JPH11233552A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPH11233552A
JPH11233552A JP10052869A JP5286998A JPH11233552A JP H11233552 A JPH11233552 A JP H11233552A JP 10052869 A JP10052869 A JP 10052869A JP 5286998 A JP5286998 A JP 5286998A JP H11233552 A JPH11233552 A JP H11233552A
Authority
JP
Japan
Prior art keywords
constant current
ball
discharge
bonding
time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10052869A
Other languages
Japanese (ja)
Inventor
Masanao Ura
正直 浦
Hidenori Sasahara
秀憲 笹原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP10052869A priority Critical patent/JPH11233552A/en
Publication of JPH11233552A publication Critical patent/JPH11233552A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To suppress the drop in the temperature of a ball until bonding after the ball at the tip of a wire is formed and to improve the reliability of bonding in a wire bonding device. SOLUTION: A constant current unit 2 which can set conduction time and a constant current value from outside is provided. A constant current value is switched in a range which does not exceed the constant current value at the time of forming the ball and the disconnection of weak discharge is continued for time which is previously set by a timer modulator after ball forming time by the timer 3 terminates. Thus, the drop in the temperature of the ball until bonding time is suppressed compared to a case when discharge stops after the ball is formed as in a former case and bonding is executed at the ball temperature higher than the former case. Thus, the alloying of a bonding junction face is made uniform and is stabilized. Then, an advantage that highly reliable bonding is executed is provided.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、電気トーチによる
火花放電でワイヤの先端にボールを形成し、このボール
部分をＩＣ等の電極パットへ圧着することによりボンデ
ィングを行うワイヤボンディング装置の技術分野に属す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the technical field of a wire bonding apparatus for forming a ball at the tip of a wire by spark discharge using an electric torch, and bonding the ball portion to an electrode pad such as an IC by bonding. Belong.

【０００２】[0002]

【従来の技術】図３に、ワイヤボンディング装置におけ
る従来の電気トーチによるボール形成のブロック図を示
す。直流高圧電源１で発生した直流高電圧は、グランド
側はクランパ７を介してワイヤ８へ印加され、反対側の
出力は定電流器１０および安定器５を介して電気トーチ
ロット６へ印加される。こうして高電圧が印加されると
ワイヤ８の先端と電気トーチロット６との間で一定時間
火花放電が発生しその放電熱でワイヤ８の先端が溶融し
て表面張力により球状となり、放電が終了するとワイヤ
８の先端にボールが形成される。定電流器１０は、ワイ
ヤ８の先端と電気トーチロット６との間隙（放電間隙）
が変化するなどして放電インピーダンスが変化しても放
電電流が予め設定した一定値になるように定電流化する
手段である。2. Description of the Related Art FIG. 3 shows a block diagram of a conventional electric torch for forming a ball in a wire bonding apparatus. The DC high voltage generated by the DC high-voltage power supply 1 is applied to the wire 8 via the clamper 7 on the ground side, and is applied to the electric torch lot 6 via the constant current regulator 10 and the ballast 5 on the opposite side. . When a high voltage is applied in this way, a spark discharge is generated for a fixed time between the tip of the wire 8 and the electric torch lot 6, and the tip of the wire 8 is melted by the discharge heat and becomes spherical due to surface tension. A ball is formed at the tip of the wire 8. The constant current device 10 has a gap (discharge gap) between the tip of the wire 8 and the electric torch lot 6.
This is a means for making the discharge current constant so that the discharge current becomes a predetermined constant value even if the discharge impedance changes due to a change in.

【０００３】また、高電圧を印加する時間はボール形成
に必要充分な時間を予め把握しておき、その時間だけ印
加するようにする。これは、放電開始トリガー信号がタ
イマ３に入力し、この信号を起動信号として、予め設定
した時間だけ定電流器１０を通電させる信号をタイマ３
から定電流器１０へ送ることによって行われる。安定器
５は火花放電を安定させる手段である。こうして、ワイ
ヤ８の先端に所定のボールが形成されると、電気トーチ
ロットが退避しキャピラリ９がボールを下にあるＩＣ１
１の電極パット１２へ圧着する。In addition, the time required to apply a high voltage is determined in advance so as to be necessary and sufficient for ball formation, and the voltage is applied only during that time. This is because a discharge start trigger signal is input to the timer 3, and a signal for energizing the constant current device 10 for a preset time is used as a start signal as a start signal.
To the constant current device 10. The ballast 5 is means for stabilizing the spark discharge. When a predetermined ball is formed at the end of the wire 8 in this manner, the electric torch lot is retracted, and the capillary 9 moves the IC 1 with the ball below.
One electrode pad 12 is pressed.

