CN214539895U - Flash memory chip's test platform - Google Patents
Flash memory chip's test platform Download PDFInfo
- Publication number
- CN214539895U CN214539895U CN202120214664.3U CN202120214664U CN214539895U CN 214539895 U CN214539895 U CN 214539895U CN 202120214664 U CN202120214664 U CN 202120214664U CN 214539895 U CN214539895 U CN 214539895U
- Authority
- CN
- China
- Prior art keywords
- test
- slide block
- base
- testing
- flash memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Tests Of Electronic Circuits (AREA)
Abstract
The test platform of the flash memory chip is characterized by comprising a test operation surface (47), a vacuumizing assembly (46), a horizontal rotating sliding block (45), a horizontal rotating outer frame (44), a front-back moving sliding block (43), a left-right moving sliding block (42), a test platform base (41) and a tester base (31) from top to bottom in sequence. This test platform adopts electrical equipment, solves the manual physical demands who goes up and down of operator, has also solved manual operation time fast and slow, and output is undulant, the problem of efficiency loss, very big improvement rate of equipment utilization.
Description
Technical Field
The invention relates to a test platform of a flash memory chip.
Background
The flash memory chip is a mobile data storage capable of storing files and data in any format, is small, light and portable, and can be said to be a small personal mobile database
The detection of the flash memory chip needs to be carried out together with a computer through software, and the flash memory chip can be detected through two modes of bad block detection and speed detection. If the file is damaged during bad block detection, the flash memory chip is indicated to have problems. The speed of the flash memory chip can be tested through speed detection, so that the type and the quality of the flash memory chip can be judged,
in the prior art, after an operator of the test platform performs the action of taking and replacing materials, the operator operates the rocker, the action is complicated, the efficiency is low, the speed cannot be too high when the rocker lifts the workbench, the force cannot be too strong, and the efficiency is difficult to effectively improve. Because of factors such as friction of equipment components, abrasion of lifted components after multiple collisions and the like, the contact between the probe and the wafer can not be kept consistent, repeated debugging is needed during large-batch testing, the repeated debugging is needed frequently, the pressure is high, the needle mark on the PAD of the wafer is too large, the subsequent packaging qualification rate is influenced, the pressure is low, and good contact can not be kept.
Disclosure of Invention
The invention aims to provide a test platform of a flash memory chip, which is characterized by comprising a test operation surface (47), a vacuumizing assembly (46), a horizontal rotating slide block (45), a horizontal rotating outer frame (44), a front-back moving slide block (43), a left-right moving slide block (42) and a test platform base (41) from top to bottom in sequence;
the testing platform base (41) is of a lower flat and upper convex structure, and the lower part of the testing platform base (41) is fixed on the testing machine base (31) through screws.
The testing machine base (31) is provided with a first fixing piece (51), and the first fixing piece (51) is fixed on the testing machine base (31) through a first fixing screw (52); a first adjusting screw (50) is clamped by the first fixing piece (51);
the left and right moving slide block (42) is of a concave-concave convex structure; the concave part of the left-right moving slide block (42) is matched with the convex part of the testing platform base (41); a second fixing piece (53) is fixed on one side surface of the left-right moving slide block (42) through a second fixing screw (54); the second fixing piece (53) and the first adjusting screw rod (50) are positioned at the same height; the other side surface of the left-right moving slide block (42) is fixedly connected with a third fixing piece (57) through a third fixing screw (58), and a second adjusting screw rod (56) is clamped by the third fixing piece (57).
The vacuum pumping assembly (46) is connected with a vacuum pump connecting hose (49) through a vacuum pipe quick connector (48).
The test working surface (47) is provided with a vacuum suction hole (16) and an insert (17).
The vertical support (37) is fixed on the testing machine base (31) through a triangular fixing frame (39).
The testing machine base (31) is provided with a microswitch cable hole (13), the microswitch cable hole (13) is provided with a microswitch (12), and the microswitch (12) is provided with a rising button (26) and a falling button (27).
