CN218213295U

CN218213295U - Microelectronic assembly test tool

Info

Publication number: CN218213295U
Application number: CN202222229207.9U
Authority: CN
Inventors: 胥思炀; 袁杰; 王玉宝
Original assignee: Shanghai Kuaitie Electronics Co ltd
Current assignee: Shanghai Kuaitie Electronics Co ltd
Priority date: 2022-08-23
Filing date: 2022-08-23
Publication date: 2023-01-03
Anticipated expiration: 2032-08-23

Abstract

The utility model belongs to the technical field of microelectronic component test technique and specifically relates to a microelectronic component test fixture is related to, including setting up in the testboard of microelectronic component detector, the top is fixed with a plurality of test probes on the testboard, it is provided with the backup pad to go up and down on the testboard, be provided with the elastic support subassembly that supports the backup pad on the testboard, the detection groove of placing microelectronic component is seted up at the backup pad top, set up a plurality of inspection holes that supply test probe to wear to establish on the cell wall in detection groove, the top of inspection hole is higher than test probe's top, the backup pad top goes up and down to be provided with and presses the pressure of holding to microelectronic component and hold the board, set up the drive on the testboard and press the elevating system who holds board lift removal. When the microelectronic assembly is installed on the circuit tester, the coaxiality of the test point hole and the detection probe on the microelectronic assembly is improved, and the test accuracy of the microelectronic assembly is improved.

Description

Microelectronic assembly test tool

Technical Field

The application relates to the technical field of microelectronic component testing, in particular to a microelectronic component testing tool.

Background

The PCBA is also called as a microelectronic component, that is, the PCB blank board is processed by SMT (surface mount technology) or by the whole process of DIP (dual in-line package).

In the production process, the microelectronic assembly needs to be subjected to circuit detection, and in the related art, a microelectronic assembly tester is adopted to detect the microelectronic assembly by using a software program. When the microelectronic assembly is detected, a worker places the microelectronic assembly on the test board and presses the microelectronic assembly, so that the detection probes penetrate through test point holes of the microelectronic assembly to realize the electrical connection between the microelectronic assembly and the microelectronic assembly tester, and the microelectronic assembly tester detects the microelectronic assembly by using a software program and feeds back a detection result to a computer.

In view of the above-mentioned related art, the inventor believes that when testing a microelectronic assembly, the microelectronic assembly needs to be pressed so that the detection probes penetrate through test point holes of the microelectronic assembly. Because the test point hole of little electronic component has a lot, and the quantity that corresponds test probe is the same with the test point hole, at the in-process of artificially pressing little electronic component, can't guarantee test point hole and test probe axis axiality, when the axis deviation of test point hole and test probe is too much, bad contact appears easily between test point hole and the test probe, influences test point hole and test probe electricity connection effect to influence the accuracy of little electronic component test effect.

SUMMERY OF THE UTILITY MODEL

When installing microelectronic component on the circuit tester, in order to improve the test point hole on the microelectronic component and the axiality of test probe, this application provides a microelectronic component test fixture.

The application provides a microelectronic component test fixture adopts following technical scheme:

the utility model provides a microelectronic component test fixture, is fixed with a plurality of test probes including setting up in the testboard of microelectronic component detector at the top on the testboard, the ascending and descending of testboard is provided with the backup pad, be provided with the elastic support subassembly that supports the backup pad on the testboard, the detection groove of placing microelectronic component is seted up at the backup pad top, set up a plurality of inspection holes that supply test probe to wear to establish on the cell wall in detection groove, the top of inspection hole is higher than test probe's top, the backup pad top goes up and down to be provided with and presses the pressure of holding to microelectronic component and hold the board, set up on the testboard and drive the elevating system who presses the lift of holding the board and move.

By adopting the technical scheme, when the microelectronic assembly is detected, the microelectronic assembly is placed in the detection groove, and the detection groove positions the microelectronic assembly, so that the detection probe is positioned right above the test point hole on the microelectronic assembly. The lifting mechanism drives the pressing and holding plate to move towards the microelectronic assembly, downward acting force is applied to the microelectronic assembly, the microelectronic assembly and the supporting plate synchronously descend under the pressing and holding effect of the pressing and holding plate, the top of the detection probe is higher than the top of the detection hole in the descending process of the supporting plate, the detection probe penetrates through the detection hole, and the microelectronic assembly is electrically connected with the detection probe. The process improves the coaxiality of the detection probe and the test point hole, improves the electric connection effect of the test point hole and the detection probe, and improves the test accuracy of the microelectronic assembly. After the microelectronic assembly is tested, the pressing and holding plate is lifted, and the supporting plate is driven to reset under the action of the elastic supporting assembly.