【０００４】[0004]

【発明が解決しようとする課題】以上説明したように、
従来技術では放電はタイマ３によって定まる時間だけ経
過して停止する。その後ＩＣ１１の電極パット１２へボ
ンディングするまでには時間の経過があり、この間はボ
ールの温度が低下してゆく。一方、電極パット１２への
ボンディングは、ボールが高温である程ボンディング接
合面の合金化が均一化及び安定化され信頼性の高いボン
ディングが行われる。このため、圧着加熱用の超音波を
印加したりもしている。従って、ボール形成後ボンディ
ングまでの間にボール温度が下がることはボンディング
の信頼性を下げることになるという問題がある。As described above,
In the prior art, the discharge stops after the time determined by the timer 3 has elapsed. After that, there is a lapse of time until bonding to the electrode pad 12 of the IC 11 occurs, during which time the temperature of the ball decreases. On the other hand, in the bonding to the electrode pad 12, the higher the temperature of the ball, the more uniform and stable the alloying of the bonding joint surface, and the more reliable the bonding. For this reason, ultrasonic waves for pressure bonding heating are also applied. Therefore, there is a problem that lowering the ball temperature during the period from ball formation to bonding lowers the reliability of bonding.

【０００５】本発明の目的は、上記従来技術の問題点に
鑑みて、ボール形成後温度が低下してしまうのを抑制す
るためにボール形成後も、放電を完全に停止してしまう
のではなく、ボール形成時の放電継続時間よりも短い時
間間隔で、ボール形成時の放電電流値以下での大きい放
電電流、小さい放電電流を交互に繰り返すような放電
を、予め設定した時間だけ繰り返させるようにしたワイ
ヤボンディング装置を提供することにある。SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, an object of the present invention is not to completely stop discharge even after forming a ball but to suppress a decrease in temperature after forming the ball. At a time interval shorter than the discharge continuation time at the time of ball formation, a discharge in which a large discharge current and a small discharge current at or below the discharge current value at the time of ball formation are alternately repeated is repeated for a preset time. To provide a wire bonding apparatus.

【０００６】[0006]

【課題を解決するための手段】本発明は、上記の目的を
達成するために以下の手段構成を有する。即ち、電気ト
ーチロットと、キャピラリから出ているボンディング用
ワイヤの先端との間に高電圧を印加し火花放電を発生さ
せその放電熱によってワイヤの先端を溶融させ表面張力
によりボールを形成させ、このボール部分をボンディン
グ対象であるＩＣ等の電極パットへボンディングするボ
ンディング装置であって、下記の各構成を有することを
特徴とするワイヤボンディング装置である。 （イ） 放電用の直流高電圧を発生する直流高圧電源 （ロ） 電気トーチロットとワイヤ先端間の放電インピ
ーダンスが変化しても、直流高圧電源から流れる電流が
一定になるようにする定電流回路を有し、外部からの制
御信号により定電流を流す時間幅およびその定電流値を
制御される定電流器 （ハ） 放電開始トリガー信号を受け、ボール形成に必
要な予め設定された時間長だけ予め設定された電流値の
定電流を流させるようにする第１の制御信号を定電流器
へ出力するタイマ （ニ） 第１の制御信号の終了後引き続きボールの保温
に必要な予め定めた一定時間の間、第１の制御信号の時
間幅より短い時間幅で、第１の制御信号時における定電
流値以下の値で定電流値を高低交互に切り替えを繰り返
す第２の制御信号を定電流器へ出力するタイマ変調器The present invention has the following means in order to achieve the above object. That is, a high voltage is applied between the electric torch lot and the tip of the bonding wire coming out of the capillary to generate a spark discharge, the tip of the wire is melted by the discharge heat, and a ball is formed by surface tension. A wire bonding apparatus for bonding a ball portion to an electrode pad of an IC or the like to be bonded, having the following configuration. (B) DC high-voltage power supply that generates a DC high voltage for discharge (b) Constant current circuit that keeps the current flowing from the DC high-voltage power supply constant even when the discharge impedance between the electric torch lot and the wire tip changes A constant current device having a constant current flowing therethrough and a constant current value controlled by an external control signal (c) receiving a discharge start trigger signal and receiving only a predetermined time length necessary for ball formation A timer for outputting a first control signal to the constant current device for causing a constant current of a preset current value to flow to the constant current device. (D) A predetermined constant necessary for keeping the ball warm after the end of the first control signal During the time, the second control signal that repeats the high and low switching of the constant current value at a value equal to or less than the constant current value at the time of the first control signal with a time width shorter than the time width of the first control signal is a constant current. Output to the container Ima modulator

【０００７】[0007]

