JP3379904B2 - Torch power supply for wire bonding - Google Patents

Torch power supply for wire bonding

Info

Publication number
JP3379904B2
JP3379904B2 JP14164198A JP14164198A JP3379904B2 JP 3379904 B2 JP3379904 B2 JP 3379904B2 JP 14164198 A JP14164198 A JP 14164198A JP 14164198 A JP14164198 A JP 14164198A JP 3379904 B2 JP3379904 B2 JP 3379904B2
Authority
JP
Japan
Prior art keywords
voltage
discharge
current
power supply
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP14164198A
Other languages
Japanese (ja)
Other versions
JPH11340274A (en
Inventor
則喜 篠原
Original Assignee
株式会社九州エレクトロニクスシステム
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Priority to JP14164198A priority Critical patent/JP3379904B2/en
Publication of JPH11340274A publication Critical patent/JPH11340274A/en
Application granted granted Critical
Publication of JP3379904B2 publication Critical patent/JP3379904B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/78268Discharge electrode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/786Means for supplying the connector to be connected in the bonding apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009Pre-treatment of the connector or the bonding area
    • H01L2224/8503Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852Applying energy for connecting
    • H01L2224/85201Compression bonding
    • H01L2224/85205Ultrasonic bonding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01023Vanadium [V]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Discharge Heating (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、半導体製造装置に
おけるワイヤボンディング用のトーチ電源に関し、特に
ボールを形成するための電源に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a torch power supply for wire bonding in a semiconductor manufacturing apparatus, and more particularly to a power supply for forming a ball.

【0002】[0002]

【従来の技術】図4に従来のワイヤボンディング装置及
びトーチ電源を示す。図において、ワイヤスプール2か
ら送り出されるワイヤ1は、クランパー3を通してボン
ディングツール4の先端から繰り出され、トーチ電源5
から電極6に負の電位を与えてワイヤ1の先端と電極6
との間で放電を行わせ、その熱によってワイヤ1の先端
にボール1aを形成する。ボール1aが形成されると、
電極6を退避させて、図5に示すようにボンディングツ
ール4を下降し、ボール1aがボンディングツール4の
先端の凹部に包持されるようにし、テーブル7の上にセ
ットされたペレット8およびリードフレーム9にワイヤ
1をボンディングする。このボンディングは、超音波発
振器10からの超音波を超音波ホーン11に与え、ペレ
ット8の金属表面に対して水平方向の超音波振動を、圧
力を加えることにより伝達すると、ボール1aとペレッ
ト8の接触面の間で、金属の表面を覆っている酸化膜が
破壊され活性化した金属が現れる。活性化した金属に加
圧することにより、活性分子間の距離が近づき金属接合
する。
2. Description of the Related Art FIG. 4 shows a conventional wire bonding apparatus and torch power supply. In the figure, a wire 1 delivered from a wire spool 2 is delivered from a tip of a bonding tool 4 through a clamper 3, and a torch power supply 5
A negative potential is applied to the electrode 6 from the tip of the wire 1 and the electrode 6
A discharge is generated between the wire and the ball, and the heat forms a ball 1a at the tip of the wire 1. When the ball 1a is formed,
The electrode 6 is retracted, and the bonding tool 4 is lowered as shown in FIG. The wire 1 is bonded to the frame 9. In this bonding, ultrasonic waves from the ultrasonic oscillator 10 are applied to the ultrasonic horn 11, and ultrasonic vibrations in the horizontal direction with respect to the metal surface of the pellet 8 are transmitted by applying pressure. Between the contact surfaces, the oxide film covering the surface of the metal is destroyed and activated metal appears. When pressure is applied to the activated metal, the distance between the active molecules is reduced and metal bonding is performed.