Has the advantages that:
1. the test platform adopts electric equipment, so that the physical consumption of manual lifting of an operator is solved, the problems of high speed, low speed, yield fluctuation and efficiency loss during manual operation are solved, and the utilization rate of the equipment is greatly improved;
2. the high dependence on manpower requirements is reduced, more testing machines can be operated by only one operator, and the problems of low production efficiency caused by high dependence on the number of operators and uneven personnel capacity in the traditional operation are solved;
3. the test platform reduces vibration caused by human factors, ensures the precision of the test probe contacting with the welding spot of the wafer, avoids the problems of error test and probe damage caused by the old test machine, and improves the product percent of pass.
The testing platform of the flash memory chip is positioned on the testing device of the flash memory chip, a splice piece is arranged on the testing platform of the flash memory chip, and the position of a wafer is fixed through the splice piece; setting the lifting of the test pin card by using a stepping motor; the lifting terminal position and the buffer distance of the pin card are set and adjusted by 7 control buttons (a memory control button (1), a locking control button (2), a buffer control button (3), a puncturing control button (4), an origin restoring control button (5), a servo motor control button (6) and a mode control button (7)) on a control panel of the flash memory chip testing device, after an operator presses an ascending button (26) and a descending button (27), PLC controller sends pulse signal for step motor according to the setting value, makes step motor carry out the action of going up and down, makes the relative position that the descending of test needle card stopped at every turn keep identical completely, and the condition that the probe contacted with every wafer keeps unanimous, and the operator only need press two inching buttons that rise, descend and can replace hand formula and go up and down, has solved original several defects simultaneously:
1, a stepping motor is operated by a microswitch, so that the distance and the stroke can be accurately controlled, the stepping motor is stopped suddenly at a position 8mm away from a wafer and is pressed down slowly, and a probe is contacted with a PAD of the wafer in a slow motion, so that a series of adverse phenomena caused by quick contact of the probe and the PAD of the wafer are avoided;
in the testing process of an operator, the microswitch is only needed to be touched after material changing, the stepping motor automatically completes the pressing-buffering-contact action, the microswitch is only needed to be touched after the testing is completed, and the stepping motor automatically moves upwards to the top, so that the efficiency of the operator is greatly improved, and meanwhile, the phenomenon of inconsistent testing processes caused by different abilities of the operator is avoided.
Drawings
FIG. 1 is a schematic structural diagram of a test platform of a flash memory chip;
FIG. 2 is a perspective view of a test platform of a flash memory chip 1;
FIG. 3 is a perspective view of the test platform of the flash memory chip shown in FIG. 2;
FIG. 4 is a top view of a test platform for a flash memory chip;
FIG. 5 is a schematic view of a structure 1 of the flash memory chip testing apparatus;
FIG. 6 is a schematic view of a structure 2 of the flash memory chip testing device;
FIG. 7 is a side view of a flash memory chip testing apparatus;
FIG. 8 is a right side view of FIG. 7;
fig. 9 is a top view of fig. 8.
Detailed Description
The invention will be further illustrated with reference to the following specific examples.
As shown in the figure: a test platform of a flash memory chip is characterized by sequentially comprising a test operation surface (47), a vacuumizing assembly (46), a horizontal rotating slide block (45), a horizontal rotating outer frame (44), a front-back moving slide block (43), a left-right moving slide block (42) and a test platform base (41) from top to bottom;
the testing platform base (41) is of a lower flat and upper convex structure, and the lower part of the testing platform base (41) is fixed on the testing machine base (31) through screws.
The testing machine base (31) is provided with a first fixing piece (51), and the first fixing piece (51) is fixed on the testing machine base (31) through a first fixing screw (52); a first adjusting screw (50) is clamped by the first fixing piece (51);
the left and right moving slide block (42) is of a concave-concave convex structure; the concave part of the left-right moving slide block (42) is matched with the convex part of the testing platform base (41); a second fixing piece (53) is fixed on one side surface of the left-right moving slide block (42) through a second fixing screw (54); the second fixing piece (53) and the first adjusting screw rod (50) are positioned at the same height; the other side surface of the left-right moving slide block (42) is fixedly connected with a third fixing piece (57) through a third fixing screw (58), and a second adjusting screw rod (56) is clamped by the third fixing piece (57).
The vacuum pumping assembly (46) is connected with a vacuum pump connecting hose (49) through a vacuum pipe quick connector (48).
The test working surface (47) is provided with a vacuum suction hole (16) and an insert (17).
The vertical support (37) is fixed on the testing machine base (31) through a triangular fixing frame (39).
