JP2676437B2 - Ball forming device for wire bonder - Google Patents
Ball forming device for wire bonderInfo
- Publication number
- JP2676437B2 JP2676437B2 JP3194982A JP19498291A JP2676437B2 JP 2676437 B2 JP2676437 B2 JP 2676437B2 JP 3194982 A JP3194982 A JP 3194982A JP 19498291 A JP19498291 A JP 19498291A JP 2676437 B2 JP2676437 B2 JP 2676437B2
- Authority
- JP
- Japan
- Prior art keywords
- constant current
- circuit
- wire
- power supply
- supply circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体デバイスの組立
工程において、第１ボンディング点、例えば半導体チッ
プ上の電極と第２ボンディング点、例えばリードフレー
ムに配設された外部リードとをワイヤを用いて接続する
ワイヤボンダーにおけるワイヤボンダー用ボール形成装
置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention uses a wire at a first bonding point, for example, an electrode on a semiconductor chip and a second bonding point, for example, an external lead arranged on a lead frame, in a process of assembling a semiconductor device. TECHNICAL FIELD The present invention relates to a ball forming device for a wire bonder in a wire bonder to be connected with each other.
【０００２】[0002]
【従来技術】従来、金線又は銅，アルミニウムなどのワ
イヤを用いて第１ボンディング点となる半導体チップ上
の電極と第２ボンディング点となるリードとを接続する
装置としては、図２に示す回路構成よりなるワイヤボン
ダー用ボール形成装置が知られている。2. Description of the Related Art Conventionally, as a device for connecting an electrode on a semiconductor chip, which is a first bonding point, and a lead, which is a second bonding point, using a gold wire or a wire such as copper or aluminum, the circuit shown in FIG. A ball forming device for a wire bonder having a structure is known.
【０００３】図２に示すように、高電圧を発生する電源
回路１は、抵抗Ｒを介して高電圧定電流素子２のＥ1 端
子と接続されている。この高電圧定電流素子２は、トラ
ンジスタ（又はＦＥＴ）で構成されており、Ｅ1 端子は
エミッタ（又はソース）、Ｂ1 端子はベース（又はゲー
ト）、Ｃ1 端子はコレクタ（又はドレイン）である。As shown in FIG. 2, a power supply circuit 1 for generating a high voltage is connected to an E 1 terminal of a high voltage constant current element 2 via a resistor R. This high voltage constant current element 2 is composed of a transistor (or FET), an E 1 terminal is an emitter (or source), a B 1 terminal is a base (or gate), and a C 1 terminal is a collector (or drain). is there.
【０００４】前記Ｂ1 端子は、差動増幅器３の出力側と
接続されている。この増幅器３の入力側の一端は、電源
回路１と接続され、他端は基準電圧発生回路４を介して
抵抗Ｒと接続されている。また、Ｃ1 端子は、スイッチ
回路５を介して放電電極１０と接続されている。スイッ
チ回路５は、このスイッチ回路５を一定時間オン／オフ
するタイマ６と接続されており、このタイマ６は、トリ
ガ信号Ｔｒによって駆動される。また、ワイヤ８はキャ
ピラリ９に挿通され、クランパ７は電源回路１と接続さ
れている。The B 1 terminal is connected to the output side of the differential amplifier 3. One end of the amplifier 3 on the input side is connected to the power supply circuit 1, and the other end is connected to the resistor R via the reference voltage generation circuit 4. Further, the C 1 terminal is connected to the discharge electrode 10 via the switch circuit 5. The switch circuit 5 is connected to a timer 6 that turns on / off the switch circuit 5 for a certain period of time, and the timer 6 is driven by a trigger signal Tr. The wire 8 is inserted through the capillary 9, and the clamper 7 is connected to the power supply circuit 1.