【0003】前記のボール1aはペレット8に対するボ
ンディングを好適にするものであるが、その前提として
ペレット8のボンディングパッド面積の変更、ワイヤ1
の直径の変更等に応じて適正なボール径が要求される。
放電を開始するには、数千ボルトの電圧が必要である。
これを、トーチ電源5の定電流回路だけで放電をさせよ
うとすると、回路に使用する部品は、高耐圧品が必要と
なる。また、電流も数10mAのため、全体のワット数
が大きくなる。さらに、従来は、電流値20mA〜30
mA、放電時間1mS〜10mS程度の条件でボールを
生成していた。これらに対する弊害は、周囲の環境や電
極の状態によって、放電の状態が変わったり、放電が途
切れたりすることがあった。
The ball 1a described above is suitable for bonding to the pellet 8, but as a precondition therefor, the bonding pad area of the pellet 8 is changed and the wire 1 is
An appropriate ball diameter is required according to changes in the diameter of the ball.
Thousands of volts are required to initiate the discharge.
If this is to be discharged only by the constant current circuit of the torch power supply 5, the components used in the circuit must have high withstand voltage. Moreover, since the current is several tens of mA, the total wattage is large. Further, conventionally, the current value is 20 mA to 30
A ball was produced under the conditions of mA and discharge time of about 1 mS to 10 mS. As a harmful effect to these, the discharge state may change or the discharge may be interrupted depending on the surrounding environment and the state of the electrodes.

【0004】一方、ボンディングにおいて、ボールの柔
らかさは重要な意味がある。同じパワーの超音波発振器
でボンディング状態を比較すると、柔らかいボールの方
が、圧着ボールサイズ等の比較からボンディングの密着
性が非常に良いことが分かった。従来においては、ボー
ルが生成されると、すぐに電流を遮断していたため、ボ
ールが急冷され、安定して柔らかいボールを生成するこ
とができなかった。ボールを生成するエネルギーは、電
流とギャップ間に発生する電圧、及び放電時間で決ま
る。同じサイズのボールを作るためには、このエネルギ
ーを一定にする必要があるが放電時間を制御するという
ことは従来行われていなかった。
On the other hand, the softness of the ball has an important meaning in bonding. Comparing the bonding states with an ultrasonic oscillator of the same power, it was found that the soft ball has a much better bonding adhesion from the comparison of the pressure bonding ball size and the like. In the past, when a ball was generated, the current was immediately cut off, so that the ball was rapidly cooled and a stable soft ball could not be generated. The energy to generate the ball is determined by the voltage generated between the current and the gap, and the discharge time. In order to make balls of the same size, it is necessary to keep this energy constant, but controlling the discharge time has not been conventionally performed.

【0005】[0005]

【発明が解決しようとする課題】本発明が解決しようと
する課題は、次の通りである。 (1)ボール生成のための放電開始タイミングを管理す
るために、放電開始を確実に行う。 (2)トーチ電極とワイヤ間に放電を発生させてボール
を生成するトーチ電源において、ボールサイズの安定
性、真球性が良く、偏芯の少ないボールを作ることを可
能にする。 (3)ボンディングを小さなパワーで歩留まり良く行う
ために、柔らかいボールを生成する。 (4)放電時間を自動制御して、ボールサイズの変動を
少なくする。
The problems to be solved by the present invention are as follows. (1) In order to manage the discharge start timing for ball generation, the discharge is surely started. (2) In a torch power supply that generates a ball by generating an electric discharge between a torch electrode and a wire, it is possible to make a ball with good ball size stability, good sphericity, and little eccentricity. (3) A soft ball is produced in order to perform bonding with a small power and a high yield. (4) The discharge time is automatically controlled to reduce variations in ball size.

【0006】[0006]

【課題を解決するための手段】前記第1の課題を解決す
るために、ワイヤの先端部と電極との間に定電流回路か
ら出力される電力により放電を発生してワイヤの先端部
にボールを形成するワイヤボンディング用のトーチ電源
において、前記定電流回路とは別に、放電開始用の高圧
発生回路を設け、放電が開始した後に、前記高圧発生回
路からの高圧の印加を停止する構成とする。前記第2の
課題を解決するために、前記定電流回路に、放電電流の
大きさと放電時間の長さを調節する電流設定部と時間設
定部を設ける。前記第3の課題を解決するために、放電
電流停止後に、放電電流よりも小さい保熱用小電流を流
す手段を設ける。前記第4の課題を解決するため、ワイ
ヤの先端部と電極との間のギャップ電圧に応じて放電時
間を自動制御する手段を設ける。この場合、ギャップ電
圧を検出する手段と、ギャップ電圧の大きさに応じた周
波数のパルスを発生する手段と、パルスをカウントする
手段を備え、所定のパルス数をカウントしたときに放電
電流を停止するようにする。他の手段として、ギャップ
電圧を積分する積分手段と、この積分手段の出力を外部
からの設定電圧と比較する比較手段とを備え、前記積分
手段の出力が前記設定電圧に達したときに放電電流を停
止するようにする。
In order to solve the first problem, a discharge is generated between the tip of the wire and the electrode by the electric power output from the constant current circuit, and a ball is applied to the tip of the wire. In the torch power supply for wire bonding to form, a high voltage generation circuit for starting discharge is provided separately from the constant current circuit, and after the discharge is started, application of high voltage from the high voltage generation circuit is stopped. . In order to solve the second problem, the constant current circuit is provided with a current setting unit and a time setting unit that adjust the magnitude of the discharge current and the length of the discharge time. In order to solve the third problem, a means for supplying a small heat-retention current smaller than the discharge current is provided after the discharge current is stopped. In order to solve the fourth problem, a means for automatically controlling the discharge time according to the gap voltage between the tip of the wire and the electrode is provided. In this case, a means for detecting the gap voltage, a means for generating a pulse having a frequency corresponding to the magnitude of the gap voltage, and a means for counting the pulses are provided, and the discharge current is stopped when a predetermined number of pulses are counted. To do so. As another means, an integrating means for integrating the gap voltage and a comparing means for comparing the output of the integrating means with a set voltage from the outside are provided, and the discharge current when the output of the integrating means reaches the set voltage. To stop.