The testing machine base (31) is provided with a microswitch cable hole (13), the microswitch cable hole (13) is provided with a microswitch (12), and the microswitch (12) is provided with a rising button (26) and a falling button (27).
This patent the test platform of flash memory chip, install on the testing arrangement of flash memory chip.
The testing device of the flash memory chip is characterized by comprising a testing machine base (31), a testing platform (the testing platform of the flash memory chip), a testing bracket (25), a vertical support (37), a progress motor (38), a control box and a progress motor guide rail (14);
the vertical support (37) is vertically arranged on the base (31) of the testing machine, the control box is arranged on the outer side of the vertical support (37), the step motor (38) is arranged on the inner side of the vertical support (37), the step motor (38) is provided with a step motor guide rail (14), and the testing bracket (25) can move up and down along the step motor guide rail (14) through a guide rail sliding block (40);
the test platform is positioned below the test bracket (25) and is arranged on a base (31) of the testing machine.
The control box comprises a control box panel (8) and a control box rear cover (35), and the control box rear cover (35) is connected with the vertical support (37) through the control box panel (8);
the upper part of the control box rear cover (35) is provided with a stepping motor cable hole (9), the upper part of the side surface is provided with a cooling fan (34), and the lower part of the side surface is provided with a tester switch (32) and a tester power jack (33); a memory control button (1), a locking control button (2), a buffering control button (3), a pricking control button (4), an origin recovery control button (5), a servo motor control button (6) and a mode control button (7) are sequentially arranged on the control box panel (8) from top to bottom;
the side part of the test bracket (25) is provided with a test bracket fixing hole (18), and the test bracket fixing hole (18) is used for connecting a guide rail sliding block (40); the test bracket (25) is also provided with an emergency stop protective cover (21) and an emergency stop microswitch (22), wherein an emergency stop protective cover hanging hole (15) is formed in the emergency stop protective cover (21); the periphery of the test bracket (25) is provided with a probe card fixing bolt (23) for fixing the test probe card (20), and the middle part of the test probe card (20) is provided with a probe (24);
the side surface of the step motor (38) is provided with an emergency stop switch cable (30); a guide rail protective cover (29) is arranged on the stepping motor guide rail (14).
The test platform sequentially comprises a test operation surface (47), a vacuumizing assembly (46), a horizontal rotating slide block (45), a horizontal rotating outer frame (44), a front-back moving slide block (43), a left-right moving slide block (42) and a test platform base (41) from top to bottom.
The structure of each part of the test platform (test platform of flash memory chip) is as follows:
the testing platform base (41) is of a structure with a lower flat part and an upper convex part, and the lower part of the testing platform base (41) is fixed on the testing machine base (31) through screws; the testing machine base (31) is provided with a first fixing piece (51), and the first fixing piece (51) is fixed on the testing machine base (31) through a first fixing screw (52); the first fixing piece (51) clamps a first adjusting screw rod (50);
the left and right moving slide block (42) is of a concave-concave convex structure; the concave part of the left-right moving slide block (42) is matched with the convex part of the testing platform base (41); a second fixing piece (53) is fixed on one side surface of the left-right moving slide block (42) through a second fixing screw (54); the second fixing piece (53) and the first adjusting screw rod (50) are positioned at the same height; the other side surface of the left-right moving slide block (42) is fixedly connected with a third fixing piece (57) through a third fixing screw (58), and a second adjusting screw rod (56) is clamped by the third fixing piece (57).
The front-back moving slide block (43) is of a concave-down and upper-flat structure; the concave part of the front-back moving slide block (43) is matched with the convex part of the left-right moving slide block (42); the side surface of the front-back moving sliding block (43) is fixed with a fourth fixing piece (59) through a fourth fixing screw (60), and the fourth fixing piece (59) and the second adjusting screw (56) are located at the same height;
the horizontal rotating outer frame (44) is of a hollow structure and is connected with an upper flat part of the front-back moving slide block (43) through a screw; the side surface of the horizontal rotating outer frame (44) is provided with a horizontal fixing piece (65), the horizontal fixing piece (65) is provided with a rotating fulcrum (62), and two ends of the horizontal fixing piece (65) are provided with a first horizontal rotating knob (63) and a second horizontal rotating knob (64);
the horizontal rotating sliding block (45) is of an upper horizontal and lower convex structure, the convex part is matched with the hollow part of the horizontal rotating outer frame (44), and the rotating fulcrum (62) is connected with the horizontal rotating sliding block (45) through a horizontal fixing piece (65);
the vacuum pumping assembly (46) is connected with a vacuum pump connecting hose (49) through a vacuum pipe quick connector (48); the test working surface (47) is provided with a vacuum suction hole (16) and an insert (17).
