JPS63124483A - Cap for light transmission and manufacture thereof - Google Patents

Cap for light transmission and manufacture thereof

Info

Publication number
JPS63124483A
JPS63124483A JP61270118A JP27011886A JPS63124483A JP S63124483 A JPS63124483 A JP S63124483A JP 61270118 A JP61270118 A JP 61270118A JP 27011886 A JP27011886 A JP 27011886A JP S63124483 A JPS63124483 A JP S63124483A
Authority
JP
Japan
Prior art keywords
cap
frame
light
metal frame
oxide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61270118A
Other languages
Japanese (ja)
Other versions
JPH0799786B2 (en
Inventor
Takashi Maehara
隆 前原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP61270118A priority Critical patent/JPH0799786B2/en
Publication of JPS63124483A publication Critical patent/JPS63124483A/en
Publication of JPH0799786B2 publication Critical patent/JPH0799786B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To prevent light scattering, and to reduce noises by previously forming the oxide film of a metal constituting a metallic frame onto the inner surface of the frame when a semiconductor laser element is sealed hermetically by using a cap in which a light-transmitting member is sealed to the metallic frame. CONSTITUTION:Ni is plated previously onto the surface of a cap-shaped metallic frame 12 consisting of an Fe-Ni-Co alloy, etc., a through-hole 18 is bored to the top section of the metallic frame, and a light-transmitting plate 14 is sealed in the through hole 18 by employing low melting-point glass 16. An opening section 22 for housing a semiconductor laser element is formed to the lower section of the frame 12, and the periphery of the frame 12 is bent to the outside and used as a flange 24 for joining stems. The inner surface of the frame 12 is coated with a black oxide film 26 composed of the same material as the frame 12, but the treatment is generated by heat treatment in an acidic atmosphere before Ni plating and the formation of the light- transmitting plate 14, etc. Accordingly, the film 26 absorbs beams and does not conduct reflection, thus approximately removing internal scattering, then generating no noise in a laser.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、半導体レーザー装置などに用いられる光透過
用キャップおよびその製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a light-transmitting cap used for semiconductor laser devices and the like, and a method for manufacturing the same.

(従来の技術) 従来、例えば半導体レーザー装置に搭載される半導体レ
ーザー素子は金属枠に光透過部材を封着したキャップに
より気密封止される。このキャップの金属枠ば頂部に透
孔が穿設されたキャップ(帽子)状に形成され、透孔は
ガラス等からなる光透過部材によって封着される。また
、金属枠は金属製であるので、耐蝕性向上のためのめっ
きが施される。
(Prior Art) Conventionally, for example, a semiconductor laser element mounted on a semiconductor laser device is hermetically sealed with a cap in which a light transmitting member is sealed to a metal frame. The metal frame of this cap is formed into a cap (cap) shape with a through hole bored in the top, and the through hole is sealed with a light transmitting member made of glass or the like. Furthermore, since the metal frame is made of metal, it is plated to improve corrosion resistance.

通常、光透過部材をキャップの金属枠に封着す名湯台に
は、まず金属枠に低融点ガラスを溶着し、この低融点ガ
ラスを再熔融することによりガラス等からなる光透過部
材を封着している。
Normally, in famous bathtubs where a light transmitting member is sealed to the metal frame of the cap, low melting point glass is first welded to the metal frame, and this low melting point glass is remelted to seal the light transmitting member made of glass etc. I'm wearing it.

前記低融点ガラスはその下地となる金属枠との濡れ性を
向上させるため、あらかしめ金属枠を酸化性雰囲気中で
加熱し、金属枠表面に金属酸化膜を形成した後、金属枠
に溶着される。
In order to improve the wettability of the low melting point glass with the underlying metal frame, the metal frame is heated in an oxidizing atmosphere to form a metal oxide film on the surface of the metal frame, and then welded to the metal frame. Ru.

この金属酸化膜は後工程のめっき処理の妨げになるため
、めっき前にあらかじめ酸処理し、金属枠表面の金属酸
化膜を除去した後、ニッケルめっき等の耐蝕めっきがな
される。
Since this metal oxide film interferes with the subsequent plating process, the metal frame is treated with acid before plating to remove the metal oxide film on the surface of the metal frame, and then a corrosion-resistant plating such as nickel plating is applied.