【０００５】上記構成よりなる装置を用いてボールの形
成を行うには、外部からのトリガ信号Ｔｒによってタイ
マ６によりスイッチ回路５が駆動されてスイッチがオン
になる。このスイッチ回路５の５ａ側の端子には、最大
約１２００Ｖ程度の電圧がかかっている。したがって、
このスイッチのオンによって放電電極１０に高電圧が印
加されてワイヤ８の先端との間で放電が開始される。そ
して、電源回路１からの高圧電源により抵抗Ｒの両端に
誘起される電圧は、基準電圧発生回路４及び差動増幅器
３に入力される。そして、基準電圧発生回路４で形成さ
れる基準電圧との差電圧が差動増幅器３より出力されて
Ｂ1 端子がバイアスされて高電圧定電流素子２は定電流
制御を行う。そして、放電電極１０とワイヤ８間の放電
エネルギーＥによりワイヤの先端を溶融してボール状に
形成する。In order to form a ball using the apparatus having the above structure, the switch circuit 5 is driven by the timer 6 driven by the timer 6 in response to an external trigger signal Tr. A maximum voltage of about 1200 V is applied to the terminal on the 5a side of the switch circuit 5. Therefore,
When this switch is turned on, a high voltage is applied to the discharge electrode 10 to start discharge with the tip of the wire 8. Then, the voltage induced across the resistor R by the high-voltage power supply from the power supply circuit 1 is input to the reference voltage generation circuit 4 and the differential amplifier 3. The differential voltage from the reference voltage generated by the reference voltage generating circuit 4 is output from the differential amplifier 3 and the B 1 terminal is biased, and the high voltage constant current element 2 performs constant current control. Then, the tip of the wire is melted by the discharge energy E between the discharge electrode 10 and the wire 8 to form a ball shape.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、従来の
装置では、差動増幅器３により電圧制御が行われて高電
圧定電流素子２により定電流制御されるが、この差動増
幅器３には比較的高利得なアンプが用いられているの
で、位相遅れ等が発生して速やかな制御がなされず、定
電流を安定して維持することができないという欠点があ
る。その結果、位相遅れが発生して定電流制御が安定せ
ず放電維持用のスパーク放電電流の減少により適正電流
が得られないため、良好なボール形成ができないという
欠点がある。However, in the conventional device, voltage control is performed by the differential amplifier 3 and constant current control is performed by the high-voltage constant current element 2. Since a high-gain amplifier is used, there is a drawback that a phase delay or the like occurs and rapid control cannot be performed, and a constant current cannot be stably maintained. As a result, a phase delay occurs, the constant current control is not stable, and an appropriate current cannot be obtained due to a decrease in the spark discharge current for sustaining the discharge.
【０００７】そこで、本発明は上記従来技術の欠点に鑑
みてなされたもので、応答速度が速く、しかも定電流を
常に安定して供給維持することができ、最適なボール径
を形成することができるワイヤボンダー用ボール形成装
置を提供することを目的とする。Therefore, the present invention has been made in view of the above-mentioned drawbacks of the prior art, and has a fast response speed, and can always stably supply and maintain a constant current to form an optimum ball diameter. An object of the present invention is to provide a ball forming device for a wire bonder.
【０００８】[0008]
【課題を解決するための手段】本発明は、キャピラリ先
端から送り出されたワイヤの先端と放電電極との間に高
電圧を印加することにより放電を起こさせ、その放電エ
ネルギーによりワイヤの先端部を溶融してボールを形成
するワイヤボンダー用ボール形成装置であって、電源回
路と、前記電源回路と接続された駆動電源回路と、前記
電源回路と接続された定電流回路と、該定電流回路に接
続された高電圧定電流開閉素子とで構成された電流制御
回路と、一方が前記駆動電源回路と接続され、他方が前
記高電圧定電流開閉素子と接続されたスイッチ回路とを
備え、前記高電圧定電流開閉素子は、前記スイッチ回路
の開閉制御によりワイヤと放電電極間に常に定電流を供
給して一定のボール径を形成するように構成したもので
ある。According to the present invention, a high voltage is applied between the tip of a wire sent from the tip of a capillary and a discharge electrode to cause a discharge, and the discharge energy causes the tip of the wire to move. A ball forming apparatus for a wire bonder that melts to form balls, comprising: a power supply circuit; a drive power supply circuit connected to the power supply circuit; a constant current circuit connected to the power supply circuit; and a constant current circuit. A high-voltage constant current switching element connected to the current control circuit, one of which is connected to the drive power supply circuit, and the other is connected to the high-voltage constant current switching element of the switch circuit, The voltage constant current switching element is configured to constantly supply a constant current between the wire and the discharge electrode by the switching control of the switch circuit to form a constant ball diameter.
【０００９】[0009]
【実施例】次に、本発明に係るワイヤボンダー用ボール
形成装置の実施例を説明する。EXAMPLE An example of a ball bonder ball forming apparatus according to the present invention will be described below.
