JPS63136344U - - Google Patents
Info
- Publication number
- JPS63136344U JPS63136344U JP1987027816U JP2781687U JPS63136344U JP S63136344 U JPS63136344 U JP S63136344U JP 1987027816 U JP1987027816 U JP 1987027816U JP 2781687 U JP2781687 U JP 2781687U JP S63136344 U JPS63136344 U JP S63136344U
- Authority
- JP
- Japan
- Prior art keywords
- spacer
- base
- chip
- melting point
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000006850 spacer group Chemical group 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 239000005394 sealing glass Substances 0.000 claims 3
- 229910000510 noble metal Inorganic materials 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987027816U JPH0412682Y2 (cs) | 1987-02-26 | 1987-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987027816U JPH0412682Y2 (cs) | 1987-02-26 | 1987-02-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63136344U true JPS63136344U (cs) | 1988-09-07 |
| JPH0412682Y2 JPH0412682Y2 (cs) | 1992-03-26 |
Family
ID=30830201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987027816U Expired JPH0412682Y2 (cs) | 1987-02-26 | 1987-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412682Y2 (cs) |
-
1987
- 1987-02-26 JP JP1987027816U patent/JPH0412682Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0412682Y2 (cs) | 1992-03-26 |
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