JPS6312777U - - Google Patents
Info
- Publication number
- JPS6312777U JPS6312777U JP10615986U JP10615986U JPS6312777U JP S6312777 U JPS6312777 U JP S6312777U JP 10615986 U JP10615986 U JP 10615986U JP 10615986 U JP10615986 U JP 10615986U JP S6312777 U JPS6312777 U JP S6312777U
- Authority
- JP
- Japan
- Prior art keywords
- board
- pin
- probe
- frame
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 claims description 33
- 238000007689 inspection Methods 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
第１図は本考案の回路基板検査装置の一例の後
部の縦断側面図、第２図は同一部縦断して示す正
面図、第３図は第２図の一部の拡大図、第４図は
回路基板検査装置における圧縮ばねによる支持部
分を主として示す説明図、第５図は第２図の一部
省略平面図、第６図は第５図の―線断面部分
図、第７図は部品をさらに追加して示す第５図と
同様な平面図、第８図は回路基板検査装置の前部
の側面図である。
１……支持ベース、２……案内支柱、３……天
板、４……装置の枠体、Ｂ１……上部プローブボ
ード、Ｂ２……下部プローブボード、６……上部
プローブボード装着枠、８……下向きのコンタク
トプローブ、９……下部プローブボード装着枠、
１５……上向きのコンタクトプローブ、Ｐ……回
路基板、１７……回路基板保持枠、２０……ガイ
ド、２１……ロツド、２２……摺動板、２３……
位置決め用ピン、４０，４１，４３，４４……ガ
イドピン、４２，４５……コイルばね、５０……
押上げ装置、５２……レバー、６０……張出し部
、ＰＢ１……第１ピンボード、ＰＢ２……第２ピ
ンボード、ＰＢ３……第３ピンボード、ＰＢ４…
…第４ピンボード、６１，６４，８０，８４……
導通ピン、６２，７０，８１，８６……コード、
６５……ガイドロツド、６６……圧下板、６８…
…圧下カム、６９……圧下ハンドル。
Fig. 1 is a longitudinal sectional side view of the rear part of an example of the circuit board inspection device of the present invention, Fig. 2 is a longitudinal sectional front view of the same part, Fig. 3 is an enlarged view of a part of Fig. 2, and Fig. 4 is an explanatory diagram mainly showing the support part by the compression spring in the circuit board inspection device, FIG. 5 is a partially omitted plan view of FIG. FIG. 8 is a side view of the front part of the circuit board inspection apparatus. DESCRIPTION OF SYMBOLS 1...Support base, 2...Guiding column, 3...Top plate, 4...Device frame, B1 ...Upper probe board, B2 ...Lower probe board, 6...Upper probe board mounting frame , 8...Downward contact probe, 9...Lower probe board mounting frame,
15... upward contact probe, P... circuit board, 17... circuit board holding frame, 20... guide, 21... rod, 22... sliding plate, 23...
Positioning pin, 40, 41, 43, 44... Guide pin, 42, 45... Coil spring, 50...
Push-up device, 52... lever, 60... overhang, PB 1 ... first pin board, PB 2 ... second pin board, PB 3 ... third pin board, PB 4 ...
...4th pin board, 61, 64, 80, 84...
Conduction pin, 62, 70, 81, 86... code,
65... Guide rod, 66... Reduction plate, 68...
...Reduction cam, 69...Reduction handle.