【0007】[0007]

【発明の実施の形態】以下、本発明の実施の形態を図面
に示す実施例を参照しながら具体的に説明する。図1は
本発明の全体構成を示すブロック図である。図中、1は
ワイヤ、2はワイヤスプール、3はクランパー、4はボ
ンディングツール、5はトーチ電源(定電流回路)、6
は電極、12は高圧発生部、13は電流設定部、14は
時間設定部、15は制御部、16は抵抗である。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be specifically described below with reference to the examples shown in the drawings. FIG. 1 is a block diagram showing the overall configuration of the present invention. In the figure, 1 is a wire, 2 is a wire spool, 3 is a clamper, 4 is a bonding tool, 5 is a torch power supply (constant current circuit), 6
Is an electrode, 12 is a high voltage generating unit, 13 is a current setting unit, 14 is a time setting unit, 15 is a control unit, and 16 is a resistor.

【0008】図1において、ワイヤ1の先端と電極6と
の間に放電が開始するためには、数千ボルトの電圧が必
要であるが、定電流回路5だけで放電をさせようとする
と、回路に使用する部品は、高耐圧品が必要となる。ま
た、電流も数10mAのため、全体のワット数が大きく
なる。このため、高圧発生部12を別に設ける。この高
圧発生部12は、定電流回路5の電流が流れ出すきっか
けのための放電をするもので、電圧は高いが、電流は非
常に小さい。この高電圧は、ボンダーからのトリガー信
号で発生する。放電が開始して定電流回路5の電流が流
れ出せば、電流検出器がそれを感知して自動的に高圧発
生部12からの高圧発生を停止する。
In FIG. 1, a voltage of several thousand volts is required to start the discharge between the tip of the wire 1 and the electrode 6, but if the constant current circuit 5 alone is used for discharging, The components used in the circuit must have high withstand voltage. Moreover, since the current is several tens of mA, the total wattage is large. For this reason, the high voltage generator 12 is separately provided. The high-voltage generator 12 discharges the current of the constant current circuit 5 to trigger the current to flow out. The voltage is high, but the current is very small. This high voltage is generated by the trigger signal from the bonder. When the discharge starts and the current of the constant current circuit 5 starts to flow, the current detector senses it and automatically stops the high voltage generation from the high voltage generator 12.

【0009】なお、高圧発生部12は、ボンダーからの
開始信号で高圧を発生した後、電流が流れなかった場
合、2mS後に自動的にストップする。初期高圧のレベ
ルは、半固定可変抵抗により2000V〜6000Vま
で、ワイヤーと電極間のギャップの長さによって調節で
きる。
The high voltage generator 12 automatically stops after 2 mS when no current flows after the high voltage is generated by the start signal from the bonder. The level of initial high voltage can be adjusted from 2000V to 6000V by the semi-fixed variable resistance, depending on the length of the gap between the wire and the electrode.

【0010】図2は以上の電圧と電流のタイムチャート
であり、(a)はトリガー信号、(b)は高圧発生部1
2の出力電圧、(c)は放電電流、(d)はギャップ電
圧、(e)はワイヤー先端に形成されるボール1aの大
きさの変化を示すものである。
FIG. 2 is a time chart of the above voltage and current. (A) is a trigger signal and (b) is a high voltage generator 1.
2 shows the output voltage, (c) shows the discharge current, (d) shows the gap voltage, and (e) shows the change in size of the ball 1a formed at the tip of the wire.

