JPS5940312B2 - Manufacturing method of lens cap for optical semiconductors - Google Patents
Manufacturing method of lens cap for optical semiconductorsInfo
- Publication number
- JPS5940312B2 JPS5940312B2 JP54095237A JP9523779A JPS5940312B2 JP S5940312 B2 JPS5940312 B2 JP S5940312B2 JP 54095237 A JP54095237 A JP 54095237A JP 9523779 A JP9523779 A JP 9523779A JP S5940312 B2 JPS5940312 B2 JP S5940312B2
- Authority
- JP
- Japan
- Prior art keywords
- lens
- metal shell
- glass
- graphite jig
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 230000003287 optical effect Effects 0.000 title claims description 10
- 239000002184 metal Substances 0.000 claims description 37
- 239000011521 glass Substances 0.000 claims description 32
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 26
- 229910002804 graphite Inorganic materials 0.000 claims description 25
- 239000010439 graphite Substances 0.000 claims description 25
- 238000007789 sealing Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- 239000006060 molten glass Substances 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 230000001603 reducing effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
Description
【発明の詳細な説明】
本発明は光導電素子、発光ダイオード等の光半導体素子
を気密封入すると共に、レンズ機能も有するレンズキャ
ップの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a lens cap that hermetically encapsulates an optical semiconductor element such as a photoconductive element or a light emitting diode, and also has a lens function.
一般に、発光ダイオードやホトトランジスタ、LASC
Rなどの光半導体素子を有する光半導体装置は、第1図
に示すような構造のものが多い。Generally, light emitting diodes, phototransistors, LASC
Many optical semiconductor devices having optical semiconductor elements such as R have a structure as shown in FIG.
この第1図に於て、1はステム、2はステム1上に固定
された光半導体素子、3はステム1にガラス4で気密に
封された外部リード線、5は外部リード線3と光半導体
素子2を接続する細線であり、6はステム1上に気密に
固定されたレンズキャップである。このレンズキャップ
6は金属シェルTにガラスレンズ8を封着した構造を有
する。つまり、金属シェルTは筒状部7aと、筒状部7
aの下端外周縁に一体形成した下部フランジTbと、筒
状部Taの上端内周縁に一体形成した上部フランジ7c
で構成され、上部フランジ7cの内周端面でレンズ封着
穴9が形成され、このレンズ封着穴、9にガラス円板を
融着して溶融ガラスの表面張力で所定の球面形状のガラ
スレンズ8が形成される。そして、下部フランジ7bが
ステム1上に抵抗溶接等で気密に固定される。ところで
、金属シェルTはコバール(Fe−Ni−Co合金)な
どの金属が一般に使用され、ガラスレンズ8は硼硅酸ガ
ラスなどが使用されている。In this Figure 1, 1 is a stem, 2 is an optical semiconductor element fixed on the stem 1, 3 is an external lead wire hermetically sealed to the stem 1 with glass 4, and 5 is an external lead wire 3 and an optical semiconductor element fixed on the stem 1. This is a thin wire connecting the semiconductor elements 2, and 6 is a lens cap that is airtightly fixed on the stem 1. This lens cap 6 has a structure in which a glass lens 8 is sealed to a metal shell T. That is, the metal shell T includes the cylindrical part 7a and the cylindrical part 7.
A lower flange Tb integrally formed on the outer peripheral edge of the lower end of a, and an upper flange 7c integrally formed on the inner peripheral edge of the upper end of the cylindrical portion Ta.
A lens sealing hole 9 is formed on the inner peripheral end surface of the upper flange 7c, and a glass disk is fused to the lens sealing hole 9 to form a glass lens in a predetermined spherical shape using the surface tension of the molten glass. 8 is formed. Then, the lower flange 7b is airtightly fixed onto the stem 1 by resistance welding or the like. By the way, metal such as Kovar (Fe-Ni-Co alloy) is generally used for the metal shell T, and borosilicate glass or the like is used for the glass lens 8.
