JPS63131200U - - Google Patents
Info
- Publication number
- JPS63131200U JPS63131200U JP2301587U JP2301587U JPS63131200U JP S63131200 U JPS63131200 U JP S63131200U JP 2301587 U JP2301587 U JP 2301587U JP 2301587 U JP2301587 U JP 2301587U JP S63131200 U JPS63131200 U JP S63131200U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- metal
- metal substrates
- circuit elements
- conductive path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
は本実施例のケース材の正面図、第３図は第２図
の側面図、第４図乃至第６図は従来例を示す断面
図である。
１，２は金属基板、３，３′は絶縁フイルム、
４は導電路、５はケース材、６，７は外部リード
、８は保護フイルム、９はケース材の端部、１０
は金属ペースト膜、１１，１２は回路素子。
Fig. 1 is a sectional view showing an embodiment of the present invention, Fig. 2 is a front view of the case material of this embodiment, Fig. 3 is a side view of Fig. 2, and Figs. 4 to 6 show the conventional example. FIG. 1 and 2 are metal substrates, 3 and 3' are insulating films,
4 is a conductive path, 5 is a case material, 6 and 7 are external leads, 8 is a protective film, 9 is an end of the case material, 10
1 is a metal paste film, and 11 and 12 are circuit elements.
Claims (1)
連結する絶縁フイルムと、前記絶縁フイルム上に
形成された所望形状の導電路と、前記導電路上に
固着された複数の回路素子と、前記回路素子を対
向させて前記絶縁フイルムを折曲げて前記二枚の
金属基板を離間固着する金属のケース材と、前記
絶縁フイルムの折曲げ部上に設けられた金属ペー
スト膜とを備えたことを特徴とする混成集積回路
。 two metal substrates, an insulating film that connects the two metal substrates at a distance, a conductive path of a desired shape formed on the insulating film, a plurality of circuit elements fixed on the conductive path; A metal case material for separating and fixing the two metal substrates by bending the insulating film with the circuit elements facing each other, and a metal paste film provided on the bent portion of the insulating film. Features of hybrid integrated circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2301587U JPS63131200U (en) | 1987-02-19 | 1987-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2301587U JPS63131200U (en) | 1987-02-19 | 1987-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63131200U true JPS63131200U (en) | 1988-08-26 |
Family
ID=30820944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2301587U Pending JPS63131200U (en) | 1987-02-19 | 1987-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63131200U (en) |
-
1987
- 1987-02-19 JP JP2301587U patent/JPS63131200U/ja active Pending