第3図は従来のキャップの一例を示す断面図である。FIG. 3 is a sectional view showing an example of a conventional cap.

10はキャップ、12はキャップ10の金属枠、14は
光透過板である。この光透過板14の表面上には反射防
止膜が施される。16は低融点ガラスであり、これを熔
融することにより光透過板14を金属枠12に封着する
。18は金属枠12頂部に開口する透孔、20は金属枠
12表面に施されるニッケルめっき等の耐蝕めっきであ
る。従来のキャップ10は図示するように金属枠12の
封着部を除く表面に耐蝕めっきが施される。
10 is a cap, 12 is a metal frame of the cap 10, and 14 is a light transmitting plate. An antireflection film is applied on the surface of this light transmitting plate 14. 16 is a low melting point glass, and by melting this glass, the light transmitting plate 14 is sealed to the metal frame 12. Reference numeral 18 indicates a through hole opening at the top of the metal frame 12, and reference numeral 20 indicates a corrosion-resistant plating such as nickel plating applied to the surface of the metal frame 12. As shown in the figure, the conventional cap 10 is coated with corrosion-resistant plating on the surface of the metal frame 12 except for the sealing portion.

(発明が解決しようとする問題点) 上記キャップは例えば半導体レーザー装置では、半導体
レーザー素子を搭載するステムに接合され、半導体レー
ザー素子を気密封止している。
(Problems to be Solved by the Invention) For example, in a semiconductor laser device, the cap is joined to a stem on which a semiconductor laser element is mounted, and hermetically seals the semiconductor laser element.

この半導体レーザー素子はステムに立設した放熱体に接
合され、半導体レーザー素子から発生するレーザー光は
、光透過部材を透過して外部へ放出される。この光透過
部材には反射防止膜などの処理が施されているが、半導
体レーザー素子から放出されるレーザー光が円錐状のビ
ームとして発光する等のためにステム上面等によってキ
ャップ内部に反射・散乱される。
This semiconductor laser element is joined to a heat radiator provided upright on the stem, and the laser light generated from the semiconductor laser element is transmitted through the light transmitting member and emitted to the outside. This light-transmitting member is treated with an anti-reflection coating, but because the laser light emitted from the semiconductor laser element is emitted as a conical beam, it is reflected and scattered inside the cap by the top surface of the stem, etc. be done.

この散乱光はキャップ内で反射し、外部装置に誤認識さ
れること、また、散乱して光透過部材か   、ら外部
に放出されること等によって、レーザー光源のノイズの
原因となる。
This scattered light is reflected within the cap and erroneously recognized by an external device, and is also scattered and emitted to the outside from the light transmitting member, causing noise in the laser light source.

少させなければならない。I have to reduce it.

そこで、本発明は上記問題点を解消すべくなされたもの
であり、その目的とするところは、キャップ内における
光の散乱を抑え、散乱光に起因するノイズを減少させ、
それによって信頼性を向上させることができるキャップ
およびその製造方法を提供するにある。
Therefore, the present invention has been made to solve the above problems, and its purpose is to suppress scattering of light within the cap, reduce noise caused by scattered light,
An object of the present invention is to provide a cap and a method for manufacturing the same that can thereby improve reliability.

(問題点を解決するための手段) 本発明は上記問題点を解消するため次の構成をそなえる
(Means for Solving the Problems) In order to solve the above problems, the present invention has the following configuration.

すなわち、キャップ状に形成された金属枠に光透過部材
を封着して成る光透過用キャップにおいて、該キャップ
の前記金属枠の内面に該金属枠の金属酸化膜を形成した
ことを特徴とし、また、キャップ状に形成された金属枠
に光透過部材を封着して成る光透過用キャップの製造方
法において、前記金属枠を酸化性雰囲気中で加熱して該
金属枠の表面に金属酸化膜を形成し、前記光透過部材を
封着した後、前記金属枠の内面をゴム栓等により密封し
て金属酸化膜を除去し、該金属枠の内面に形成した金属
酸化膜をそのまま残すことを特徴とする。
That is, in a light-transmitting cap formed by sealing a light-transmitting member to a metal frame formed in a cap shape, a metal oxide film of the metal frame is formed on the inner surface of the metal frame of the cap, Further, in the method for manufacturing a light-transmitting cap in which a light-transmitting member is sealed to a metal frame formed in a cap shape, the metal frame is heated in an oxidizing atmosphere to form a metal oxide film on the surface of the metal frame. After forming and sealing the light transmitting member, the inner surface of the metal frame is sealed with a rubber plug or the like to remove the metal oxide film, leaving the metal oxide film formed on the inner surface of the metal frame as it is. Features.