又、ガラスレンズ8の封着形成は、金属シェル7の上部
フランジTc上に透明ガラス円板を載置し、このガラス
円板を加熱溶融することにより行゛つている。しかし、
金属シェル7の金属面とガラスとのなじみは非常に悪く
、従つて、金属シェル7の上部フランジTc・にガラス
円板を単に溶着させるだけでは、ガラスレンズ8の封着
強度や気密性に不良が発生する。そこで、従来は金属シ
ヨ エル7とガラスとのなじみを良くするため、金属シ
ェル□の全表面に予め酸化膜を形成して、次の要領でレ
ンズキャップ6を製造していた。即ち、第2図に示すよ
うに、平板状の下部グラファイト治具10上に予備酸化
した金属シェル7、の上部フランジTc上に所定寸法の
ガラス円板11を載せておく。Further, the glass lens 8 is sealed and formed by placing a transparent glass disk on the upper flange Tc of the metal shell 7 and heating and melting this glass disk. but,
The compatibility between the metal surface of the metal shell 7 and the glass is very poor. Therefore, simply welding a glass disk to the upper flange Tc of the metal shell 7 will result in poor sealing strength and airtightness of the glass lens 8. occurs. Conventionally, in order to improve the compatibility between the metal shell 7 and the glass, an oxide film was previously formed on the entire surface of the metal shell □, and the lens cap 6 was manufactured in the following manner. That is, as shown in FIG. 2, a glass disk 11 of a predetermined size is placed on the upper flange Tc of the pre-oxidized metal shell 7 on the flat lower graphite jig 10.
次に金属シェルTの筒状部7aの外径よりやや大きな内
径の穴12を下面に有する上部グラフアイト治具13を
被せ、穴12に金属シエル7を嵌挿し、又、上部グラフ
アイト治具13の下端で下部フランジ7bを押える。こ
の状態に於て、ガラス円板11を加熱溶融させると、溶
融ガラスのーー部はレンズ封着穴9を垂れ下つて表面張
力で湾曲し、又、溶融ガラスの上部は上部フランジ7c
上に表面張力で湾曲して溶着されて、第2図鎖線形状の
ガラスレンズが形成される。しかし、この従来方法には
次の欠点があつた。Next, an upper graphite jig 13 having a hole 12 with an inner diameter slightly larger than the outer diameter of the cylindrical part 7a of the metal shell T is placed on the lower surface, the metal shell 7 is fitted into the hole 12, and the upper graphite jig is 13 to press down the lower flange 7b. In this state, when the glass disk 11 is heated and melted, a part of the molten glass hangs down through the lens sealing hole 9 and is curved due to surface tension, and the upper part of the molten glass is bent at the upper flange 7c.
The glass lens is curved and welded on top by surface tension to form a glass lens shaped like the chain line in FIG. However, this conventional method had the following drawbacks.
つまり、ガラスレンズ8の形状と、金属シエル7との気
密性は金属シエル7表面の予備酸化膜の量に大きく影響
を受ける。例えば、この予備酸化膜の量が少ない場合、
レンズ形状を問題なく出せるが、気密不良を誘発する。
そのため、予備酸化膜の量を十分に多くとつて、気密不
良を防止しているが、この場合はレンズ形状が不安定に
なる欠点があつた。即ち、従来は第2図に示した如く、
金属シエル7の内面を解放した状態でガラス円板11を
レンズ封着穴9周縁の上部フランジ7cに溶着していた
。この時、金属シエル7の予備酸化膜の量を多くしてガ
ラスとのなじみ性を良くしておくと、溶融ガラスは上部
フランジ7cの下面から筒状部7aの内周面にまで沿つ
て流れ、第3図に示すような形状不良のガラスレンズ8
が形成されることがあつた。本発明は上記従来の欠点に
鑑み、これを改良、除去したもので、封着治具の形状改
良により、金属シエル7の予備酸化膜の量を増大させて
も、所定のレンズ形状を確保できる製造方法を提供する
。In other words, the shape of the glass lens 8 and its airtightness with the metal shell 7 are greatly influenced by the amount of preliminary oxide film on the surface of the metal shell 7. For example, if the amount of this preliminary oxide film is small,
Although the lens shape can be produced without any problem, it causes poor airtightness.