Preferably, one side of the pressing plate, which is close to the support plate, is provided with a plurality of first ejector rods for pressing and holding the top of the microelectronic assembly, and the bottom ends of the plurality of first ejector rods are located at the same water level.

By adopting the technical scheme, when the microelectronic assembly is pressed and held, the plurality of first ejector rods exert the pressing and holding force on the microelectronic assembly, the plurality of first ejector rods improve the pressing and holding force points on the microelectronic assembly, and the stability of the microelectronic assembly in the downward moving process is improved. The end parts of the first ejector rods are located at the same horizontal height, so that when the first ejector rods press and hold the microelectronic assembly, the axis of the test point hole in the downward moving process of the microelectronic assembly is not prone to shifting, and the coaxiality of the test point hole in the microelectronic assembly and the detection probe can be improved.

Preferably, one side of the pressing plate close to the support plate is provided with a plurality of second ejector rods for pressing and holding the top of the support plate, and the bottom ends of the plurality of second ejector rods are located at the same horizontal height.

Through adopting above-mentioned technical scheme, when pressing and holding the microelectronic assembly, first ejector pin is pressed and is held the microelectronic assembly, and the second ejector pin is pressed and is held the backup pad, and under the combined action of first ejector pin and second ejector pin, microelectronic assembly and backup pad can synchronous motion, have improved microelectronic assembly at the stationarity of removal in-process.

Preferably, the first ejector rod and the second ejector rod are detachably mounted on the pressing plate, and a fastening piece for fixing the first ejector rod and the second ejector rod on the pressing plate is arranged on the pressing plate.

Through adopting above-mentioned technical scheme, first ejector pin and second ejector pin pass through fastener demountable installation on pressing the board, are convenient for change first ejector pin and second ejector pin.

Preferably, elevating system includes support frame, operation panel, connecting plate, lifter and uide bushing, be provided with the fixed plate on the testboard, the support frame is fixed in the fixed plate, the operation panel articulate in the support frame, the connecting plate articulate in the operation panel, the uide bushing is fixed in the support frame, the lifter wears to locate the uide bushing, the axis of uide bushing and lifter all follows vertical direction, it is fixed in to press the board to hold on the lifter, the connecting plate articulate in the lifter, the operation panel with the articulated axis of support frame the operation panel with the articulated axis of connecting plate the connecting plate with the articulated axis of lifter all follows horizontal direction, and a plurality of articulated axes are parallel to each other.

Through adopting above-mentioned technical scheme, when the board was removed to control pressure, along vertical direction rotation operation board, drive the connecting plate and remove, when the connecting plate removed, drive the lifter and remove, the uide bushing formed the direction to the lifter for the lifter slides along vertical direction, and the lifter drives the pressure at the removal in-process and holds the board and remove.

Preferably, the test board is provided with a plurality of guide posts, the axes of the guide posts are along the vertical direction, and the guide posts penetrate through the pressing and holding plate.

Through adopting above-mentioned technical scheme, the guide post forms the direction to pressing the slip of holding the board for the board is held in the pressure and is difficult to appear the skew at the in-process that holds the microelectronic assembly, has improved the pressure that holds the board and hold the effect to microelectronic assembly.

Preferably, the elastic support component comprises a plurality of sliding rods and a plurality of support springs, the sliding rods are fixed to the bottom of the support plate, a plurality of sliding holes are formed in the test board, the sliding rods slide in the sliding holes, the support springs are sleeved on the sliding rods, and two ends of each support spring are respectively abutted to the support plate and the test board.

Through adopting above-mentioned technical scheme, supporting spring exerts elastic support power to the backup pad, when pressing the board and pressing the microelectronic component and holding, the slide bar slides in the sliding hole, and supporting spring produces deformation. After the microelectronic assembly is tested, the pressing plate is lifted, and the supporting plate is reset under the action of the supporting spring.

Preferably, the bottom of the sliding rod is provided with a limiting plate, and the limiting plate abuts against the side wall, far away from the supporting plate, of the test bench.