【0011】図2において、T0は放電が開始するまで
の初期高圧印加領域であり、ワイヤー先端と電極6との
間のギャップ長によって変化する。ギャップが広がれば
0は長くなる。T1は放電領域であり、この領域でボー
ル1aがワイヤー1の先端に生成される。ギャップ長に
よりギャップ電圧VGが変わり、またボール生成時間が
異なる。
In FIG. 2, T 0 is an initial high voltage application region until the start of discharge, which changes depending on the gap length between the wire tip and the electrode 6. The wider the gap, the longer T 0 . T 1 is a discharge area, and the ball 1 a is generated at the tip of the wire 1 in this area. The gap voltage V G changes depending on the gap length, and the ball generation time also changes.

【0012】また、従来は、電流値I1=20mA〜3
0mA、放電時間T1=1mS〜10mS程度の条件で
ボールを生成していた。これらに対する弊害は、周囲の
環境や電極の状態によって、放電の状態が変わったり、
放電が途切れたりすることがあった。
Further, conventionally, the current value I 1 = 20 mA to 3
A ball was produced under the conditions of 0 mA and discharge time T 1 = 1 mS to 10 mS. The adverse effect on these is that the state of discharge changes depending on the surrounding environment and the state of the electrodes,
The discharge was sometimes interrupted.

【0013】これを解決するために、短時間でボールを
生成する。従来式と同じボール径を生成するためには、
当然、電流値を大きくする必要がある。電流値は、従来
式の約2倍、放電時間は1/5程度の設定範囲とした。
この電流値及び放電時間の設定は、図1中の電流設定部
13及び時間設定部14において行う。25μmのワイ
ヤーでの実験結果では、ボール径35μm〜80μmを
安定して生成できることが確認できた。
To solve this, a ball is generated in a short time. To generate the same ball diameter as the conventional formula,
Naturally, it is necessary to increase the current value. The current value was set to about twice that of the conventional method, and the discharge time was set to about 1/5.
The current value and the discharge time are set by the current setting unit 13 and the time setting unit 14 in FIG. From the experimental result with the wire of 25 μm, it was confirmed that the ball diameter of 35 μm to 80 μm can be stably generated.

【0014】次に、柔らかいボールの形成方法について
説明する。ボールの柔らかさは、ボンディングにおい
て、重要な意味がある。同じパワーの超音波発振器でボ
ンディング状態を比較すると、柔らかいボールの方が、
圧着ボールサイズ等の比較から非常に良いことが分かっ
た。柔らかいボールを作るための方式として、従来では
ボールが生成されると、すぐに電流を遮断していたが、
これをボール生成後、図2のT2の区間で小さい電流I2
に切り替えてボールの保熱をした後、電流を遮断するよ
うにする。保熱のための電流に切り替える方式は、いき
なり設定された電流値まで落とす場合と、ゆるやかに落
とす場合が考えられる。
Next, a method of forming a soft ball will be described. The softness of the ball has an important meaning in bonding. Comparing the bonding states with an ultrasonic oscillator of the same power, the softer ball is
It was found from the comparison of the pressure bonding ball size, etc. that it was very good. In the past, as a method for making soft balls, the current was cut off immediately when the ball was generated,
After the ball is generated, a small current I 2 is generated in the section T 2 of FIG.
Switch to and keep the ball warm, then shut off the current. As a method of switching to the current for heat retention, there are a case where the current value is suddenly dropped to the set current value and a case where the current value is gradually dropped.