Therefore, the amount of the preliminary oxidation film is sufficiently large to prevent poor airtightness, but in this case, there is a drawback that the lens shape becomes unstable. That is, conventionally, as shown in Figure 2,
With the inner surface of the metal shell 7 open, the glass disk 11 was welded to the upper flange 7c around the lens sealing hole 9. At this time, if the amount of preliminary oxidation film on the metal shell 7 is increased to improve its compatibility with the glass, the molten glass will flow from the lower surface of the upper flange 7c to the inner peripheral surface of the cylindrical portion 7a. , a glass lens 8 with a defective shape as shown in FIG.
was sometimes formed. The present invention improves and eliminates the above conventional drawbacks, and by improving the shape of the sealing jig, it is possible to maintain a predetermined lens shape even if the amount of pre-oxidation film on the metal shell 7 is increased. A manufacturing method is provided.
.以下本発明を図面を参照して説明する。いま本発明を
第1図に示したレンズキヤツプ6の製造に適用した場合
、第4図に示すような下部グラフアイト治具14と上部
グラフアイト治具15を使用する。.. The present invention will be explained below with reference to the drawings. When the present invention is applied to manufacturing the lens cap 6 shown in FIG. 1, a lower graphite jig 14 and an upper graphite jig 15 as shown in FIG. 4 are used.
この下部グラフアイト治具14は上面に金属シエル7の
下部フランジ7bの外径よりやや大きい外径と、筒状部
7aの内径よりやや小さい内径と、筒状部7aの高さよ
り大きい深さの筒状溝16を有する。又、この筒状溝1
6で囲まれた円柱状部分17の上面には金属シエル7
・のレンズ封着穴9に対応する大きさのレンズ逃げ穴1
8が形成されている。又、上部グラフアイト治具15は
筒状溝16の外径よりやや小さい外径と、金属シエル7
の筒状部7aの外径よりやや大きい内径の筒状体で構成
されている。尚、各治具をグラフアイト(或はカーボン
)製にする理由は、グラフアイト面を予備酸化膜面に接
触させて全体加熱すると、グラフアイト面には溶融ガラ
スがなじみ難く、しかもグラフアイト面は予備酸化膜に
対して還元性があつて、予備酸化膜を還元除去する作用
があるためである。次に上記各治具14,15によるレ
ンズキヤツプ6の製造要領を説明する。This lower graphite jig 14 has an outer diameter slightly larger than the outer diameter of the lower flange 7b of the metal shell 7, an inner diameter slightly smaller than the inner diameter of the cylindrical part 7a, and a depth larger than the height of the cylindrical part 7a. It has a cylindrical groove 16. Also, this cylindrical groove 1
A metal shell 7 is placed on the top surface of the cylindrical portion 17 surrounded by 6.
・Lens escape hole 1 of a size corresponding to the lens sealing hole 9
8 is formed. Further, the upper graphite jig 15 has an outer diameter slightly smaller than the outer diameter of the cylindrical groove 16, and a metal shell 7.
It is composed of a cylindrical body having an inner diameter slightly larger than the outer diameter of the cylindrical portion 7a. The reason why each jig is made of graphite (or carbon) is that when the graphite surface is brought into contact with the pre-oxidized film surface and the whole is heated, molten glass is difficult to blend into the graphite surface. This is because it has a reducing property to the pre-oxidized film and has the effect of reducing and removing the pre-oxidized film. Next, the procedure for manufacturing the lens cap 6 using the above-mentioned jigs 14 and 15 will be explained.