(実施例) 以下に本発明の好適な実施例を添付図面に基づいて詳細
に説明する。
(Embodiments) Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

第1図は、本発明に係る実施例を示す光透過用キャップ
の断面図である。
FIG. 1 is a sectional view of a light transmitting cap showing an embodiment of the present invention.

図で従来例と同一の部材については同一の番号を付す。In the figures, the same members as in the conventional example are given the same numbers.

12はキャップ本体をなす鉄−ニソケルーコバルト合金
、鉄−ニッケル合金等の金属からなるキャップ状に形成
された金属枠である。この金属枠12の光透過部材が封
着される頂部には透孔18が穿設され、金属枠12の下
部は、半導体レーザー素子等を収容するため開口し、こ
の開口部22の周縁にはステム等と接合するためのフラ
ンジ24が設けられている。
Reference numeral 12 denotes a metal frame formed into a cap shape and made of metal such as iron-nickel-cobalt alloy or iron-nickel alloy, which forms the cap body. A through hole 18 is bored at the top of the metal frame 12 to which the light transmitting member is sealed, and the lower part of the metal frame 12 is opened to accommodate a semiconductor laser element, etc., and the periphery of this opening 22 is A flange 24 is provided for joining with a stem or the like.

20は金属枠12表面に施された耐蝕めっきであり、電
解ニッケルめっきあるいは無電解ニッケルめっき等がな
されたものである。
20 is a corrosion-resistant plating applied to the surface of the metal frame 12, such as electrolytic nickel plating or electroless nickel plating.

26は前記金属枠12の内面に施された金属酸化膜であ
り、封着部を除く金属枠の内面全体にわたって被われる
。この金属酸化膜は前記金属枠12を酸性雰囲気中で加
熱処理して形成したものであり、化学的に安定な黒色の
酸化皮膜である。
A metal oxide film 26 is applied to the inner surface of the metal frame 12, and covers the entire inner surface of the metal frame except for the sealing portion. This metal oxide film is formed by heat-treating the metal frame 12 in an acidic atmosphere, and is a chemically stable black oxide film.

14は透孔18に低融点ガラス16を介して封着される
光透過板である。
Reference numeral 14 denotes a light transmitting plate sealed to the through hole 18 with a low melting point glass 16 interposed therebetween.

つぎに、上述したキャップの製造方法について説明する
Next, a method for manufacturing the above-mentioned cap will be explained.

まず、所定のキャップ状に成形された金属枠12を酸化
性雰囲気中で加熱し、金属枠12の全表面に金属枠I2
の金属酸化膜26を形成する。
First, the metal frame 12 formed into a predetermined cap shape is heated in an oxidizing atmosphere, and the entire surface of the metal frame 12 is coated with the metal frame I2.
A metal oxide film 26 is formed.

つぎに、金属酸化膜26が形成された金属枠12の透孔
18の金属枠内面側周縁部に低融点ガラス16を溶着す
る。そして、この低融点ガラス16上に光透過板14を
載置し、加熱することにより低融点ガラス16を熔融し
光透過板14を金属枠12に気密に封着する。
Next, the low melting point glass 16 is welded to the peripheral edge of the inner surface of the metal frame 12 of the through hole 18 on which the metal oxide film 26 is formed. Then, the light transmitting plate 14 is placed on the low melting point glass 16, and the low melting point glass 16 is melted by heating, and the light transmitting plate 14 is hermetically sealed to the metal frame 12.