Through adopting above-mentioned technical scheme, when the backup pad was not held by the pressure, under supporting spring's effect for the limiting plate butt forms spacingly to the backup pad in the testboard, and this height is the initial height of backup pad, and this height is the height after the backup pad resets.

In summary, the present application includes at least one of the following beneficial technical effects:

1. when the microelectronic assembly is detected, the microelectronic assembly is placed in the detection groove, and the detection groove positions the microelectronic assembly, so that the detection probe is positioned right above the test point hole in the microelectronic assembly. Elevating system drives to press and holds the board and remove towards microelectronic component, applys decurrent effort to microelectronic component, holds under the effect at the pressure of pressing holding the board, and microelectronic component and backup pad descend in step, and the in-process that the backup pad descends, the top of test probe is higher than the top of inspection hole, and test point is downthehole to the test probe wears to locate, and microelectronic component is connected with the test probe electricity. The process improves the coaxiality of the detection probe and the test point hole, improves the electric connection effect of the test point hole and the detection probe, and improves the test accuracy of the microelectronic assembly;

2. through setting up first ejector pin and second ejector pin, when pressing and holding microelectronic component, first ejector pin is pressed and is held microelectronic component, the second ejector pin is pressed and is held the backup pad, under the combined action of first ejector pin and second ejector pin, microelectronic component and backup pad can synchronous motion, make microelectronic component shift the difficult skew that appears in the axis in-process test point hole that moves down, can improve the test point hole on the microelectronic component and detect probe's axiality.

Drawings

FIG. 1 is a schematic view showing the overall structure of the present embodiment;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

FIG. 3 is a sectional view showing the structure of the elastic support member according to the present embodiment;

fig. 4 is a partially enlarged view of fig. 3 at B.

Reference numerals: 1. a test bench; 2. detecting the probe; 3. a support plate; 4. an elastic support member; 41. a slide bar; 42. a support spring; 5. a detection tank; 6. a detection hole; 7. pressing and holding the plate; 8. a lifting mechanism; 81. a support frame; 82. an operation panel; 83. a connecting plate; 84. a lifting rod; 85. a guide sleeve; 9. a first ejector rod; 10. a second ejector rod; 11. a fastener; 12. a fixing plate; 13. a guide post; 14. a sliding hole; 15. and a limiting plate.

Detailed Description

The present application is described in further detail below with reference to figures 1-4.

The embodiment of the application discloses a microelectronic assembly test tool.

Referring to fig. 1 and 2, a microelectronic assembly testing tool includes a testing table 1 installed on a microelectronic assembly tester, a plurality of detecting probes 2 are fixed on the testing table 1, and the axes of the detecting probes 2 are vertical. The supporting plate 3 is installed above the test board 1 in a lifting mode, and an elastic supporting component 4 for supporting the supporting plate 3 is arranged between the test board 1 and the supporting plate 3. The detection groove 5 of joint microelectronic component is seted up at the top of backup pad 3, and a plurality of inspection holes 6 have been seted up along vertical direction on backup pad 3 is located the cell wall that detects groove 5, inspection hole 6 and 2 one-to-one of detecting probe, and corresponding detecting probe 2 wears to locate in inspection hole 6, and detecting probe 2's top height is slightly less than the top of inspection hole 6.

Referring to fig. 1 and 2, a pressing plate 7 for pressing and holding the microelectronic assembly is installed above the supporting plate 3 in a lifting manner, and a lifting mechanism 8 for controlling the pressing plate 7 to move in the vertical direction is installed on the test platform 1. The bottom of the pressing plate 7 is detachably provided with a plurality of first ejector rods 9 for pressing and holding the microelectronic assembly and a plurality of second ejector rods 10 for pressing and holding the support plate 3, the first ejector rods 9 and the second ejector rods 10 are fixed on the pressing plate 7 through fasteners 11, and the fasteners 11 are bolts in the embodiment. The lower ends of the first push rods 9 are located at the same horizontal height, the lower ends of the second push rods 10 are located at the same horizontal height, and the height of the bottom ends of the first push rods 9 is slightly higher than that of the bottom ends of the second push rods 10.

