JPS63134535U - - Google Patents

Info

Publication number
JPS63134535U
JPS63134535U JP1987025704U JP2570487U JPS63134535U JP S63134535 U JPS63134535 U JP S63134535U JP 1987025704 U JP1987025704 U JP 1987025704U JP 2570487 U JP2570487 U JP 2570487U JP S63134535 U JPS63134535 U JP S63134535U
Authority
JP
Japan
Prior art keywords
electrode
dry etching
heat dissipation
dissipation sheet
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987025704U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987025704U priority Critical patent/JPS63134535U/ja
Publication of JPS63134535U publication Critical patent/JPS63134535U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Drying Of Semiconductors (AREA)

Description

【図面の簡単な説明】
第１図ａおよびｂはそれぞれ本考案の一実施例
の平面図および部分拡大側面断面図、第２図は従
来の一例の部分拡大側面断面図である。 １……水冷電極、２……放熱シート、３……取
付ねじ、４……輪状磁石、５……ウエハーホルダ
、６……放熱シート、７……ウエハー、８……吸
着用磁石、９……取付リング、１０……冷却水管
、１１……爪。

Claims (1)

    【実用新案登録請求の範囲】
  1. 水冷電極と、この電極上に設置されるウエハー
    ホルダとからなり、複数個のウエハーを実装して
    ドライエツチングを行うためのドライエツチング
    電極において、前記ウエハーホルダが、複数個の
    円形窪みとその周囲に埋め込まれる輪状磁石とを
    有し、かつ前記水冷電極の上面に放熱シートを介
    してねじ締め可能な構造を有し、更に前記ウエハ
    ーを前記複数個の円形窪みに放熱シートを介して
    実装固定するために、下部に前記輪状磁石に対応
    する吸着用磁石を有する取付リングを設けたこと
    を特徴とするドライエツチング電極の構造。
JP1987025704U 1987-02-25 1987-02-25 Pending JPS63134535U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987025704U JPS63134535U (ja) 1987-02-25 1987-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987025704U JPS63134535U (ja) 1987-02-25 1987-02-25

Publications (1)

Publication Number Publication Date
JPS63134535U true JPS63134535U (ja) 1988-09-02

Family

ID=30826110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987025704U Pending JPS63134535U (ja) 1987-02-25 1987-02-25

Country Status (1)

Country Link
JP (1) JPS63134535U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04356921A (ja) * 1991-06-03 1992-12-10 Fujitsu Ltd ドライエッチング装置のウェハ保持盤
JP2012159161A (ja) * 2011-02-02 2012-08-23 Orion Machinery Co Ltd 軸受の内輪用ロックナット及び二軸回転ポンプ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04356921A (ja) * 1991-06-03 1992-12-10 Fujitsu Ltd ドライエッチング装置のウェハ保持盤
JP2012159161A (ja) * 2011-02-02 2012-08-23 Orion Machinery Co Ltd 軸受の内輪用ロックナット及び二軸回転ポンプ

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