【発明の実施の形態】本発明の実施の形態は、ボール形
成が繰り返し継続した場合に放電電流値が一定に揃うよ
うにするとともに１回のボール形成放電中においても、
放電電流値が一定になるようにしている定電流器を、通
電時間および通電時の一定電流値を、外部から制御でき
るようにし、外部にタイマとタイマ変調器を設け、タイ
マが放電開始トリガー信号を受けるとタイマに設定され
たボール形成のための放電時間Ｔ1 だけ定電流器が予め
設定された放電電流を流すように制御信号を定電流器へ
送り、ボール形成放電が終了した後は、タイマ変調器か
らＴ1 より短い時間間隔Ｔ2 で放電が完全に停止しない
程度に放電電流を下げ、次いでボール形成時の放電電流
値を越えない範囲で放電電流値を大きくし以下、予め設
定した時間の間、放電電流値の上げ下げを繰り返させる
というものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention is intended to make the discharge current value uniform when ball formation is repeated repeatedly, and to make the discharge current value even during one ball formation discharge.
A constant current device that keeps the discharge current value constant, a power supply time and a constant current value during power supply can be controlled from the outside, and a timer and a timer modulator are provided outside. the receiving the control signal so as to flow a discharge current to the discharge time T 1 by a constant current circuit is set in advance for the ball formation which is set in the timer sends to the constant current circuit, after the ball forming the discharge is completed, discharge timer modulator short time interval T 2 from T 1 from the lower the discharge current so as not to completely stop and then follows by increasing the discharge current value in a range that does not exceed the discharge current value during ball formation, preset During this time, the discharge current value is repeatedly raised and lowered.

【０００８】定電流器の通電時間や定電流値を制御する
こと自体は従来周知の技術で可能であるが、本発明は、
ボール形成放電の後に引き続いて、狭い時間間隔で放電
電流値を上げ下げ制御することにより、形成されたボー
ルの温度の低下を抑制するという点に特徴がある。Although it is possible to control the energizing time and the constant current value of the constant current device by a conventionally well-known technique, the present invention relates to:
It is characterized in that a decrease in the temperature of the formed ball is suppressed by raising and lowering the discharge current value at a narrow time interval after the ball forming discharge.

【０００９】[0009]

【実施例】以下、本発明のワイヤボンディング装置の実
施例を図面を参照して説明する。図１は、本発明のワイ
ヤボンディング装置の実施例の構成を示すブロック図で
ある。図３の従来例と異なる点は、タイマ変調器４が設
けられ、その出力する変調信号によって定電流器２の通
電時間およびその定電流値が制御される点である。タイ
マ３へ放電開始トリガー信号が入力されると、図２に示
すように、タイマ３に予め設定された時間幅Ｔ1 の間は
ボール形成に必要な一定電流値Ｉ1 を定電流器２に流さ
せる制御信号を送る。この時間幅Ｔ1 が終了するとこれ
を受けてタイマ変調器４がＴ1 より短い時間間隔ｔ1 で
定電流器２の定電流値をＩ2 とＩ3に交互に切り替える
制御信号を予め定められた時間幅Ｔ2 の間定電流器２へ
送る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the wire bonding apparatus according to the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing the configuration of an embodiment of the wire bonding apparatus of the present invention. The difference from the conventional example of FIG. 3 is that the timer modulator 4 is provided, and the energizing time of the constant current device 2 and the constant current value thereof are controlled by the modulation signal output from the timer modulator 4. When a discharge start trigger signal is input to the timer 3, as shown in FIG. 2, a constant current value I 1 necessary for ball formation is supplied to the constant current device 2 during a time width T 1 preset in the timer 3. Send a control signal to make it flow. Upon completion of this time width T 1, the timer modulator 4 receives this and sets a control signal for switching the constant current value of the constant current device 2 alternately between I 2 and I 3 at a time interval t 1 shorter than T 1. and sending time to the constant current circuit 2 between the width T 2.

【００１０】ここで、Ｔ1 およびＩ1 の設定は、ボール
形成時であり従来と同じと考えてよいが、ｔ1、Ｔ2、Ｉ2、
Ｉ3 は経験的に定められる。Ｉ2 は放電が完全に停止し
ない程度の小さな値であり、Ｉ3 はボール形成時の電流
値Ｉ1 を越えない値に設定される。こうしてボール形成
後も弱い火花放電を断続させることにより、ボールの温
度低下を抑制し、ボールのボンディングの信頼性を向上
させる。Here, T 1 and I 1 are set at the time of ball formation and may be considered to be the same as the conventional ones. However, t 1 , T 2 , I 2 ,
I 3 is determined empirically. I 2 is a small value at which discharge is not completely stopped, I 3 is set to a value that does not exceed the current value I 1 at the time of ball formation. In this way, the weak spark discharge is intermittently formed even after the formation of the ball, whereby the temperature drop of the ball is suppressed and the reliability of the bonding of the ball is improved.