When detecting microelectronic component, with microelectronic component joint in detecting groove 5, and the height at microelectronic component top is a little more than 3 top surfaces of backup pad, detection probe 2 is located microelectronic component and goes up under the test hole. The pressing plate 7 is controlled to move downwards by the lifting mechanism 8, so that the first ejector rod 9 abuts against the top surface of the microelectronic component, and the second ejector rod 10 abuts against the top surface of the supporting plate 3 synchronously. The pressing plate 7 moves downwards continuously, and the supporting plate 3 is driven to move downwards stably under the common action of the first ejector rod 9 and the second ejector rod 10. In-process that backup pad 3 descends, the top of detecting probe 2 is higher than the top of inspection hole 6, and in the test point hole was worn to locate by detecting probe 2, microelectronic component was connected with detecting probe 2 electricity. The process improves the coaxiality of the detection probe 2 and the test point hole, improves the electric connection effect of the test point hole and the detection probe 2, and improves the test accuracy of the microelectronic assembly.

Referring to fig. 1, the lifting mechanism 8 includes a supporting frame 81, an operating plate 82, a connecting plate 83, a lifting rod 84 and a guide sleeve 85, the fixed plate 12 is fixed on the test platform 1, the supporting frame 81 is fixed on the fixed plate 12, the operating plate 82 is an L-shaped plate, and the operating plate 82 is hinged on the supporting frame 81. The guide sleeve 85 is welded on the support frame 81, the axis of the guide sleeve 85 is vertical, the lifting rod 84 penetrates through the guide sleeve 85, and the bottom end of the lifting rod 84 is fixed with the top of the pressing plate 7 through a bolt. Both ends of the connecting plate 83 are hinged to the top of the operating plate 82 and the lift lever 84, respectively. The hinge axes of the operating plate 82 and the support bracket 81, the hinge axes of the operating plate 82 and the connecting plate 83, and the hinge axis between the connecting plate 83 and the lift lever 84 are parallel to each other, and all three hinge axes are in the horizontal direction.

When the staff is controlling the pressure plate 7 to move up and down, the staff rotates the operation plate 82 to drive the connecting plate 83 to move, so that the lifting rod 84 is moved, and under the guiding action of the guide sleeve 85, the lifting rod 84 slides along the vertical direction, thereby driving the pressure plate 7 to move up and down. In order to further improve the moving stability of the pressing and holding plate 7, two guide posts 13 are fixed on the test board 1, the axis of each guide post 13 is vertical, the two guide posts 13 penetrate through the pressing and holding plate 7, and the guide posts 13 enable the pressing and holding plate 7 to be difficult to deviate in the lifting process.

Referring to fig. 3 and 4, the elastic support assembly 4 includes four sliding rods 41 and four support springs 42, the top ends of the sliding rods 41 are screwed into the holding plate 7, and the four sliding rods 41 are distributed at four corners of the holding plate 7. The top of the test bench 1 is provided with four sliding holes 14 matched with the sliding rods 41 in the vertical direction, and the sliding rods 41 slide in the sliding holes 14. The inside of testboard 1 has the space that slides of slide bar 41, and the bottom mounting of slide bar 41 has limiting plate 15, and limiting plate 15 is inside testboard 1, and the lateral wall that the backup pad 3 was kept away from in testboard 1 butt limiting plate 15 top. The four supporting springs 42 are respectively sleeved on the four sliding rods 41, and two ends of the supporting springs 42 respectively abut against the test board 1 and the supporting board 3.

The supporting spring 42 is in a compressed state, when the supporting plate 3 is not pressed, the limiting plate 15 abuts against the test board 1 under the action of the elastic force of the supporting spring 42 to limit the supporting plate 3, and the height of the supporting plate 3 at the moment is the initial height. When the support plate 3 is pressed, the support plate 3 moves downward, the slide rod 41 slides in the slide hole 14, and the support plate 3 slides in the space inside the test stand 1. When the supporting plate 3 is released from being pressed, the supporting spring 42 drives the supporting plate 3 to return, so that the limiting plate 15 is abutted to the test platform 1 again, i.e. the supporting plate 3 is restored to the initial height.