The vertical support (37) is fixed on the testing machine base (31) through a triangular fixing frame (39); the testing machine base (31) is provided with a microswitch cable hole (13), the microswitch cable hole (13) is provided with a microswitch (12), and the microswitch (12) is provided with a lifting button (26) and a descending button (27);
the upper part of the step motor (38) is provided with a stepping motor cable (10).
The left-right moving slide block (42) is provided with a left-right slide block locking device (55);
the front-back moving slide block (43) is provided with a front-back slide block locking device (61);
the horizontal rotating slide block (45) is provided with a horizontal rotating angle ruler (11);
the upper part of the progressive motor guide rail (14) is an origin position (28);
the first adjusting screw rod (50) can be rotated to be in contact with the second fixing piece (53), so that the left-right moving slide block (42) is driven to move left and right;
the second adjusting screw rod (56) can be in contact with the fourth fixing piece (59) through rotation, so that the forward and backward moving slide block (43) is driven to move forward and backward;
when in use, the following steps are adopted:
designing and installing:
in order to avoid vibration generated when the stepping motor works, the bottom of the tester is made of 30cm x 18cm alloy steel to form a tester base (31), a vertical support (37) is screwed and opened at the crossed position of the vertical support (37) and the tester base (31), the vertical support (37) is locked by screws, a triangular steel frame (39) is used for locking the vertical support (37) and the tester base (31) at the same time, and the vertical support (37) is stabilized and perpendicular to the tester base (31) by using triangular stability.
The vertical support (37) is provided with holes corresponding to mounting hole positions of a progressive motor guide rail (14) and mounting hole positions of a control box panel (8), a stepping motor (38) and the progressive motor guide rail (14) are fixed to the vertical support (37), the control box panel (8) is mounted on the vertical support (37), a PLC controller is installed on the control box panel after a 220V-to-24V power supply is installed, then a stepping motor power line is connected to a 24V power supply in the control box through a stepping motor cable hole (9), a stepping motor controls a signal line, a inching switch (up and down) is clicked, an emergency stop line of a protection switch is connected into the PLC controller, a control box rear cover (35) is covered, and the control box panel (8) is fixed through screws.
Mounting a pin card test bracket (25) on a guide rail sliding block (40), wherein the pin card test bracket (25) is required to be parallel to a tester base (31) after being mounted;
a hole is formed in the tester base (31) under the pin card test bracket (25) and is fixed with the test platform base (41) through a screw.
(II) debugging before use
After a series of fittings are manufactured according to the design and assembled, a wafer is placed on the vacuum suction hole in the middle of the test operation surface (47) by using double-sided adhesive tape, and four edges of the wafer are basically parallel to four edges of the test operation surface and then fixed. The vacuum suction holes (16) arranged on the test operation surface (47) are arranged in a grid pattern, the number of the embedded pieces (17) is two, two embedded pieces are abutted against two adjacent edges on the left side and the upper side of the wafer to form a 90-degree included angle, the two embedded pieces are fixed by quick-drying glue, after the test operation surface is tested, the wafer fixed by the double-sided glue is taken down, and the residual glue on the edges of the embedded pieces is removed.
The testing machine is placed on a table top which is stable in structure and cannot shake, and a vacuum pump connecting hose is connected to a vacuum tube quick connector (48) on a vacuum pumping assembly (46);
the power line is connected to a power jack (33), a power tester switch (32) is turned ON, the original point control restoring button (5) (OFF/ON) is turned to ON once, the test bracket (25) is restored to the original point position (28), and the original point control restoring button (5) (OFF/ON) automatically rebounds to OFF. The test wafer is moved upward and leftward along the inside of the insert by using a suction pen, and is released after being tightly attached to the two vertical side lines (the welding points of the wafer are uniformly towards the right side).
