JPS6312974Y2 - - Google Patents
Info
- Publication number
- JPS6312974Y2 JPS6312974Y2 JP4355879U JP4355879U JPS6312974Y2 JP S6312974 Y2 JPS6312974 Y2 JP S6312974Y2 JP 4355879 U JP4355879 U JP 4355879U JP 4355879 U JP4355879 U JP 4355879U JP S6312974 Y2 JPS6312974 Y2 JP S6312974Y2
- Authority
- JP
- Japan
- Prior art keywords
- tablet
- lever
- preheating
- resin
- control mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 21
- 239000011347 resin Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 9
- 238000001514 detection method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000009475 tablet pressing Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Control Of High-Frequency Heating Circuits (AREA)
- Constitution Of High-Frequency Heating (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4355879U JPS6312974Y2 (OSRAM) | 1979-04-04 | 1979-04-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4355879U JPS6312974Y2 (OSRAM) | 1979-04-04 | 1979-04-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55144007U JPS55144007U (OSRAM) | 1980-10-16 |
| JPS6312974Y2 true JPS6312974Y2 (OSRAM) | 1988-04-13 |
Family
ID=28918209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4355879U Expired JPS6312974Y2 (OSRAM) | 1979-04-04 | 1979-04-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6312974Y2 (OSRAM) |
-
1979
- 1979-04-04 JP JP4355879U patent/JPS6312974Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55144007U (OSRAM) | 1980-10-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0558889B2 (OSRAM) | ||
| JPS6312974Y2 (OSRAM) | ||
| US4322593A (en) | Apparatus for pre-heating resin tablet | |
| JP3795790B2 (ja) | 樹脂封止方法 | |
| JPH0581540B2 (OSRAM) | ||
| JP3446054B2 (ja) | シャットハイトの変動を補償する方法 | |
| JPS6023007B2 (ja) | 高周波予熱機 | |
| JPS59202813A (ja) | 封止用樹脂の予備加熱装置 | |
| JPH0518131Y2 (OSRAM) | ||
| JP2897204B2 (ja) | リードフレーム加熱装置 | |
| US1136076A (en) | Process of producing electrical heating devices. | |
| JPS58223540A (ja) | インサ−ト圧入装置 | |
| KR950000049Y1 (ko) | 몰드다이 | |
| JPH06132331A (ja) | 半導体封止金型 | |
| KR0139128Y1 (ko) | 반도체패키지 제조용 몰딩프레스의 금형장치 | |
| JPH0242655B2 (OSRAM) | ||
| KR0139127Y1 (ko) | 반도체패키지 제조용 몰딩프레스의 금형 발열장치 | |
| JPS62150Y2 (OSRAM) | ||
| JPH07330359A (ja) | ガラス容器の成形方法 | |
| JPS5935773Y2 (ja) | 可撓性容器内の圧力検出装置 | |
| JPS6030978Y2 (ja) | 曲げ成形用金型 | |
| JP2003226528A (ja) | レンズ素子の成形装置及びその成形方法 | |
| JPS6032900Y2 (ja) | プレス用曲げ型における素材の供給検出装置 | |
| KR0157100B1 (ko) | 반도체밀봉금형 | |
| JPS6240296B2 (OSRAM) |