ついで、金属枠12表面に耐蝕めっきを施すが、この光
透過板14が封着された状態では、金属枠12表面に金
属酸化膜が形成されているので、めっき前に酸処理を行
う。この酸処理は、第2図に示ずように、前記金属枠1
2の内面をゴム栓28などの弾性体等によって密封し、
金属枠の内側に処理液が侵入しないようにして行う。こ
れによって、金属枠I2の内面は酸処理されず、金属枠
12の外面のみ酸処理されて金属酸化膜が除去される。
Corrosion-resistant plating is then applied to the surface of the metal frame 12, but since a metal oxide film is formed on the surface of the metal frame 12 with the light transmitting plate 14 sealed, acid treatment is performed before plating. This acid treatment is performed on the metal frame 1 as shown in FIG.
The inner surface of 2 is sealed with an elastic body such as a rubber stopper 28,
This is done in such a way that the processing liquid does not enter the inside of the metal frame. As a result, the inner surface of the metal frame I2 is not acid-treated, and only the outer surface of the metal frame 12 is acid-treated to remove the metal oxide film.

この酸処理は金属酸化膜の除去とめっきの前処理を兼ね
て行うことができる。つづいて、電解ニッケル、あるい
は無電解ニッケルめっき等を施すことにより金属枠12
の外面に耐蝕めっきが施され、所望のキャップを得るこ
とができる。
This acid treatment can be performed both to remove the metal oxide film and as a pretreatment for plating. Next, the metal frame 12 is coated with electrolytic nickel or electroless nickel plating.
Corrosion-resistant plating is applied to the outer surface of the cap, making it possible to obtain the desired cap.

上述したキャップは、内面に黒色の金属酸化膜が形成さ
れているから、光を吸収する効率が大きく、光を反射し
ないという効果がある。したがって、金属枠の内面にニ
ッケルめっきなどが施されて、光の反射率が大きい従来
のキャップにくらべ、光がキャップ内面で散乱すること
を極めて低く抑えることができる。
Since the above-mentioned cap has a black metal oxide film formed on its inner surface, it has a high efficiency of absorbing light and has the effect of not reflecting light. Therefore, compared to a conventional cap in which the inner surface of the metal frame is coated with nickel plating or the like and has a high light reflectance, scattering of light on the inner surface of the cap can be suppressed to an extremely low level.

また、金属酸化膜は化学的に安定であるので、キャップ
内面の耐蝕性にもなんら問題がない。
Furthermore, since the metal oxide film is chemically stable, there is no problem with the corrosion resistance of the inner surface of the cap.

なお、本発明に係る製造方法は、金属酸化膜を除去する
酸処理時に、所定部分の金属酸化膜をそのまま残すこと
を特徴とするものであり、光透過部材として光透過板や
レンズ状光透過部材を用いて、低融点ガラスで封着する
ほか、ガラス部材などを金属枠に載置して熔融すること
により板状、レンズ状等の所望の形状に形成して封着し
てもよいことはもちろんである。
The manufacturing method according to the present invention is characterized in that a predetermined portion of the metal oxide film remains intact during the acid treatment to remove the metal oxide film, and a light transmitting plate or a lens-like light transmitting member is used as the light transmitting member. In addition to sealing with low melting point glass, glass members may be placed on a metal frame and melted to form a desired shape such as a plate or lens and then sealed. Of course.

(発明の効果) 上述したように、本発明に係るキャップおよびその製造
方法によれば、キャップ内面に金属酸化膜を形成したか
らキャップ内面におけるレーザー光などの散乱を防止す
ることができ、キャップ内の散乱光に起因するノイズを
極めて低く抑えることができる。
(Effects of the Invention) As described above, according to the cap and the manufacturing method thereof according to the present invention, since a metal oxide film is formed on the inner surface of the cap, it is possible to prevent scattering of laser light, etc. on the inner surface of the cap. Noise caused by scattered light can be suppressed to an extremely low level.

また、その製造においては、従来の製造工程中に組込む
ことができるから、製造が容易であるという著効を奏す
ることができる。
In addition, since it can be incorporated into the conventional manufacturing process, it can be manufactured easily.

以上本発明につき好適な実施例を挙げて種々説明したが
、本発明はこの実施例に限定されるものではなく、発明
の精神を逸脱しない範囲内で多くの改変を施し得るのは
もちろんのことである。
Although the present invention has been variously explained above with reference to preferred embodiments, the present invention is not limited to these embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the invention. It is.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係るキャップの実施例を示す断面図、
第2図はキャップの製造方法を示す断面図、第3図はキ
ャップの従来例を示す断面図であ10・・・キャップ、
  ]2・・・金属枠、14・・・光透過板、  16
・・・低融点ガラス、18・・・透孔、 20・・・耐
蝕めっき、22・・・開口部、 24・・・フランジ、
26・・・金属酸化膜、 28・・・ゴム栓。
FIG. 1 is a sectional view showing an embodiment of the cap according to the present invention;
FIG. 2 is a sectional view showing a method for manufacturing a cap, and FIG. 3 is a sectional view showing a conventional example of a cap.
]2...Metal frame, 14...Light transmission plate, 16
...low melting point glass, 18...through hole, 20...corrosion-resistant plating, 22...opening, 24...flange,
26...Metal oxide film, 28...Rubber stopper.