【0015】保熱のための電流値I2や時間T2は、条件
設定で設定できるようにする。なぜなら、設定によって
は、ボールが成長することが考えられる。このため、実
験的にデ−タを取り、最適な設定をすることが必要にな
る。本実施例では、電流値I2を約5mA〜10mAで
図1の電流設定部13で調節つまみ(図示せず)の目盛
1〜10で設定することとした。また、時間T2の調整
は、図1の時間設定部14で行う。ここで、ボールの柔
らかさの比較において、冷めた状態での測定値に差は認
められない。その確認方法の一つに、ボンディングした
後の圧着ボールサイズの測定による比較がある。同じパ
ワーの超音波発振器でのボンディングにおいて、明らか
に圧着ボールサイズに差が認められた。柔らかいボール
の方が、より小さなパワーでボンディングできることが
分かる。
The current value I 2 and time T 2 for heat retention can be set by setting conditions. This is because the ball may grow depending on the setting. For this reason, it is necessary to empirically collect data and make optimum settings. In the present embodiment, the current value I2 is set to about 5 mA to 10 mA by the scale 1-10 of the adjusting knob (not shown) in the current setting unit 13 of FIG. The time T 2 is adjusted by the time setting unit 14 in FIG. Here, in comparing the softness of the balls, no difference is observed in the measured values in the cold state. One of the confirmation methods is a comparison by measuring the pressure bonding ball size after bonding. In the bonding with the ultrasonic oscillator of the same power, the difference in the crimping ball size was clearly recognized. It can be seen that softer balls can be bonded with less power.

【0016】次に、放電時間を自動制御するための実施
例について説明する。ボールを生成するエネルギーは、
電流とギャップ間に発生する電圧及び放電時間で決ま
る。同じサイズのボールを作るためには、このエネルギ
ーを一定にする必要がある。 エネルギー(P)=電流(I)×ギャップ電圧(V)×
時間(T) 上式で電流は、定電流のため一定であり、ギャップ電圧
は、ギャップ長により、自動的に変わる。時間が一定だ
とギャップ長の変動でエネルギーも変動する。エネルギ
ーを一定にするためには、ギャップ電圧が大きくなった
分、時間を短くする必要がある。
Next, an embodiment for automatically controlling the discharge time will be described. The energy that creates a ball is
It is determined by the voltage generated between the current and the gap and the discharge time. To make balls of the same size, this energy needs to be constant. Energy (P) = current (I) × gap voltage (V) ×
Time (T) In the above equation, the current is constant because it is a constant current, and the gap voltage automatically changes depending on the gap length. If the time is constant, the energy also fluctuates as the gap length fluctuates. In order to keep the energy constant, it is necessary to shorten the time as the gap voltage increases.

【0017】以上のことを解決するために、V/Fコン
バータを活用する。電流とギャップ電圧と時間の関係は
前記の図2に示す通りである。電流(I1)と時間
(T1)は、条件により設定する。ギャップ電圧は、自
動的に発生する。この自動的に発生するギャップ電圧を
利用し放電時間を制御する方法の一つに、V/Fコンバ
ーターを用いることができる。
In order to solve the above, a V / F converter is utilized. The relationship between the current, the gap voltage and the time is as shown in FIG. The current (I 1 ) and time (T 1 ) are set according to the conditions. The gap voltage is automatically generated. A V / F converter can be used as one of the methods of controlling the discharge time by utilizing this automatically generated gap voltage.

【0018】即ち、ギャップ電圧をV/Fコンバーター
に入力すると、入力された電圧に応じた周波数のパルス
が発生する。これは、図2(f)に示すように、ギャッ
プ電圧が高いと出力される周波数が高く、低いと周波数
も低くなる。この出力された周波数のパルスをカウント
し、指定のカウント数と同じになった時に、放電電流I
1をストップする。これにより、ギャップ電圧VGが高く
なると、出力周波数が高くなり、早く指定値と同じにな
る。つまり、ギャップ電圧VGが高くなると、時間を短
くする方向に作用する。これとは逆にギャップ電圧VG
が低くなると、時間が長くなる。これらの作用を利用
し、指定値(設定時間に対応)は一定でも、ギャップ電
圧VGの変動によるエネルギーの変動を、時間を自動的
に変えることにより、無くすことができる。
That is, when the gap voltage is input to the V / F converter, a pulse having a frequency corresponding to the input voltage is generated. As shown in FIG. 2F, this means that the output frequency is high when the gap voltage is high, and the frequency is low when the gap voltage is low. The output current pulse is counted, and when the number of pulses reaches the specified count number, the discharge current I
Stop 1 As a result, when the gap voltage V G becomes higher, the output frequency becomes higher and the value quickly becomes equal to the specified value. That is, when the gap voltage V G becomes higher, it acts to shorten the time. On the contrary, the gap voltage V G
The lower the, the longer the time. By utilizing these effects, even if the designated value (corresponding to the set time) is constant, the energy fluctuation due to the fluctuation of the gap voltage V G can be eliminated by automatically changing the time.