【００１０】図１は、本発明に係るワイヤボンダー用ボ
ール形成装置の回路の構成を示す図である。なお、図２
に示す従来装置の構成と同じ機能及び構成よりなるもの
は同じ符合を用いて説明する。FIG. 1 is a diagram showing a circuit configuration of a wire bonder ball forming apparatus according to the present invention. Note that FIG.
Elements having the same functions and configurations as those of the conventional apparatus shown in FIG.
【００１１】図１において、高電圧を発生する電源回路
１は、電流制御回路１２と接続されている。この電流制
御回路１２は、定電流回路１２ａと高電圧定電流開閉素
子１２ｂとで構成されている。定電流回路１２ａは、定
電流を生成して後段の高電圧定電流開閉素子１２ｂに供
給するものである。また、高電圧定電流開閉素子１２ｂ
は、従来の高電圧定電流素子２とほぼ同様の素子が使用
されているが、従来の高電圧定電流素子２は定電流制御
を行い、最大約１２００Ｖ程度の電圧は、後段のスイッ
チ回路５に加わっているのに対して、本実施例では高電
圧定電流開閉素子１２ｂに当該電圧がかけられている。
この高電圧定電流開閉素子１２ｂは、トランジスタ（又
はＦＥＴ）で構成されており、Ｅ2 端子はエミッタ（又
はソース）、Ｂ2 端子はベース（又はゲート）、Ｃ2 端
子はコレクタ（又はドレイン）である。前記Ｂ2 端子
は、電源回路１と電流制御回路１２との間に接続された
駆動電源回路１１を介してスイッチ回路５と接続されて
おり、これらによってループが形成されている。そし
て、このスイッチ回路５には、このスイッチ回路５を一
定時間オン／オフするタイマ６と接続されており、この
タイマ６は、トリガ信号Ｔｒによって駆動される構成と
なっている。また、高電圧定電流開閉素子１２ｂのＣ2
端子は、放電電極１０と接続されている。キャピラリ９
にはワイヤ８が挿通されており、クランパ７は、電源回
路１と接続されている。In FIG. 1, a power supply circuit 1 that generates a high voltage is connected to a current control circuit 12. The current control circuit 12 is composed of a constant current circuit 12a and a high voltage constant current switching element 12b. The constant current circuit 12a generates a constant current and supplies it to the high voltage constant current switching element 12b in the subsequent stage. Also, the high voltage constant current switching element 12b
The same device as the conventional high-voltage constant current device 2 is used, but the conventional high-voltage constant current device 2 performs constant current control, and a maximum voltage of about 1200 V is applied to the switch circuit 5 in the subsequent stage. In contrast to this, in the present embodiment, the voltage is applied to the high voltage constant current switching element 12b.
The high voltage constant current switching element 12b is composed of a transistor (or FET), an E 2 terminal is an emitter (or source), a B 2 terminal is a base (or gate), and a C 2 terminal is a collector (or drain). Is. The B 2 terminal is connected to the switch circuit 5 via the drive power supply circuit 11 connected between the power supply circuit 1 and the current control circuit 12, and a loop is formed by these. The switch circuit 5 is connected to a timer 6 that turns on / off the switch circuit 5 for a certain period of time, and the timer 6 is driven by a trigger signal Tr. In addition, C 2 of the high voltage constant current switching element 12b
The terminal is connected to the discharge electrode 10. Capillary 9
A wire 8 is inserted through the clamper 7, and the clamper 7 is connected to the power supply circuit 1.
【００１２】上記構成よりなる装置を用いてボールの形
成を行うには、外部からのトリガ信号Ｔｒによってタイ
マ６が駆動されてスイッチ回路５が駆動される。一方、
電流制御回路１２の定電流回路１２ａの後段の高電圧定
電流開閉素子１２ｂには、前記スイッチ回路５のスイッ
チが閉じてオンされ、高電圧定電流開閉素子１２ｂのＢ
2 端子がバイアスされて該素子１２ｂが駆動されてＥ2
とＣ2 端子間に電流が流れて最大約１２００Ｖ程度の電
圧が放電電極１０に印加される。そして、放電電極１０
とワイヤ８の先端との間で放電を起こさしめ、その放電
エネルギーＥによりワイヤ８の先端を溶融してボール状
に形成する。この時のＥ2 とＣ2 間に流れる電流はほぼ
一定の電流が流れている。そして、本実施例によれば、
放電電極１０とワイヤ８間での電極間距離の変化やスパ
ーク放電電極の酸化等によりスパーク放電が不安定にな
った場合であっても、高電圧定電流開閉素子１２ｂのス
イッチングが速やかになされるので、応答速度が早く位
相遅れ等のない高速スイッチングが可能となると共に装
置がシンプルになる。In order to form a ball using the apparatus having the above structure, the timer 6 is driven by the external trigger signal Tr and the switch circuit 5 is driven. on the other hand,
In the high voltage constant current switching element 12b in the subsequent stage of the constant current circuit 12a of the current control circuit 12, the switch of the switch circuit 5 is closed and turned on, and the high voltage constant current switching element 12b is turned on.