まず下部グラフアイト治具14の筒状溝16に予備酸化
を十分にした金属シエル7の下部フランジ7bと筒状部
7aを嵌挿する。すると金属シエル7の上部フランジ7
cの下面が下部グラフアイト治具14の円柱状部分17
の上端面に接触し、レンズ封着穴9とレンズ逃げ穴18
が一致する。つまり、金属シエル7は内面が円柱状部分
17の上端面及び周向に接触して保持される。次に、金
属シエル7の上部フランジ7c上にガラス円板11を載
置し、他方、筒状溝16に上部グラフアイト治具15を
嵌挿して、上部グラフアイト治具15を金属シエル7の
下部フランジ7b上に載せる。これが第4図に示す状態
で、この時、上部グラフアイト治具15は金属シエル7
を押える錘りとして作用し、上部フランジ7cの下面を
下部グラフアイト治具14の円柱状部分17の上端面に
圧接させると共に、筒状部7aの外周面に近接する。そ
して、この状態に於て、全体を窒素等の中性ガスや、弱
還元性ガスの雰囲気中に入れて、約1000℃に加熱す
る。すると、ガラス円板11が溶融して、第5図に示す
ように、金属シエル7のレンズ封着穴9の周縁にガラス
レンズ8が所定の形状で形成される。つまり、金属シエ
ル7の予備酸化膜の量が多くても、上部フランジ7cの
下面は下部グラフアイト治具14の円柱状部分17の上
端面に接触して、而も還元されるため、この土部フラン
ジ7cの下面には溶融ガラスがなじまず、溶融ガラスは
レンズ逃げ穴18へ逃げて、ここで表面張力により所定
の大きさに湾曲する。又、上部フランジ7cの上面の酸
化膜は還元されないため、ここに溶融ガラスは強くなじ
んで封着され、気密性が確保される。又2筒状部7aの
外周面には上部グラフアイト治具15が近接しているた
め、溶融ガラスが筒状部7aの外周面を流れ落ちること
はなく、従つて、上部フランジ7c上にも表面張力で溶
融ガラスが盛り上り、所定形状のガラスレンズ8が形成
される。尚、下部グラフアイト治具14と上部ゲラフア
イト治具15の形状は上記例に限らず、要は金属シエル
7の内面と、レンズ封着面を除く外面の要部に接触や近
接する形状であればよい。First, the lower flange 7b and the cylindrical portion 7a of the metal shell 7, which has been sufficiently preoxidized, are fitted into the cylindrical groove 16 of the lower graphite jig 14. Then, the upper flange 7 of the metal shell 7
The lower surface of c is the cylindrical part 17 of the lower graphite jig 14
The lens sealing hole 9 and the lens escape hole 18
matches. In other words, the inner surface of the metal shell 7 is held in contact with the upper end surface and circumferential direction of the cylindrical portion 17 . Next, the glass disk 11 is placed on the upper flange 7c of the metal shell 7, and the upper graphite jig 15 is inserted into the cylindrical groove 16. Place it on the lower flange 7b. This is the state shown in FIG. 4. At this time, the upper graphite jig 15 is attached to the metal shell 7
The lower surface of the upper flange 7c is brought into pressure contact with the upper end surface of the cylindrical portion 17 of the lower graphite jig 14, and is close to the outer peripheral surface of the cylindrical portion 7a. In this state, the whole is placed in an atmosphere of a neutral gas such as nitrogen or a weakly reducing gas, and heated to about 1000°C. Then, the glass disk 11 is melted, and the glass lens 8 is formed in a predetermined shape around the periphery of the lens sealing hole 9 of the metal shell 7, as shown in FIG. In other words, even if the amount of preliminary oxidation film on the metal shell 7 is large, the lower surface of the upper flange 7c comes into contact with the upper end surface of the cylindrical portion 17 of the lower graphite jig 14 and is reduced. The molten glass does not conform to the lower surface of the flange 7c, and the molten glass escapes to the lens escape hole 18, where it is curved to a predetermined size due to surface tension. Further, since the oxide film on the upper surface of the upper flange 7c is not reduced, the molten glass is tightly adhered thereto and sealed, thereby ensuring airtightness. Furthermore, since the upper graphite jig 15 is close to the outer peripheral surface of the second cylindrical portion 7a, the molten glass does not flow down the outer peripheral surface of the cylindrical portion 7a, and therefore the surface does not flow down onto the upper flange 7c. The molten glass rises due to the tension, and a glass lens 8 having a predetermined shape is formed. Note that the shapes of the lower graphite jig 14 and the upper gelaphite jig 15 are not limited to the above example, but may have a shape that comes into contact with or close to the inner surface of the metal shell 7 and the main part of the outer surface excluding the lens sealing surface. Bye.