The implementation principle of the microelectronic assembly test tool in the embodiment of the application is as follows: when detecting the microelectronic assembly, the microelectronic assembly is clamped in the detection groove 5, the operator rotates the operation plate 82 to drive the pressing plate 7 to move downwards, so that the first ejector rods 9 act on the top surface of the microelectronic assembly, the second ejector rods 10 act on the top surface of the supporting plate 3 synchronously, the first ejector rods 9 and the second ejector rods 10 press and hold the microelectronic assembly and the supporting plate 3, and the supporting plate 3 and the microelectronic assembly are driven to move downwards synchronously. In-process that backup pad 3 descends, the top of detecting probe 2 is higher than the top of inspection hole 6 gradually, and it is downthehole that the test point is worn to locate by detecting probe 2, and microelectronic component is connected with detecting probe 2 electricity. The process improves the coaxiality of the detection probe 2 and the test point hole, improves the electric connection effect of the test point hole and the detection probe 2, and improves the test accuracy of the microelectronic assembly. After testing the microelectronic assembly, the operator rotates the operation plate 82 in the reverse direction, so that the pressing plate 7 moves upward, and the support plate 3 is driven to return under the action of the support spring 42.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a microelectronic component test fixture, is fixed with a plurality of test probe (2), its characterized in that including setting up in testboard (1) of microelectronic component detector on testboard (1) the top: the utility model discloses a test bench, including testboard (1), backup pad (3) are provided with in testboard (1) the lift, be provided with elastic support subassembly (4) that support backup pad (3) are carried out on testboard (1), backup pad (3) top is seted up and is placed detection groove (5) of little electronic component, set up a plurality of inspection holes (6) that supply inspection probe (2) to wear to establish on the cell wall of detection groove (5), the top of inspection hole (6) is higher than the top of inspection probe (2), backup pad (3) top goes up and down to be provided with presses that press to hold to little electronic component and hold board (7), set up on testboard (1) and drive and press hold board (7) lifting movement's elevating system (8).

2. The microelectronic assembly test tool of claim 1, wherein: one side of the pressing plate (7) close to the support plate (3) is provided with a plurality of first push rods (9) for pressing and holding the tops of the microelectronic components, and the bottom ends of the first push rods (9) are located at the same water level.

3. The microelectronic assembly testing tool according to claim 2, characterized in that: one side of the pressing plate (7) close to the supporting plate (3) is provided with a plurality of second ejector rods (10) used for pressing the top of the supporting plate (3), and the bottom ends of the second ejector rods (10) are located at the same horizontal height.

4. The microelectronic assembly test tool of claim 3, wherein: the first ejector rod (9) and the second ejector rod (10) are detachably mounted on the pressing plate (7), and a fastener (11) for fixing the first ejector rod (9) and the second ejector rod (10) on the pressing plate (7) is arranged on the pressing plate (7).

5. The microelectronic assembly test tool of claim 1, wherein: elevating system (8) are including support frame (81), operation panel (82), connecting plate (83), lifter (84) and uide bushing (85), be provided with fixed plate (12) on testboard (1), support frame (81) are fixed in fixed plate (12), operation panel (82) articulate in support frame (81), connecting plate (83) articulate in operation panel (82), uide bushing (85) are fixed in support frame (81), lifter (84) wear to locate uide bushing (85), the axis of uide bushing (85) and lifter (84) all is along vertical direction, it is fixed in to press board (7) on lifter (84), connecting plate (83) articulate in lifter (84), operation panel (82) with the articulated axis of support frame (81), operation panel (82) with the articulated axis of connecting plate (83), connecting plate (83) and the articulated axis of lifter (84) all is along the horizontal direction, and a plurality of articulated axes are parallel to each other.

6. The microelectronic assembly test tool according to claim 1, characterized in that: the test bench (1) is provided with a plurality of guide columns (13), the axis of each guide column (13) is vertical, and the guide columns (13) penetrate through the pressure holding plate (7).

7. The microelectronic assembly test tool of claim 1, wherein: elastic support subassembly (4) include a plurality of slide bar (41) and a plurality of supporting spring (42), slide bar (41) are fixed in the bottom of backup pad (3), a plurality of holes (14) that slide have been seted up on testboard (1), slide bar (41) slide in hole (14) slide, supporting spring (42) cover is located slide bar (41), the both ends of supporting spring (42) respectively the butt in backup pad (3) and testboard (1).

8. The microelectronic assembly test tool of claim 7, wherein: the bottom of slide bar (41) is provided with limiting plate (15), limiting plate (15) butt in testboard (1) is kept away from the lateral wall of backup pad (3).