【0019】このV/Fコンバータを使用する代わり
に、積分器を使用することもできる。即ち、ギャップ電
圧を積分器に入力し、積分器の出力電圧を、外部からの
設定電圧と比較することにより積分時間を可変する。積
分器は入力電圧に応じて傾斜が変わる。図3はその説明
図であり、ギャップ電圧が低い場合はaの特性になり、
ギャップ電圧が高い場合はbの特性になる。この波形を
比較器に入力し、外部からの設定電圧と比較する。比較
器の出力で放電電流を停止すると、図3のようにギャッ
プ電圧が高いbの方が早い時間で停止することがわか
る。外部からの設定電圧は、図1の時間設定部14にて
行う。
Instead of using this V / F converter, it is also possible to use an integrator. That is, the gap time is input to the integrator and the output voltage of the integrator is compared with the set voltage from the outside to change the integration time. The slope of the integrator changes according to the input voltage. FIG. 3 is an explanatory diagram thereof, and when the gap voltage is low, the characteristic of a becomes
When the gap voltage is high, the characteristic is b. This waveform is input to the comparator and compared with the external set voltage. It can be seen that when the discharge current is stopped by the output of the comparator, b having a higher gap voltage is stopped earlier in time as shown in FIG. The set voltage from the outside is set by the time setting unit 14 in FIG.

【0020】[0020]

【発明の効果】本発明によれば、下記の効果を奏する。 (1)放電開始用の高圧発生回路を設けたことにより、
放電開始を確実に行うことができ、生成されるボールの
大きさを管理することができる。 (2)ボール生成のための電流値と放電時間を管理でき
るため、ボールサイズの安定性、真球性が良く、偏芯の
少ないボールを作ることを可能にする。また、放電時間
を短縮することにより周囲の影響を受けにくいことか
ら、真球性が良く、偏芯の少ないボールを生成できる。
さらに、小ボールが生成可能なことから、より小さなパ
ットへのボンディングが可能になり、チップの小型化に
寄与する。真球性、偏芯は、ボンディングにおいて、非
常に重要な項目で、これらを良くすることで、ボンダー
の性能を大きく向上させることができる。また、今後期
待されるバンプボンダーへの登用も可能になる。 (3)柔らかいボールを生成することができるため、ボ
ンディングを小さなパワーで歩留まり良く行うことがで
きる。 (4)放電時間を自動制御することにより、ボールサイ
ズの変動を少なくすることができる。
According to the present invention, the following effects are exhibited. (1) By providing a high voltage generation circuit for starting discharge,
It is possible to reliably start the discharge, and it is possible to control the size of the generated ball. (2) Since the current value and the discharge time for ball generation can be controlled, it is possible to make a ball with good ball size stability and sphericalness and less eccentricity. Further, by shortening the discharge time, it is possible to generate a ball having good sphericity and less eccentricity because it is less affected by the surroundings.
Furthermore, since small balls can be produced, bonding to a smaller pad becomes possible, which contributes to downsizing of the chip. The sphericity and the eccentricity are very important items in bonding, and by improving them, the performance of the bonder can be greatly improved. In addition, it will be possible to use it as a bump bonder that is expected in the future. (3) Since soft balls can be produced, bonding can be performed with a small power and a good yield. (4) Ball size fluctuation can be reduced by automatically controlling the discharge time.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の実施例を示すブロック図である。FIG. 1 is a block diagram showing an embodiment of the present invention.

【図2】 本発明による放電電流等のタイムチャートで
ある。
FIG. 2 is a time chart of discharge current and the like according to the present invention.

【図3】 本発明実施例において積分器を使用する場合
の説明図である。
FIG. 3 is an explanatory diagram when an integrator is used in the embodiment of the present invention.

【図4】 従来のトーチ電源を示す構成図である。FIG. 4 is a configuration diagram showing a conventional torch power supply.

【図5】 ボールとボンディングツールの部分拡大図で
ある。
FIG. 5 is a partially enlarged view of a ball and a bonding tool.