以上説明したように、本発明によれば金属シエルの予備
酸化膜の量を十分に多くしても、金属シエルのガラスと
の接着の必要部以外はグラフアイト治具で囲まれてガラ
ス溶着されるため、必要部以外に溶融ガラスが流れず、
従つて、ガラスレンズの気密性に対する信頼性を向上で
きると共に、レンズ形状を常に安定して確保でき、製品
の良品率の向上が図れる。As explained above, according to the present invention, even if the amount of the pre-oxidized film on the metal shell is sufficiently increased, the parts of the metal shell other than those necessary for adhesion to the glass are surrounded by a graphite jig and the glass is welded. This prevents molten glass from flowing outside of the necessary areas.
Therefore, the reliability of the airtightness of the glass lens can be improved, the lens shape can always be maintained stably, and the rate of non-defective products can be improved.
又、レンズ形状の不安や、気密性不良の心配がなくなる
ため、封着温度の管理幅を緩和できる。Furthermore, since there is no need to worry about the shape of the lens or poor airtightness, the control range for the sealing temperature can be relaxed.
第1図は光半導体用レンズキヤツプを用いた光半導体装
置の側断面図、第1図は従来のレンズキヤツプ製造装置
の断面図、第3図は従頼製法による不良レンズキヤツプ
の断面図、第4図は本発明による製造方法を実施する装
置の例を示す断面図、第5図は第4図装置のレンズキヤ
ツプ製造後の断面図である。
6・・・・・・レンズキヤツプ、7・・・・・・金属シ
エル、7a・・・・・・筒状部、7b・・・・・・下部
フランジ、7c・・・・・・上部フランジ、8・・・・
・・ガラスレンズ、9・・・・・・レンズ封着穴. 1
1・・・・・・ガラス円板、14・・・・・・下部グラ
フアイト治具、15・・・・・・上部グラフアイト治具
、16・・・・・・筒状溝、17・・・・・・円柱状部
分、18・・・・・ルンズ逃げ孔。Fig. 1 is a side sectional view of an optical semiconductor device using a lens cap for optical semiconductors, Fig. 1 is a sectional view of a conventional lens cap manufacturing apparatus, Fig. 3 is a sectional view of a defective lens cap made by a conventional manufacturing method, FIG. 4 is a cross-sectional view showing an example of an apparatus for carrying out the manufacturing method according to the present invention, and FIG. 5 is a cross-sectional view of the apparatus shown in FIG. 4 after the lens cap is manufactured. 6... Lens cap, 7... Metal shell, 7a... Cylindrical part, 7b... Lower flange, 7c... Upper flange. , 8...
...Glass lens, 9...Lens sealing hole. 1
1... Glass disc, 14... Lower graphite jig, 15... Upper graphite jig, 16... Cylindrical groove, 17. ...Cylindrical part, 18...Lunzu escape hole.
Claims (1)
たレンズ封着穴にガラスを溶着してレンズキャップを形
成する方法に於て、前記金属シェルの少なくともガラス
溶着面以外の部分にグラファイト治具を接触させた状態
で、レンズ封着穴にガラスを溶着するようにしたことを
特徴とする光半導体用レンズキャップの製造方法。 2 前記グラファイト治具は、前記金属シェルの下部フ
ランジが嵌入する幅の、かつ金属シェルの筒状部の高さ
よりも深い筒状溝と、この筒状溝で囲まれる円柱状部分
の上端面に金属シェルのレンズ封着孔と対応する大きさ
のレンズ逃げ孔とを有する下部グラファイト治具と、前
記筒状溝に嵌合する筒状の上部グラファイト治具とより
なる、特許請求の範囲第1項に記載の光半導体用レンズ
キャップの製造方法。[Scope of Claims] 1. In a method of forming a lens cap by welding glass to a lens sealing hole formed in the upper end of a metal shell whose entire surface is pre-oxidized, at least the glass welding surface of the metal shell A method for manufacturing a lens cap for an optical semiconductor, characterized in that glass is welded to a lens sealing hole while a graphite jig is in contact with other parts. 2. The graphite jig has a cylindrical groove having a width into which the lower flange of the metal shell fits and is deeper than the height of the cylindrical part of the metal shell, and an upper end surface of a cylindrical part surrounded by this cylindrical groove. Claim 1, comprising a lower graphite jig having a lens escape hole of a size corresponding to the lens sealing hole of the metal shell, and a cylindrical upper graphite jig that fits into the cylindrical groove. The method for manufacturing a lens cap for optical semiconductors as described in 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54095237A JPS5940312B2 (en) | 1979-07-25 | 1979-07-25 | Manufacturing method of lens cap for optical semiconductors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54095237A JPS5940312B2 (en) | 1979-07-25 | 1979-07-25 | Manufacturing method of lens cap for optical semiconductors |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5619685A JPS5619685A (en) | 1981-02-24 |
JPS5940312B2 true JPS5940312B2 (en) | 1984-09-29 |
Family
ID=14132146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54095237A Expired JPS5940312B2 (en) | 1979-07-25 | 1979-07-25 | Manufacturing method of lens cap for optical semiconductors |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5940312B2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0736452B2 (en) * | 1985-04-30 | 1995-04-19 | 関西日本電気株式会社 | Lens cap manufacturing method |
JP4504662B2 (en) * | 2003-04-09 | 2010-07-14 | シチズン電子株式会社 | LED lamp |
JP4919488B2 (en) * | 2004-10-21 | 2012-04-18 | パナソニック株式会社 | Lighting device |
JP4679264B2 (en) * | 2005-06-27 | 2011-04-27 | パナソニック株式会社 | Lens cap manufacturing method |
KR100774218B1 (en) | 2006-09-28 | 2007-11-08 | 엘지전자 주식회사 | Lens, a method for manufacturing it and light emitting device package |
JP2014145859A (en) * | 2013-01-28 | 2014-08-14 | Panasonic Corp | Manufacturing method of lid body with lens |
WO2014118838A1 (en) * | 2013-01-29 | 2014-08-07 | パナソニック株式会社 | Ultraviolet light emitting device |
DE102018105171A1 (en) * | 2018-03-07 | 2019-09-12 | Schott Ag | Lens cap, photodiode with a lens cap and method of making the same |
-
1979
- 1979-07-25 JP JP54095237A patent/JPS5940312B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5619685A (en) | 1981-02-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3190952A (en) | Welded hermetic seal | |
JPS5940312B2 (en) | Manufacturing method of lens cap for optical semiconductors | |
JP4385062B2 (en) | Infrared detector manufacturing method | |
US2977561A (en) | Hermetically sealed electrical component and method of making the same | |
JPH0637401A (en) | Optical semiconductor vessel | |
JP2560129B2 (en) | Semiconductor laser device | |
JP2560136B2 (en) | Semiconductor laser device | |
JP2560128B2 (en) | Semiconductor laser device | |
US3125709A (en) | Housing assembly | |
US3117179A (en) | Transistor capsule and header therefor | |
JP2588517Y2 (en) | Semiconductor laser device | |
JP2560135B2 (en) | Method for filling transparent resin in semiconductor laser device | |
JPS622771Y2 (en) | ||
JPS5915080Y2 (en) | semiconductor equipment | |
JPH01239958A (en) | Airtightly sealed semiconductor element | |
JPS604390Y2 (en) | airtight terminal | |
KR830002575B1 (en) | Manufacturing method of hermetic terminal | |
KR800001154Y1 (en) | Press type stem | |
JPS588586B2 (en) | Sealing method for semiconductor devices | |
JPS5842764A (en) | Plating method | |
JPH0342686Y2 (en) | ||
JPS5941309B2 (en) | Lens cap manufacturing method | |
JPS59172255A (en) | Airtight terminal with ground lead wire and manufacture thereof | |
JPS63122250A (en) | Semiconductor device | |
JPH04121768U (en) | semiconductor laser equipment |