JPS63121448U - - Google Patents

Info

Publication number
JPS63121448U
JPS63121448U JP1987013180U JP1318087U JPS63121448U JP S63121448 U JPS63121448 U JP S63121448U JP 1987013180 U JP1987013180 U JP 1987013180U JP 1318087 U JP1318087 U JP 1318087U JP S63121448 U JPS63121448 U JP S63121448U
Authority
JP
Japan
Prior art keywords
wiring conductor
protruding electrode
dam
electrode
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987013180U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0744018Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987013180U priority Critical patent/JPH0744018Y2/ja
Publication of JPS63121448U publication Critical patent/JPS63121448U/ja
Application granted granted Critical
Publication of JPH0744018Y2 publication Critical patent/JPH0744018Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods

Landscapes

  • Wire Bonding (AREA)
JP1987013180U 1987-01-31 1987-01-31 突起電極部構造 Expired - Lifetime JPH0744018Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987013180U JPH0744018Y2 (ja) 1987-01-31 1987-01-31 突起電極部構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987013180U JPH0744018Y2 (ja) 1987-01-31 1987-01-31 突起電極部構造

Publications (2)

Publication Number Publication Date
JPS63121448U true JPS63121448U (no) 1988-08-05
JPH0744018Y2 JPH0744018Y2 (ja) 1995-10-09

Family

ID=30801996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987013180U Expired - Lifetime JPH0744018Y2 (ja) 1987-01-31 1987-01-31 突起電極部構造

Country Status (1)

Country Link
JP (1) JPH0744018Y2 (no)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0364925A (ja) * 1989-07-26 1991-03-20 Internatl Business Mach Corp <Ibm> 集積回路チツプ実装構造及びその形成方法
JP2007012826A (ja) * 2005-06-29 2007-01-18 Nippon Inter Electronics Corp 電極構造

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58157147A (ja) * 1982-03-12 1983-09-19 Mitsubishi Electric Corp 混成集積回路基板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58157147A (ja) * 1982-03-12 1983-09-19 Mitsubishi Electric Corp 混成集積回路基板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0364925A (ja) * 1989-07-26 1991-03-20 Internatl Business Mach Corp <Ibm> 集積回路チツプ実装構造及びその形成方法
JP2007012826A (ja) * 2005-06-29 2007-01-18 Nippon Inter Electronics Corp 電極構造
JP4666608B2 (ja) * 2005-06-29 2011-04-06 日本インター株式会社 電極構造の製造方法

Also Published As

Publication number Publication date
JPH0744018Y2 (ja) 1995-10-09

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