The mode control button (7) (automatic/manual) is shifted to a manual mode, the servo motor control button (6) (OFF/ON) is shifted to OFF, the brake of the stepping motor is released at the moment, the test bracket (25) is slightly pressed down by hand until the test bracket (25) is about three centimeters away from the test operation surface 47, the servo motor control button (6) (OFF/ON) is shifted to ON, the brake of the stepping motor is tightly held, the memory control button (1) (OFF/ON) is shifted to ON and then released, and after the controller memorizes the current position of the guide rail sliding block (40) of the stepping motor, the memory control button (1) (OFF/ON) can automatically rebound to the OFF position.
Then, the pricking control button (4) (up/down) is shifted to (down), and the test bracket (25) is continuously lowered to be about two centimeters away from the test operation surface (47).
The test probe card (20) is inserted into a gap in the middle of the test bracket (25), the probe (24) is positioned right above the welding point of the wafer, at the moment, the test probe card is pressed by hands, and four probe card fixing bolts (23) on the test bracket are screwed.
Adjusting the jumper cap of the main control board to 3.3V/1.8V/1.2V jumper position required by the wafer, inserting the main control board interface (19) of the test pin card (20), connecting one end of a USB cable with the main control board, connecting the other end of the USB cable with a computer for test, starting test software in the computer,
the microscope is fixed by a bracket, the objective lens is arranged right above the probe 24, and a microscope lamp is turned on to provide enough illumination for auxiliary debugging.
Observing the positions of a probe (24) and a wafer welding point by using a microscope, shifting a switch of a needle inserting control button (4) (up/down) to down to slowly descend a test bracket, shifting a buffer control button (3) (up/down) to up when the probe is about 8mm away from a test wafer, shifting a locking control button (2) (OFF/ON) to ON, and then shifting a memory control button (1) (OFF/ON) to ON, thereby finishing the initial setting of a buffer position.
The buffer control button (3) (up/down) is shifted to lower, the switch of the needle inserting control button (4) (up/down) is continuously shifted to lower, the relative positions of the wafer welding points and the probes are observed, and the wafer welding points and the tips of the probes 24 are aligned by fine adjustment knobs such as horizontal rotation of the test platform in the left-right and front-back directions when necessary. When the contact is about to contact with the welding spot of the wafer, the switch of the pricking control button (4) (up/down) is inching to (down) (1 um distance each time) until the test result is displayed in computer software, the setting of the end position is completed, the locking control button (2) (OFF/ON) is turned to ON, the memory control button (1) (OFF/ON) is turned to ON, the buffering control button (3) (up/down) is turned to the middle, the setting of the buffering end position is completed, the microscope can be removed, and the mode control button (7) (automatic/manual) is turned to the automatic mode. At this time, the test can be performed by only pressing the up button (26) and the down button (27).
Firstly, measuring two wafers, then independently placing the wafers under a microscope to observe the depth of the probe pricked on a wafer bonding pad, if the depth needs to be adjusted, shifting a mode control button (7) (automatic/manual) to be automatic, pressing a descending button (27), and descending a needle clamp bracket to a preset end point position; and then the mode control button (7) is toggled to manual, the buffer control button (3) is toggled to down, the acupuncture control button (4) is toggled to up or down, the distance of 1um is adjusted once each time the acupuncture control button is toggled, after the adjustment is completed, the lock (OFF/ON) is toggled to OFF in sequence, the memory (OFF/ON) is toggled to ON again, the buffer (up/down) 3 is toggled back to the middle, finally the mode control button (7) is toggled to automatic, and the adjustment of the end point of the buffer stroke is completed.
(III) test procedure
Before batch testing, an operator firstly starts a testing computer, starts testing software, dials a mode control button (7) (automatic/manual) to be automatic, and then dials an original point control button (5) (OFF/ON) to be ON once, so that a stepping motor returns to a zero position.
An operator uses a vacuum suction pen to suck a wafer to be tested (welding points face the right side all the time) from a picking-up disc provided with the wafer, the wafer is placed into an included angle of two embedded pieces on a testing operation surface, after two sides of the wafer and the embedded pieces are tightly abutted at the same time, the vacuum suction pen is loosened, the wafer is stopped on a testing platform, and a descending button (27) is pressed;
after the descending button (27) is electrified, a low level signal is sent to the port A of the PLC, the controller immediately drives the stepping motor, the test bracket quickly descends to a buffer position and then slowly descends to a preset end point position, and a probe is pricked on a welding point of the wafer. At the moment, the wafer is electrically connected with the main control board, the main control chip identifies the wafer and returns the result to the software window of the test computer;
after the test result is presented, an operator presses a lifting button (26), a lifting switch sends a low level signal to the port B of the controller, the test bracket quickly rises to return to the original point 28, the operator sucks up the tested wafer on the test platform, the wafer is placed on a corresponding extraction disc according to the test result, and the process of the test process is repeated.