【００１１】[0011]

【発明の効果】以上説明したように、本発明のワイヤボ
ンディング装置においては、火花放電によるボール形成
後も、予め設定した時間の間、時間の短い弱い放電を、
断続的に繰り返すようにしたので、従来のようにボール
形成後は放電が停止してしまう場合に較べ、ボンディン
グ時までのボールの温度低下が抑制され、従来より高い
ボール温度でボンディングが行われるのでボンディング
接合面の合金化が均一化及び安定化され信頼性の高いボ
ンディングが行われるという利点がある。As described above, in the wire bonding apparatus of the present invention, even after the ball is formed by the spark discharge, the weak discharge having a short time is maintained for a preset time.
Since the repetition is repeated intermittently, the temperature drop of the ball until bonding is suppressed compared to the case where the discharge stops after the ball is formed as in the past, and the bonding is performed at a higher ball temperature than before. There is an advantage that the alloying of the bonding surface is uniformized and stabilized, and highly reliable bonding is performed.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明のワイヤボンディング装置の実施例の構
成を示すブロック図である。FIG. 1 is a block diagram showing a configuration of an embodiment of a wire bonding apparatus according to the present invention.

【図２】本発明における定電流器の電流波形図である。FIG. 2 is a current waveform diagram of a constant current device according to the present invention.

【図３】従来のワイヤボンディング装置の構成を示すブ
ロック図である。FIG. 3 is a block diagram showing a configuration of a conventional wire bonding apparatus.

【符号の説明】[Explanation of symbols]

１ 直流高圧電源 ２ 定電流器 ３ タイマ ４ タイマ変調器 ５ 安定器 ６ 電気トーチロット ７ クランパ ８ ワイヤ ９ キャピラリ １０ 定電流器 １１ ＩＣ １２ 電極パット DESCRIPTION OF SYMBOLS 1 DC high-voltage power supply 2 Constant current device 3 Timer 4 Timer modulator 5 Ballast 6 Electric torch lot 7 Clamper 8 Wire 9 Capillary 10 Constant current device 11 IC 12 Electrode pad

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 電気トーチロットと、キャピラリから出
ているボンディング用ワイヤの先端との間に高電圧を印
加し火花放電を発生させその放電熱によってワイヤの先
端を溶融させ表面張力によりボールを形成させ、このボ
ール部分をボンディング対象であるＩＣ等の電極パット
へボンディングするボンディング装置であって、下記の
各構成を有することを特徴とするワイヤボンディング装
置。 （イ） 放電用の直流高電圧を発生する直流高圧電源 （ロ） 電気トーチロットとワイヤ先端間の放電インピ
ーダンスが変化しても、直流高圧電源から流れる電流が
一定になるようにする定電流回路を有し、外部からの制
御信号により定電流を流す時間幅およびその定電流値を
制御される定電流器 （ハ） 放電開始トリガー信号を受け、ボール形成に必
要な予め設定された時間長だけ予め設定された電流値の
定電流を流させるようにする第１の制御信号を定電流器
へ出力するタイマ （ニ） 第１の制御信号の終了後引き続きボールの保温
に必要な予め定めた一定時間の間、第１の制御信号の時
間幅より短い時間幅で、第１の制御信号時における定電
流値以下の値で定電流値を高低交互に切り替えを繰り返
す第２の制御信号を定電流器へ出力するタイマ変調器1. A high voltage is applied between an electric torch lot and a tip of a bonding wire coming out of a capillary to generate a spark discharge, and the discharge heat melts the tip of the wire to form a ball by surface tension. A bonding apparatus for bonding the ball portion to an electrode pad of an IC or the like to be bonded, the bonding apparatus having the following configurations. (B) DC high-voltage power supply that generates a DC high voltage for discharge (b) Constant current circuit that keeps the current flowing from the DC high-voltage power supply constant even when the discharge impedance between the electric torch lot and the wire tip changes A constant current device having a constant current flowing therethrough and a constant current value controlled by an external control signal (c) receiving a discharge start trigger signal and receiving only a predetermined time length necessary for ball formation A timer for outputting a first control signal to the constant current device for causing a constant current of a preset current value to flow to the constant current device. (D) A predetermined constant necessary for keeping the ball warm after the end of the first control signal During the time, the second control signal that repeats the high and low switching of the constant current value at a value equal to or less than the constant current value at the time of the first control signal with a time width shorter than the time width of the first control signal is a constant current. Output to the container Ima modulator
JP10052869A 1998-02-18 1998-02-18 Wire bonding device Pending JPH11233552A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10052869A JPH11233552A (en) 1998-02-18 1998-02-18 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10052869A JPH11233552A (en) 1998-02-18 1998-02-18 Wire bonding device

Publications (1)

Publication Number Publication Date
JPH11233552A true JPH11233552A (en) 1999-08-27

Family

ID=12926893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10052869A Pending JPH11233552A (en) 1998-02-18 1998-02-18 Wire bonding device

Country Status (1)

Country Link
JP (1) JPH11233552A (en)

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