Claims (1)
支柱の上部に天板を取付けて構成した検査装置の
枠体を備え、前記天板の下側には、下向きのピン
状コンタクトプローブを有する上部プローブボー
ドを枠体外に取出し自在に装着し、一方、枠体内
の下側空間には、前記案内支柱に沿つて上下方向
に移動可能に下部プローブボード装着枠を設け、
この装着枠の上部に、上向きのピン状コンタクト
プローブを有する下部プローブボードを装置の枠
体外に取出し自在に装着し、前記上部プローブボ
ードと下部プローブボードの間には、両プローブ
ボードに平行に両面回路基板を着脱自在に支持す
る回路基板保持枠を前記案内支柱に沿つて上下に
移動可能に設け、検査装置枠体の底部には、検査
時に前記下部プローブボード装着枠を上方へ押上
げて、下部プローブボードのコンタクトプローブ
を回路基板の下面に接触させるとともに下部プロ
ーブボード装着枠を介して回路基板保持枠をも押
上げて回路基板の上面を上部プローブボードのコ
ンタクトプローブに接触させる押上げ装置を設け
、上部プローブボードの一部には、多数の導通ピ
ンを上下方向に装着した第１ピンボードを固設し
て、上部プローブボードの各コンタクトプローブ
の基部を第１ピンボードの各導通ピンに配線によ
り接続し、上部プローブボードと共に第１ピンボ
ードもその配線と共に装置の枠体外に取出しうる
ようにし、装置の枠体には、第１ピンボードの上
方に対向して第１ピンボードに向かつて下降自在
に第２ピンボードを装着し、この第２ピンボード
にはその下降時に第１ピンボードの導通ピンの各
々の上端に電気的に接触する多数の導通ピンを上
下方向に装着し、第２ピンボードの導通ピンを、
それぞれ、検査機器に連なるコネクタに配線によ
り接続し、一方、下部プローブボードの一部には
、多数の導通ピンを上下方向に装着した第３ピン
ボードを固設して、下部プローブボードの各コン
タクトプローブの基部を第３ピンボードの各導通
ピンに配線により接続し、下部プローブボードと
共に第３ピンボードもその配線と共に装置の枠体
外に取出しうるようにし、装置の枠体には、第３
ピンボードの上方に対向して第４ピンボードを固
着し、この第４ピンボードには、下部プローブボ
ードの上昇時に第３ピンボードの導通ピンの各々
の上端に電気的に接触する多数の導通ピンを上下
方向に装着し、第４ピンボードの導通ピンを、そ
れぞれ、検査機器に連なるコネクタに配線により
接続してなる回路基板検査装置。 ２ 上部および下部プローブボードを装置の枠体
外に水平方向に引出し可能としてなる実用新案登
録請求の範囲第１項記載の回路基板検査装置。 ３ 第１ピンボードを、上部プローブボードの後
部両側に設け、第２ピンボードを天板に上下に移
動自在に支持してなる実用新案登録請求の範囲第
１項記載の回路基板検査装置。 ４ 第１ピンボードを上部プローブボードより高
い位置に設けてなる実用新案登録請求の範囲第３
項記載の回路基板検査装置。 ５ 第３ピンボードを、下部プローブボードの後
方中央部に第１ピンボードと上下方向に重ならな
い位置に設け、第４ピンボードを天板によりその
下方に支持してなる実用新案登録請求の範囲第３
項記載の回路基板検査装置。[Claims for Utility Model Registration] 1. A frame body of an inspection device configured by installing a plurality of guide columns on a support base and attaching a top plate to the upper part of the guide columns, the lower side of the top plate having: An upper probe board having a pin-shaped contact probe pointing downward is removably attached to the outside of the frame, while a lower probe board mounting frame is provided in the lower space of the frame so as to be movable in the vertical direction along the guide column. established,
A lower probe board having an upward pin-shaped contact probe is attached to the upper part of this mounting frame so that it can be freely removed from the outside of the device frame, and between the upper probe board and the lower probe board, both sides are placed parallel to both probe boards. A circuit board holding frame for removably supporting a circuit board is provided so as to be movable up and down along the guide column, and a circuit board holding frame is provided at the bottom of the inspection device frame for pushing up the lower probe board mounting frame during inspection. A push-up device that brings the contact probes of the lower probe board into contact with the lower surface of the circuit board and also pushes up the circuit board holding frame via the lower probe board mounting frame to bring the upper surface of the circuit board into contact with the contact probes of the upper probe board. A first pin board, on which a number of conductive pins are installed vertically, is fixed on a part of the upper probe board, and the base of each contact probe on the upper probe board is connected to each conductive pin on the first pin board. The connection is made by wiring, and the first pin board as well as the upper probe board can be taken out of the frame of the device together with the wiring. Once a second pin board was installed so that it could be freely lowered, and a number of conductive pins were installed in the vertical direction on this second pin board to electrically contact the upper ends of each of the conductive pins of the first pin board when the second pin board was lowered, Connect the conduction pin of the second pin board,
Each is connected by wiring to a connector connected to the test equipment, while a third pin board with a large number of conductive pins mounted vertically is fixed on a part of the lower probe board, and each contact on the lower probe board The base of the probe is connected to each conduction pin of the third pin board by wiring, so that the third pin board as well as the lower probe board can be taken out of the frame of the device together with its wiring.
