、第
2図において放電電流i3はi3z、放電電圧v3はv
3zとなる。そこで、放電電流検出部13が検出する電
流i3が電流t3zとなる異常上昇をとらえてショート
発生を判定するショート判定部を設け、このショート判
定部の判定結果によって積分器15によるショート発生
以後の積分を中止させ、ボール径判定部16によってボ
ール径の不良発生を判定可能とする。
Under constant voltage control, when the discharge state becomes short-circuited, the discharge current i3 becomes i3z and the discharge voltage v3 becomes v in Fig. 2.
It becomes 3z. Therefore, a short-circuit determination section is provided that determines the occurrence of a short circuit by detecting an abnormal rise in which the current i3 detected by the discharge current detection section 13 becomes the current t3z, and based on the determination result of this short-circuit determination section, the integrator 15 calculates the This enables the ball diameter determining section 16 to determine whether a defective ball diameter has occurred.

また2つの実施例では、放電指令時間Tを必要とするボ
ール径にかかわらず一定T1とし、放電電流を変化させ
た場合について説明したが、ワイヤ21の径が犬きく異
なったり、必要とするボール径が極端に大きい場合、放
電指令時間Tも°長くする必要性が生じてくる。これは
1例えばワイヤ21の直径がdlからd2(di+Δd
l)程度の範囲のグループでは同一放電指令時間内に必
要とするボールを得ることは可能であるが、ワイヤ21
の直径がd2からd3(d2+Δd2)程度の範囲のグ
ループでは放電指令時間Tを前者のグループより長くし
なければならない、このため、ワイヤ21の直径がdl
からd2に対応するグツドレベルL1.d2からd3に
対応するグツドレベルL2という具合に別々に設定する
ことで、少なくともグループ内におけるグツドレベルL
は一定にしてボール径の判定を行なうことができる。
In addition, in the two embodiments, the discharge command time T is constant T1 regardless of the required ball diameter, and the discharge current is varied. If the diameter is extremely large, it becomes necessary to lengthen the discharge command time T as well. This is 1. For example, the diameter of the wire 21 is from dl to d2 (di+Δd
l) It is possible to obtain the required balls within the same discharge command time in a group within the range of
In the group where the diameter of the wire 21 is in the range of d2 to d3 (d2 + Δd2), the discharge command time T must be longer than that of the former group. Therefore, the diameter of the wire 21 is dl
to the good level L1. corresponding to d2. By setting the good level L2 corresponding to d2 to d3 separately, at least the good level L within the group can be set separately.
The ball diameter can be determined by keeping constant.

[発明の効果] 本発明によれば、簡素な装置構成により、ボール径の判
定精度を向丘することができる。
[Effects of the Invention] According to the present invention, ball diameter determination accuracy can be improved with a simple device configuration.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の第1の実施例に係るボール形成装置を
示すブロック図、第2図はボール形成装置に用いられる
制御波形を示す波形図、第3図る電荷量相当値の積分状
態を説明する模式図、第5図はワイヤボンディング装置
を示す模式図である。 10・・・ボール形成装置、11・・・放電条件設定部
(放電条件設定手段)、12・・・放電発生装置(放電
発生手段)、13・・・放電電流検出部、14・・・電
流有無検出部(電流有無検出手段)、15・・・積分器
、16・・・正常放電状態設定部、17・・・ボール径
判定?s(ボール径判定手段)、2工・・・ワイヤ。 22・・・電極。 代理−大 弁理士  塩 川 修 治 第3図(A) η時間 第3図(B) T=−1・時間 第4図(A) 時間− 第4回(B) 時間− 第5図
FIG. 1 is a block diagram showing a ball forming device according to the first embodiment of the present invention, FIG. 2 is a waveform diagram showing control waveforms used in the ball forming device, and FIG. 3 is a waveform diagram showing the integral state of the electric charge equivalent value. FIG. 5 is a schematic diagram showing a wire bonding apparatus. DESCRIPTION OF SYMBOLS 10... Ball forming device, 11... Discharge condition setting part (discharge condition setting means), 12... Discharge generating device (discharge generating means), 13... Discharge current detection part, 14... Current Presence/absence detection section (current presence/absence detection means), 15... Integrator, 16... Normal discharge state setting section, 17... Ball diameter determination? s (ball diameter determination means), 2nd work...wire. 22...electrode. Agent - Dai Patent Attorney Shuji Shiokawa Figure 3 (A) η Time Figure 3 (B) T = -1・Time Figure 4 (A) Time - 4th (B) Time - Figure 5

Claims (4)