【符号の説明】[Explanation of symbols]

1 ワイヤ、1a ボール、2 ワイヤスプール、3
クランパー、4 ボンディングツール、5 トーチ電
源、6 電極、7 テーブル、8 ペレット、9リード
フレーム、10 超音波発振器、11 超音波ホーン、
12 高圧発生部、13 電流設定部、14 時間設定
部、15 制御部、16 抵抗
1 wire, 1a ball, 2 wire spool, 3
Clamper, 4 bonding tool, 5 torch power supply, 6 electrodes, 7 table, 8 pellets, 9 lead frame, 10 ultrasonic oscillator, 11 ultrasonic horn,
12 high voltage generating section, 13 current setting section, 14 hour setting section, 15 control section, 16 resistance

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H01L 21/60 ─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. 7 , DB name) H01L 21/60

Claims (5)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 ワイヤの先端部と電極との間に定電流回
路から出力される電力により放電を発生してワイヤの先
端部にボールを形成するワイヤボンディング用のトーチ
電源において、前記定電流回路とは別に、放電開始用の
高圧発生回路を設け、放電が開始した後に、前記高圧発
生回路からの高圧の印加を停止し、放電電流停止後に、
放電電流よりも小さい保熱用小電流を流す手段を設けた
ことを特徴とするワイヤボンディング用のトーチ電源。
1. A torch power supply for wire bonding, in which a discharge is generated between a tip of a wire and an electrode by electric power output from a constant current circuit to form a ball at the tip of the wire. Separately from the above, a high-voltage generating circuit for starting discharge is provided, and after the start of discharging, the application of high voltage from the high-voltage generating circuit is stopped, and after the discharge current is stopped,
A torch power supply for wire bonding, characterized in that means for supplying a small current for heat retention smaller than a discharge current is provided .
【請求項2】 前記定電流回路に、放電電流の大きさと
放電時間の長さを調節する電流設定部と時間設定部を設
けたことを特徴とする請求項1記載のワイヤボンディン
グ用のトーチ電源。
2. The torch power supply for wire bonding according to claim 1, wherein the constant current circuit is provided with a current setting unit and a time setting unit for adjusting the magnitude of discharge current and the length of discharge time. .
【請求項3】 ワイヤの先端部と電極との間のギャップ
電圧に応じて放電時間を自動制御する手段を設けたこと
を特徴とする請求項1又は2に記載のワイヤボンディン
グ用のトーチ電源。
3. The torch power supply for wire bonding according to claim 1, further comprising means for automatically controlling discharge time in accordance with a gap voltage between the tip of the wire and the electrode.
【請求項4】 ギャップ電圧を検出する手段と、ギャッ
プ電圧の大きさに応じた周波数のパルスを発生する手段
と、パルスをカウントする手段を備え、所定のパルス数
をカウントしたときに放電電流を停止するようにしたこ
とを特徴とする請求項3に記載のワイヤボンディング用
のトーチ電源。
4. A means for detecting a gap voltage and a gap.
Means for generating a pulse with a frequency according to the magnitude of the voltage
And a means for counting pulses, and a predetermined number of pulses
The discharge current should be stopped when
The torch power supply for wire bonding according to claim 3, wherein:
【請求項5】 ギャップ電圧を検出する手段と、ギャッ
プ電圧を積分する積分手段と、この積分手段の出力を外
部からの設定電圧と比較する比較手段とを備え、前記積
分手段の出力が前記設定電圧に達したときに放電電流を
停止するようにしたことを特徴とする請求項3に記載の
ワイヤボンディング用のトーチ電源。
5. A means for detecting a gap voltage and a gap
The output of this integration means
Comparing the set voltage from the unit, the product
The discharge current when the output of the dividing means reaches the set voltage.
The torch power supply for wire bonding according to claim 3, wherein the torch power supply is stopped .
JP14164198A 1998-05-22 1998-05-22 Torch power supply for wire bonding Expired - Fee Related JP3379904B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14164198A JP3379904B2 (en) 1998-05-22 1998-05-22 Torch power supply for wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14164198A JP3379904B2 (en) 1998-05-22 1998-05-22 Torch power supply for wire bonding

Publications (2)

Publication Number Publication Date
JPH11340274A JPH11340274A (en) 1999-12-10
JP3379904B2 true JP3379904B2 (en) 2003-02-24

Family

ID=15296780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14164198A Expired - Fee Related JP3379904B2 (en) 1998-05-22 1998-05-22 Torch power supply for wire bonding

Country Status (1)

Country Link
JP (1) JP3379904B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5094542B2 (en) * 2008-05-14 2012-12-12 株式会社カイジョー Ball forming apparatus and method for forming wire bonder

Also Published As

Publication number Publication date
JPH11340274A (en) 1999-12-10

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