The main control needs a certain time for the wafer test process, and an operator can simultaneously operate a plurality of test machines to perform one-man multi-machine test on the same wafer (model and thickness).
If the operator presses the descending button (27) carelessly under the condition that the hand is not separated from the area below the test bracket 25 during operation, when the test bracket 25 is pressed down rapidly, the emergency stop protective cover 21 suspended below the test bracket is blocked, any emergency stop microswitch 22 is touched upwards by the counterforce, and at the moment, the microswitch 22 sends a low-level model to the port C of the PLC controller, and the stepping motor stops acting immediately and hovers. At the moment, an operator only needs to dial the original point recovery control button (5) (OFF/ON) once to (ON), the stepping motor automatically rises to the zero position, and the descending button (27) can be pressed again to continue the test.
When the test is stopped, the operator first raises the test carriage 25 to the original point, and then dials the mode control button (7) (automatic/manual) to manual, preventing the operator from touching the rack switch by mistake.
The test platform is composed of a plurality of layers of structures, and each layer of structure is parallel to the base 31 of the test machine;
when a wafer placed on a test operation surface (47) needs to move left and right, firstly, a left and right slide block locking device (55) is loosened, a first adjusting screw rod (50) is rotated clockwise, the tail end of the first adjusting screw rod (50) pushes a second fixing piece (53) leftwards, and a left and right slide block (42) moves leftwards; the first adjusting screw rod (50) is rotated anticlockwise, the tail end of the first adjusting screw rod (50) retreats rightwards, and the left-right moving sliding block (42) moves along with the screw rod under the action of an internal spring to prop against the screw rod. And after the left-right movement adjustment of the test platform is finished, the left and right slide block locking devices (55) are screwed down, and the adjustment is finished.
When the wafer placed on the test operation surface (47) needs to move forwards and backwards, the front and back sliding block locking device (61) is firstly released, the second adjusting screw rod (56) is rotated clockwise, the tail end of the second adjusting screw rod (56) pushes the fourth firmware (59) forwards, and the front and back moving sliding block (43) moves forwards; the second adjusting screw rod (56) is rotated anticlockwise, the tail end of the second adjusting screw rod (56) retreats backwards, the front-back moving sliding block (43) automatically retreats along with the screw rod under the action of an internal spring and props against the second adjusting screw rod (56). After the front-back movement adjustment of the test platform is finished, the front-back sliding block locking device (61) is screwed down, and the adjustment is finished.
When the wafer placed on the test operation surface (47) needs to rotate horizontally, if the wafer needs to rotate clockwise at a overlooking angle, the second horizontal rotation knob (64) is unscrewed, then the first horizontal rotation knob (63) is adjusted, thrust is applied to the rotation fulcrum (62), the horizontal rotation sliding block (45) rotates clockwise, and after the horizontal rotation adjustment is completed, the second horizontal rotation knob (64) is screwed down, and the adjustment is completed. If the horizontal rotation knob needs to rotate anticlockwise at a overlooking angle, the first horizontal rotation knob (63) is unscrewed, then the second horizontal rotation knob (64) is adjusted, thrust is applied to the rotation fulcrum (62), the horizontal rotation sliding block (45) rotates clockwise, and after the horizontal rotation adjustment is completed, the first horizontal rotation knob (63) is screwed down, and the adjustment is completed.
It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teaching of the present invention, and such equivalents may fall within the scope of the present invention as defined in the appended claims.
Claims (6)
1. A test platform of a flash memory chip is characterized by sequentially comprising a test operation surface (47), a vacuumizing assembly (46), a horizontal rotating slide block (45), a horizontal rotating outer frame (44), a front-back moving slide block (43), a left-right moving slide block (42) and a test platform base (41) from top to bottom;
the testing platform base (41) is of a lower flat and upper convex structure, and the lower part of the testing platform base (41) is fixed on the testing machine base (31) through screws.