The two terminals are biased and the element 12b is driven to generate E 2
A current flows between the C 2 and C 2 terminals and a maximum voltage of about 1200 V is applied to the discharge electrode 10. And the discharge electrode 10
A discharge is caused between the wire 8 and the tip of the wire 8, and the discharge energy E melts the tip of the wire 8 to form a ball. The current flowing between E 2 and C 2 at this time is a substantially constant current. And according to this embodiment,
Even when the spark discharge becomes unstable due to a change in the electrode distance between the discharge electrode 10 and the wire 8 or oxidation of the spark discharge electrode, switching of the high voltage constant current switching element 12b is performed quickly. Therefore, the response speed is fast and high-speed switching without phase delay is possible and the device is simple.
【００１３】また、図３は、図１に示す装置によりワイ
ヤと放電電極間の電圧と電流値を測定した波形図であ
り、図４は、図２に示す装置によりワイヤと放電電極間
の電圧と電流値を測定した波形図である。図３及び図４
は、共に横軸を時間Ｔで示し、縦軸を電流Ｉ及び電圧Ｖ
の値を示したものであり、これらの図から明らかなよう
に図３に示す電流Ｉ及び電圧Ｖの値が、図４に示す従来
のものよりも放電開始時より安定して定電流制御されて
いることが明らかである。FIG. 3 is a waveform diagram in which the voltage and current value between the wire and the discharge electrode are measured by the device shown in FIG. 1, and FIG. 4 is the voltage between the wire and the discharge electrode by the device shown in FIG. It is a waveform diagram which measured the electric current value. 3 and 4
Shows the horizontal axis as time T and the vertical axis as current I and voltage V
As is clear from these figures, the values of the current I and the voltage V shown in FIG. 3 are controlled more stably than the conventional one shown in FIG. It is clear that
【００１４】[0014]
【発明の効果】以上のとおり、本発明によれば、応答速
度が早く高速スイッチングが可能となるので、ワイヤの
先端と放電電極との間のスパーク放電が不安定な場合で
あっても位相遅れ等がなく常に安定して定電流を供給す
ることができるので、ボール形成に必要な放電エネルギ
ーが常に一定に保たれ、ワイヤ先端に形成されるボール
径の大きさを均一化できる効果がある。As described above, according to the present invention, since the response speed is fast and high-speed switching is possible, even if the spark discharge between the tip of the wire and the discharge electrode is unstable, the phase delay occurs. Since a constant current can always be stably supplied without any problem, the discharge energy required for ball formation is always kept constant, and the diameter of the ball formed at the tip of the wire can be made uniform.
【図１】図１は、本発明に係るワイヤボンダー用ボール
形成装置の回路の構成を示す図である。FIG. 1 is a diagram showing a circuit configuration of a ball forming apparatus for a wire bonder according to the present invention.
【図２】図２は、従来のワイヤボンダー用ボール形成装
置の回路の構成を示す図である。FIG. 2 is a diagram showing a circuit configuration of a conventional wire bonder ball forming apparatus.
【図３】図３は、本発明に係る装置によるワイヤと放電
電極間の電圧と電流値を測定した波形図である。FIG. 3 is a waveform diagram in which voltage and current values between a wire and a discharge electrode are measured by the device according to the present invention.
【図４】図４は、従来の装置によるワイヤと放電電極間
の電圧と電流値を測定した波形図である。FIG. 4 is a waveform diagram of voltage and current values measured between a wire and a discharge electrode by a conventional device.