A fourth pin board is secured above and oppositely to the pin board, and the fourth pin board has a number of conductors that electrically contact the upper ends of each of the conductive pins of the third pin board when the lower probe board is raised. A circuit board inspection device in which pins are installed in the vertical direction and the conduction pins of the fourth pin board are connected by wiring to connectors connected to inspection equipment. 2. The circuit board inspection device according to claim 1, wherein the upper and lower probe boards can be horizontally pulled out of the frame of the device. 3. The circuit board inspection apparatus according to claim 1, wherein the first pin board is provided on both sides of the rear of the upper probe board, and the second pin board is supported on the top plate so as to be movable up and down. 4 Claim No. 3 for utility model registration in which the first pin board is provided at a higher position than the upper probe board
The circuit board inspection device described in Section 1. 5. A claim for utility model registration in which a third pin board is provided at the rear central part of the lower probe board in a position that does not overlap with the first pin board in the vertical direction, and the fourth pin board is supported below by a top plate. Third
The circuit board inspection device described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10615986U JPH048381Y2 (en) | 1986-07-10 | 1986-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10615986U JPH048381Y2 (en) | 1986-07-10 | 1986-07-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6312777U true JPS6312777U (en) | 1988-01-27 |
| JPH048381Y2 JPH048381Y2 (en) | 1992-03-03 |
Family
ID=30981264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10615986U Expired JPH048381Y2 (en) | 1986-07-10 | 1986-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH048381Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01131178U (en) * | 1988-02-29 | 1989-09-06 | ||
| JP2003014806A (en) * | 2001-06-27 | 2003-01-15 | Onishi Denshi Kk | Inspection jig for printed-wiring board |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE20080209U1 (en) | 1999-09-28 | 2001-08-09 | Immersion Corp | Control of haptic sensations for interface devices with vibrotactile feedback |
| US7159008B1 (en) | 2000-06-30 | 2007-01-02 | Immersion Corporation | Chat interface with haptic feedback functionality |
| CN1571989B (en) | 2001-10-23 | 2012-04-04 | 伊梅森公司 | Method of using tactile feedback to deliver silent status information to a user of an electronic device |
| US7505030B2 (en) | 2004-03-18 | 2009-03-17 | Immersion Medical, Inc. | Medical device and procedure simulation |
| US8315652B2 (en) | 2007-05-18 | 2012-11-20 | Immersion Corporation | Haptically enabled messaging |
| US9582178B2 (en) | 2011-11-07 | 2017-02-28 | Immersion Corporation | Systems and methods for multi-pressure interaction on touch-sensitive surfaces |
| US9245428B2 (en) | 2012-08-02 | 2016-01-26 | Immersion Corporation | Systems and methods for haptic remote control gaming |
-
1986
- 1986-07-10 JP JP10615986U patent/JPH048381Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01131178U (en) * | 1988-02-29 | 1989-09-06 | ||
| JP2003014806A (en) * | 2001-06-27 | 2003-01-15 | Onishi Denshi Kk | Inspection jig for printed-wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH048381Y2 (en) | 1992-03-03 |
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