【特許請求の範囲】[Claims] (1)ワイヤの先端部と電極との間に放電を発生させて
、ワイヤの先端部にボールを形成するワイヤボンディン
グ用のボール形成装置において、ワイヤに与えるべき放
電電流と放電指令時間を設定する放電条件設定手段と、
放電条件設定手段が設定した上記設定放電電流を上記設
定放電指令時間だけワイヤに流す放電発生手段と、放電
時にワイヤを含む放電回路中に流れる放電電流の有無を
検出し、その検出結果を2値化信号として出力する電流
有無検出手段と、電流有無検出手段の出力値を積分する
積分器と、一定のボール径が形成されるべき状態下にお
ける上記積分器の積分値をグッドレベルとして予め定め
る正常放電状態設定手段と、放電条件設定手段の設定放
電指令時間を経過した時点で積分器の積分値を該グッド
レベルと比較し、ボール径が一定値に達したか否かを判
定するボール径判定手段とを有してなることを特徴とす
るワイヤボンディング用のボール形成装置。
(1) Setting the discharge current and discharge command time to be applied to the wire in a ball forming device for wire bonding that generates a discharge between the tip of the wire and the electrode to form a ball at the tip of the wire. discharge condition setting means;
A discharge generating means causes the set discharge current set by the discharge condition setting means to flow through the wire for the set discharge command time, and a discharge generating means detects the presence or absence of a discharge current flowing in the discharge circuit including the wire at the time of discharge, and converts the detection result into a binary value. a current detection means that outputs a current detection signal as a signal; an integrator that integrates the output value of the current presence detection means; and a normal state in which the integrated value of the integrator under a condition in which a constant ball diameter is to be formed is predetermined as a good level. A ball diameter determination unit that compares the integral value of an integrator with the good level at the time when the discharge command time set by the discharge condition setting means and the discharge condition setting means has elapsed, and determines whether the ball diameter has reached a certain value. 1. A ball forming device for wire bonding, comprising: means.
(2)ワイヤの先端部と電極との間に放電を発生させて
、ワイヤの先端部にボールを形成するワイヤボンディン
グ用のボール形成装置において、ワイヤに与えるべき放
電電流と放電指令時間を設定する放電条件設定手段と、
放電条件設定手段が設定した上記設定放電電流を上記設
定放電指令時間だけはワイヤに流し得る放電発生手段と
、放電時にワイヤを含む放電回路中に流れる放電電流の
有無を検出し、その検出結果を2値化信号として出力す
る電流有無検出手段と、電流有無検出手段の出力値を積
分する積分器と、一定のボール径が形成されるべき状態
下における上記積分器の積分値をグッドレベルとして予
め定める正常放電状態設定手段と、積分器の積分値をグ
ッドレベルと比較し、ボール径が一定値に達したか否か
を判定するボール径判定手段とを有し、ボール径が一定
値に達したことをボール径判定手段が判定したことを条
件に、放電発生手段による放電を終了することを特徴と
するワイヤボンディング用のボール形成装置。
(2) Setting the discharge current and discharge command time to be applied to the wire in a ball forming device for wire bonding that generates a discharge between the tip of the wire and the electrode to form a ball at the tip of the wire. discharge condition setting means;
A discharge generating means that allows the set discharge current set by the discharge condition setting means to flow through the wire for the set discharge command time, and a discharge generating means that detects the presence or absence of a discharge current flowing in a discharge circuit including the wire at the time of discharge, and detects the detection result. A current detection means outputs a binary signal, an integrator integrates the output value of the current presence detection means, and the integrated value of the integrator under a condition in which a constant ball diameter is to be formed is set as a good level in advance. The ball diameter determining means compares the integral value of the integrator with a good level and determines whether the ball diameter has reached a certain value. A ball forming apparatus for wire bonding, characterized in that the discharge by the discharge generating means is terminated on condition that the ball diameter determining means determines that the ball diameter has been formed.
(3)特許請求の範囲第2項において、放電発生手段は
、ボール径が一定値に達したことをボール径判定手段が
判定した時点で直ちに放電を終了するワイヤボンディン
グ用のボール形成装置。
(3) The ball forming device for wire bonding according to claim 2, wherein the discharge generating means terminates the discharge immediately when the ball diameter determining means determines that the ball diameter has reached a certain value.
(4)特許請求の範囲第2項において、放電発生手段は
、ボール径が一定値に達したことをボール径判定手段が
判定してから一定時間後に放電を終了するワイヤボンデ
ィング用のボール形成装置。
(4) In claim 2, the discharge generating means is a ball forming device for wire bonding that terminates the discharge after a certain period of time after the ball diameter determining means determines that the ball diameter has reached a certain value. .
JP61281897A 1986-11-28 1986-11-28 Ball formation device for wire bonding Granted JPS63136640A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61281897A JPS63136640A (en) 1986-11-28 1986-11-28 Ball formation device for wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61281897A JPS63136640A (en) 1986-11-28 1986-11-28 Ball formation device for wire bonding

Publications (2)

Publication Number Publication Date
JPS63136640A true JPS63136640A (en) 1988-06-08
JPH0317377B2 JPH0317377B2 (en) 1991-03-07

Family

ID=17645480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61281897A Granted JPS63136640A (en) 1986-11-28 1986-11-28 Ball formation device for wire bonding

Country Status (1)

Country Link
JP (1) JPS63136640A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0383355A (en) * 1989-08-28 1991-04-09 Marine Instr Co Ltd Wire disconnection detector for semiconductor wire bonder

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI562252B (en) * 2014-02-17 2016-12-11 Shinkawa Kk Detecting discharging device, wire bonding device and detecting discharging method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0383355A (en) * 1989-08-28 1991-04-09 Marine Instr Co Ltd Wire disconnection detector for semiconductor wire bonder

Also Published As

Publication number Publication date
JPH0317377B2 (en) 1991-03-07

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