Claims (1)

【特許請求の範囲】 1、キャップ状に形成された金属枠に光透過部材を封着
して成る光透過用キャップにおいて、該キャップの前記
金属枠の内面に該金属枠の金属酸化膜を形成したことを
特徴とする光透過用キャップ。 2、キャップ状に形成された金属枠に光透過部材を封着
して成る光透過用キャップの製造方法において、前記金
属枠を酸化性雰囲気中で加熱して該金属枠の表面に金属
酸化膜を形成し、前記光透過部材を封着した後、前記金
属枠の内面をゴム栓等により密封して金属酸化膜を除去
し、該金属枠の内面に形成した金属酸化膜をそのまま残
すことを特徴とする光透過用キャップの製造方法。
[Claims] 1. In a light-transmitting cap formed by sealing a light-transmitting member to a metal frame formed in a cap shape, a metal oxide film of the metal frame is formed on the inner surface of the metal frame of the cap. A light transmitting cap that is characterized by: 2. A method for manufacturing a light-transmitting cap comprising sealing a light-transmitting member to a metal frame formed into a cap shape, in which the metal frame is heated in an oxidizing atmosphere to form a metal oxide film on the surface of the metal frame. After forming and sealing the light transmitting member, the inner surface of the metal frame is sealed with a rubber plug or the like to remove the metal oxide film, leaving the metal oxide film formed on the inner surface of the metal frame as it is. A manufacturing method for a light-transmitting cap.
JP61270118A 1986-11-13 1986-11-13 Light transmitting cap and method of manufacturing the same Expired - Fee Related JPH0799786B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61270118A JPH0799786B2 (en) 1986-11-13 1986-11-13 Light transmitting cap and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61270118A JPH0799786B2 (en) 1986-11-13 1986-11-13 Light transmitting cap and method of manufacturing the same

Publications (2)

Publication Number Publication Date
JPS63124483A true JPS63124483A (en) 1988-05-27
JPH0799786B2 JPH0799786B2 (en) 1995-10-25

Family

ID=17481796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61270118A Expired - Fee Related JPH0799786B2 (en) 1986-11-13 1986-11-13 Light transmitting cap and method of manufacturing the same

Country Status (1)

Country Link
JP (1) JPH0799786B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03132619A (en) * 1989-10-18 1991-06-06 Matsushita Electric Ind Co Ltd Semiconductor laser device and its manufacture
EP0607700A3 (en) * 1992-12-24 1994-11-30 Sharp Kk Semiconductor laser device.
US11112555B2 (en) 2019-09-30 2021-09-07 Nichia Corporation Light-emitting module with a plurality of light guide plates and a gap therein
US11561338B2 (en) 2019-09-30 2023-01-24 Nichia Corporation Light-emitting module

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6039880A (en) * 1983-08-12 1985-03-01 Hitachi Ltd Light-emitting device
JPS6142936A (en) * 1984-08-06 1986-03-01 Shinko Electric Ind Co Ltd Manufacture of body structure with light transmitting window

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6039880A (en) * 1983-08-12 1985-03-01 Hitachi Ltd Light-emitting device
JPS6142936A (en) * 1984-08-06 1986-03-01 Shinko Electric Ind Co Ltd Manufacture of body structure with light transmitting window

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03132619A (en) * 1989-10-18 1991-06-06 Matsushita Electric Ind Co Ltd Semiconductor laser device and its manufacture
EP0607700A3 (en) * 1992-12-24 1994-11-30 Sharp Kk Semiconductor laser device.
US11112555B2 (en) 2019-09-30 2021-09-07 Nichia Corporation Light-emitting module with a plurality of light guide plates and a gap therein
US11561338B2 (en) 2019-09-30 2023-01-24 Nichia Corporation Light-emitting module

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