2. The testing platform of claim 1, wherein the testing machine base (31) has a first fixing member (51), the first fixing member (51) is fixed on the testing machine base (31) by a first fixing screw (52); the first fixing piece (51) clamps a first adjusting screw rod (50);
the left and right moving slide block (42) is of a concave-concave convex structure; the concave part of the left-right moving slide block (42) is matched with the convex part of the testing platform base (41); a second fixing piece (53) is fixed on one side surface of the left-right moving slide block (42) through a second fixing screw (54); the second fixing piece (53) and the first adjusting screw rod (50) are positioned at the same height; the other side surface of the left-right moving slide block (42) is fixedly connected with a third fixing piece (57) through a third fixing screw (58), and a second adjusting screw rod (56) is clamped by the third fixing piece (57).
3. The test platform for flash memory chips of claim 1, wherein the vacuum pumping assembly (46) is connected to a vacuum pump connection hose (49) through a vacuum tube quick connector (48).
4. The test platform for flash memory chips of claim 1, wherein the test working surface (47) has vacuum suction holes (16) and inserts (17).
5. The testing platform of claim 1, wherein the vertical support (37) is fixed to the tester base (31) by a triangular fixing frame (39).
6. The testing platform of claim 1, wherein the tester base (31) is provided with a microswitch cable hole (13), the microswitch cable hole (13) is provided with a microswitch (12), and the microswitch (12) is provided with a rising button (26) and a falling button (27).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120214664.3U CN214539895U (en) | 2021-01-26 | 2021-01-26 | Flash memory chip's test platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120214664.3U CN214539895U (en) | 2021-01-26 | 2021-01-26 | Flash memory chip's test platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214539895U true CN214539895U (en) | 2021-10-29 |
Family
ID=78346701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120214664.3U Active CN214539895U (en) | 2021-01-26 | 2021-01-26 | Flash memory chip's test platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214539895U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112881893A (en) * | 2021-01-26 | 2021-06-01 | 深圳市卓然电子有限公司 | Flash memory chip's test platform |
-
2021
- 2021-01-26 CN CN202120214664.3U patent/CN214539895U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112881893A (en) * | 2021-01-26 | 2021-06-01 | 深圳市卓然电子有限公司 | Flash memory chip's test platform |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112863587A (en) | Method for testing flash memory chip | |
| CN112161558B (en) | Automatic detection system for probe stroke | |
| CN214539895U (en) | Flash memory chip's test platform | |
| CN108405363B (en) | Voice coil motor detection equipment and detection method | |
| CN211123137U (en) | ICT light sensation test fixture | |
| CN112881893A (en) | Flash memory chip's test platform | |
| CN215067097U (en) | PCBA testing arrangement | |
| CN114646868A (en) | Intelligent test needle mold equipment for FPC performance test | |
| CN212400658U (en) | Multifunctional laser marking device | |
| CN214539893U (en) | Testing device for flash memory chip | |
| CN212432056U (en) | Bipolar plate height measuring device | |
| CN205374680U (en) | Dome lamp control switch PCB check out test set that rolls off production line | |
| CN112863590B (en) | Testing device for flash memory chip | |
| CN112845168A (en) | Automatic elasticity testing machine for movable contact spring piece of starting protector of motor of refrigeration compressor | |
| CN209000548U (en) | A kind of SSD Testing device of electrical parameter | |
| CN109262412B (en) | Needle grinding table driving structure and full-automatic probe table | |
| CN114578215B (en) | FPC test equipment convenient to FPC board takes out | |
| CN107846836B (en) | A kind of car antenna and circuit board screw assembly method | |
| CN213956339U (en) | Spring leaf deformation measuring structure of protector movable contact spring leaf elasticity test machine | |
| CN215910362U (en) | Panel detection equipment | |
| CN211293145U (en) | Server mainboard function test machine | |
| CN208350941U (en) | A kind of ICT automatic aligning test machine | |
| CN113677098A (en) | Transparent circuit board equipment of bending | |
| CN112623748A (en) | Pneumatic automatic extraction and transfer device for to-be-detected spring piece of spring piece elasticity detector | |
| CN218213295U (en) | Microelectronic assembly test tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |