JP2560136B2 - Semiconductor laser device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor laser device using a semiconductor laser chip as a light emitting element of a laser, in which a portion of the semiconductor laser chip is sealed with a cap body. And a so-called can-seal type semiconductor laser device.

[Conventional technology]

In this type of Canseal type semiconductor laser device,
Sealing the portion of the semiconductor laser chip with a cap body prevents the semiconductor laser chip from deteriorating due to humidity and dust in the atmosphere, and the semiconductor laser chip is contacted from the outside and impact, etc. To protect against.

Therefore, conventionally, in this type of Canseal type semiconductor laser device, as is well known, the stem die-bonded to the semiconductor laser chip and the cap body for the semiconductor laser chip are made of carbon steel,
The entire circumference of the lower end of the cap body is fixed to the stem by resistance welding, while the transparent plate made of glass is fixed to the cap body by using glass solder, thereby I try to ensure airtightness.

When fixing a transparent plate made of glass to the cap body with glass solder, for example, in Japanese Utility Model Laid-Open No. 62-58.
As described in detail in Japanese Patent No. 066, a ring-shaped glass solder is manufactured by first press-molding glass powder into a ring and then calcining the ring, and the ring-shaped glass solder and a glass transparent body. And are loaded into the cap body, and in this state the whole is baked at a high temperature of 500 to 600 ° C. to melt the glass solder, thereby fixing the transparent plate to the cap body with the glass solder. .

[Problems to be Solved by the Invention]

However, in this way, the method of fixing the transparent plate to the cap body with the glass solder has the advantage that the fixing can be made firm and the cap body can be kept highly airtight, while the ring-shaped glass solder is used. In addition to the manufacturing process and the baking process at a high temperature, a post-processing process of nickel-plating the cap body that has been discolored by the baking at a high temperature after pickling it is necessary. In addition, it is necessary to previously form a protective film on the glass transparent plate so as not to damage the surface of the transparent plate during pickling and plating in the post-treatment step. Therefore, there is a problem that fixing the transparent plate to the cap body in a completely sealed state increases the cost and the cost of the semiconductor laser device is significantly increased. .

Therefore, Japanese Utility Model Application Laid-Open No. 61-83067 as the prior art discloses that the cap body is filled with a hard transparent resin,
By sealing the semiconductor laser chip with this transparent resin, it is proposed to omit providing the transparent plate with high airtightness to the cap body.

However, in this prior art, the semiconductor laser chip is directly sealed by the hard transparent resin filled in the cap body, and the expansion / contraction of the hard transparent resin due to temperature change or the like causes the semiconductor laser chip, Since the thin metal wire connected to the semiconductor laser chip is directly affected, there is a possibility that the property of the semiconductor laser chip may be changed or the thin metal wire may be broken. there were.

The present invention is directed to reliably prevent this problem, that is, changing the property of the semiconductor laser chip when the semiconductor laser chip is sealed with a transparent resin, or causing a break in a thin metal wire. It is a specific subject.

[Means for solving the problem]

In order to achieve this technical problem, the present invention provides a conductor laser device comprising: a stem to which a semiconductor laser chip is fixed, and a cap member fixed to the stem so as to be fitted to the semiconductor laser chip. While providing an opening in a portion of the semiconductor laser chip facing the front cleavage surface of the semiconductor laser chip, a soft transparent resin coated to cover the semiconductor laser chip in the cap body, and the opening in the cap body A hard transparent resin filled so as to be clogged up is provided. "

[Functions and effects of the invention]

With this configuration, the laser light emitted from the front cleavage surface at the tip of the semiconductor laser chip passes through the soft transparent resin that covers the semiconductor laser chip, and the hard transparent resin filled in the cap body, The light is emitted from the surface of the hard transparent resin into the atmosphere.

In this case, the present invention does not seal the semiconductor laser chip only with the hard transparent resin filled in the cap body as in the prior art, but with the soft transparent resin coated on the semiconductor laser chip and the cap. Since it is to be sealed with both the hard transparent resin filled in the body, the semiconductor laser chip can be tightly sealed by the hard transparent resin filled in the cap body, while in this hard transparent resin The expansion / contraction of the semiconductor laser chip and the thin metal wire connected to the semiconductor laser chip due to temperature change can be greatly reduced by the soft transparent resin previously applied to the semiconductor laser chip.

Therefore, according to the present invention, when the cap body is filled with the transparent resin and the provision of the transparent plate on the cap body is omitted, the properties of the semiconductor laser chip are changed or the thin metal wire is broken. It has an effect that it is possible to surely reduce the occurrence.

〔Example〕

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of the present invention will be described with reference to the drawings (FIGS. 1 to 3). A cap body 4 formed in a tubular shape so as to have an opening 3 in a plate
1 shows a semiconductor laser device constituted by the above.

A block body 5 integrally formed on the upper surface of the stem 2
A submount 6 equipped with a monitoring photodiode 7 is fixed to the side surface of the semiconductor laser chip 8, and a front cleavage plane 8a of the semiconductor laser chip 8 is provided on the surface of the submount 6. Direction, and the rear cleavage surface 8b is die-bonded so as to face the direction of the photodiode 7.

Further, a relatively soft transparent resin 9 such as a silicone resin is applied to the semiconductor laser chip 8 and the photodiode 7 so as to cover the entire surfaces of the semiconductor laser chip 8 and the photodiode 7. Has been done. The soft transparent resin 9 is used after wire bonding with a thin metal wire between the semiconductor laser chip 8 and the submount 6 and between the submount 6 and each lead terminal 10b, 10c described later. , Apply.

Reference numerals 10a, 10b, 10c denote lead terminals for the semiconductor laser chip 8 and the photodiode 7, and the lead terminals 10a of the lead terminals 10a, 10b, 10c are integrated.
Is fixed to the lower surface of the stem 2 by welding or the like, and the other two lead terminals 10b, 10c are holes 2a, 2b formed in the stem 2.
It is fixed inside by an insulating sealing material 11 such as glass in an insulating sealing state.

Further, the cap body 4 is fixed to the block body 5 with the semiconductor laser chip 8 by fitting the block body 5 with the semiconductor laser chip 8 and then welding the outward flange portion 4a at the lower end thereof to the stem 2. In addition, the fixation of the cap body 4 to the stem 2 means that the lead terminals 10a, 10b,
10c is fixed, the submount 6 and the semiconductor laser chip 8 are die-bonded to the block body 5, and between the semiconductor laser chip 8 and the submount 6 and between both lead terminals 10b and 10c of the submount 6. This is performed after wire bonding with a thin metal wire is applied to the above, and the soft transparent resin 9 is applied.

Also, the rear cleavage plane of the semiconductor laser chip 8
Laser light for monitoring emitted from 8a is guided to the photodiode 7 through the semiconductor laser chip 8 and the soft transparent resin 9 coated on the entire surfaces of the photodiode 7.

Then, the cap body 4 is filled with a hard transparent resin 12, such as an epoxy resin, so as to fill the opening 3 in the cap body 4.

According to this structure, the laser light emitted from the front cleavage plane 8a at the tip of the semiconductor laser chip 8 passes through the soft transparent resin 8 covering the portion of the semiconductor laser chip 8 and the hard body filled in the cap body 4. While passing through the transparent resin 12 and being emitted into the atmosphere from the surface 12a of the hard transparent resin 12, the entire surfaces of the semiconductor laser chip 8 and the photodiode 7 are covered with the hard transparent resin 12. Thus, the contact of humidity and dust to the semiconductor laser chip 8 and the photodiode 7 can be blocked by the hard transparent resin 12.

The filling of the hard transparent resin 12 into the cap body 4 is performed by the nozzle 13 after the cap body 4 is fixed to the stem 2 as shown in FIG. In order to form the surface 12a of the resin 12 into a flat surface, the surface of the hard transparent resin 12 is cured as it is, or just before the hard transparent resin 12 is cured. The flat plate having the property may be pressed, or further, or after the hard transparent resin 12 is cured, the surface thereof may be finished into a flat surface by polishing. Further, it goes without saying that the cap body 4 is not limited to being made of metal and may be made of non-transparent synthetic resin.

[Brief description of drawings]

The drawings show the embodiments of the present invention. Fig. 1 is a vertical sectional front view, Fig. 2 is a sectional view taken along line II-II of Fig. 1, Fig. 3 is an enlarged view of an essential part of Fig. 1, and Fig. 4 is It is sectional drawing which shows the state in which hard transparent resin is filled. 1 ... Semiconductor laser device, 2 ... Stem, 3 ... Aperture, 4 ... Cap body, 5 ... Block body, 6 ... Submount, 7 ... Monitor photodiode, 8 ...
Semiconductor laser chip, 8a ... Front cleavage plane of semiconductor laser chip, 8b ... Rear cleavage plane of semiconductor laser chip, 9 ...
… Soft transparent resin, 10a, 10b, 10c …… Lead terminals, 12 ……
Hard transparent resin, 12a: Surface of hard transparent resin.

Claims (1)

(57) [Claims] A stem to which a semiconductor laser chip is fixed;
In a conductor laser device including a cap body fixed to the stem so as to be fitted to the semiconductor laser chip, an opening is provided in a portion of the cap body facing a front cleavage plane of the semiconductor laser chip, A semiconductor laser device characterized in that a soft transparent resin applied so as to cover the semiconductor laser chip is provided in the cap body, and a hard transparent resin filled so as to fill the opening of the cap body in the cap body. .