１ 電源回路 ５ スイッチ回路 １２ 電流制御回路 １２ａ 定電流回路 １２ｂ 高電圧定電流開閉素子 1 power supply circuit 5 switch circuit 12 current control circuit 12a constant current circuit 12b high voltage constant current switching element
Claims (1)
の先端と放電電極との間に高電圧を印加することにより
放電を起こさせ、その放電エネルギーによりワイヤの先
端部を溶融してボールを形成するワイヤボンダー用ボー
ル形成装置であって、 電源回路と、 前記電源回路と接続された駆動電源回路と、 前記電源回路と接続された定電流回路と、該定電流回路
に接続された高電圧定電流開閉素子とで構成された電流
制御回路と、 一方が前記駆動電源回路と接続され、他方が前記高電圧
定電流開閉素子と接続されたスイッチ回路とを備え、 前記高電圧定電流開閉素子は、前記スイッチ回路の開閉
制御によりワイヤと放電電極間に常に定電流を供給して
一定のボール径を形成するようにしたことを特徴とする
ワイヤボンダー用ボール形成装置。 1. A wire delivered from the tip of a capillary.
By applying a high voltage between the tip of the
A discharge is generated, and the discharge energy causes the tip of the wire to
Bow for wire bonder that melts ends to form balls
A power supply circuit, a drive power supply circuit connected to the power supply circuit, a constant current circuit connected to the power supply circuit, and the constant current circuit.
Current composed of high voltage constant current switching element connected to
A control circuit, one of which is connected to the drive power supply circuit and the other of which is the high voltage
A switching circuit connected to a constant current switching element, wherein the high-voltage constant current switching element is a switching circuit for the switching circuit.
A constant current is always supplied between the wire and the discharge electrode by control.
Characterized by forming a constant ball diameter
Ball forming device for wire bonder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3194982A JP2676437B2 (en) | 1991-07-10 | 1991-07-10 | Ball forming device for wire bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3194982A JP2676437B2 (en) | 1991-07-10 | 1991-07-10 | Ball forming device for wire bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0521500A JPH0521500A (en) | 1993-01-29 |
| JP2676437B2 true JP2676437B2 (en) | 1997-11-17 |
Family
ID=16333577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3194982A Expired - Fee Related JP2676437B2 (en) | 1991-07-10 | 1991-07-10 | Ball forming device for wire bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2676437B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51112890U (en) * | 1975-03-08 | 1976-09-13 | ||
| JP5120319B2 (en) | 2009-04-03 | 2013-01-16 | 株式会社デンソー | Engine waste heat control device |
| WO2016178285A1 (en) * | 2015-05-03 | 2016-11-10 | 株式会社カイジョー | Ball forming device for wire bonder |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6039840A (en) * | 1983-08-15 | 1985-03-01 | Shinkawa Ltd | Ball forming device for wire bonder |
-
1991
- 1991-07-10 JP JP3194982A patent/JP2676437B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0521500A (en) | 1993-01-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH04346448A (en) | Ball forming device for wire bonder use | |
| JP2676437B2 (en) | Ball forming device for wire bonder | |
| JP2002079704A (en) | Method and circuit for driving self scanning type light- emitting element array | |
| JPS6216537A (en) | Device for forming wire bonding ball | |
| JP2764664B2 (en) | Ball forming apparatus and method for wire bonder | |
| US4739142A (en) | Method of producing a wire bonding ball | |
| JP2904618B2 (en) | Ball forming device for wire bonder | |
| JP3932235B2 (en) | Ball forming apparatus and method for wire bonder | |
| JP2676438B2 (en) | Wire bonding apparatus and method | |
| JP2630887B2 (en) | Wire bonding equipment | |
| JPH10163242A (en) | Wire bonding method/device | |
| JP2630886B2 (en) | Wire bonding equipment | |
| JP2611899B2 (en) | Ball forming apparatus and method for wire bonder | |
| JP2611894B2 (en) | Wire bonding equipment | |
| JPH0521501A (en) | Device and method for detecting high frequency in wire bonding device | |
| JP2757237B2 (en) | Ball forming device for wire bonder | |
| JP3105477B2 (en) | Wire bonding equipment | |
| JP2696128B2 (en) | Ball forming apparatus and method for wire bonder | |
| JP2006041412A (en) | Ball forming device in wire bonder | |
| JPH0590324A (en) | Wire bonding device | |
| JP2758819B2 (en) | Wire bonding method | |
| JPS6156506A (en) | Signal output circuit | |
| JPH07183322A (en) | Device for producing uniform ball by electric-discharge machining | |
| JPH11233552A (en) | Wire bonding device | |
| JPS6017925A (en) | Ball forming device for wire bonder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |