JPS63121448U - - Google Patents

Info

Publication number
JPS63121448U
JPS63121448U JP1987013180U JP1318087U JPS63121448U JP S63121448 U JPS63121448 U JP S63121448U JP 1987013180 U JP1987013180 U JP 1987013180U JP 1318087 U JP1318087 U JP 1318087U JP S63121448 U JPS63121448 U JP S63121448U
Authority
JP
Japan
Prior art keywords
wiring conductor
protruding electrode
dam
electrode
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987013180U
Other languages
Japanese (ja)
Other versions
JPH0744018Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987013180U priority Critical patent/JPH0744018Y2/en
Publication of JPS63121448U publication Critical patent/JPS63121448U/ja
Application granted granted Critical
Publication of JPH0744018Y2 publication Critical patent/JPH0744018Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、この考案の突起電極部構造の実施例
の説明に供する概略的な基板断面図、第２図は、
この考案の他の実施例の説明に供する概略的基板
断面図、第３図は、従来技術の説明に供する概略
的な基板断面図である。 １１……基板、１３……接着層、１５……配線
導体、１７……配線パターン、１９，３３，４１
……接着面、２１……ダム、２３……突起電極、
２５……突起電極部、２７，３９……穴、２９，
３５……側壁、３１，３７……底面。 FIG. 1 is a schematic cross-sectional view of a substrate for explaining an embodiment of the projecting electrode structure of this invention, and FIG.
FIG. 3 is a schematic cross-sectional view of a substrate for explaining another embodiment of the present invention, and FIG. 3 is a schematic cross-sectional view of a substrate for explaining the prior art. 11... Board, 13... Adhesive layer, 15... Wiring conductor, 17... Wiring pattern, 19, 33, 41
...adhesive surface, 21 ... dam, 23 ... protruding electrode,
25... Projection electrode part, 27, 39... Hole, 29,
35...Side wall, 31, 37...Bottom surface.

Claims (1)

【実用新案登録請求の範囲】 配線導体と、該配線導体に設けたダムと、該ダ
ムの内側で前記配線導体と突起電極とを接着させ
てなる突起電極部構造において、 前記配線導体と前記突起電極との接着面を、配
線導体の表面から下方に垂直に設けられた側壁、
又は下方に向かうに従つて接近するよう設けられ
た側壁を有する穴の内面としたことを特徴とする
突起電極部構造。[Scope of Claim for Utility Model Registration] A protruding electrode part structure comprising a wiring conductor, a dam provided on the wiring conductor, and the wiring conductor and the protruding electrode bonded inside the dam, the wiring conductor and the protrusion. A side wall provided perpendicularly downward from the surface of the wiring conductor so that the adhesive surface with the electrode is
Alternatively, a protruding electrode structure characterized in that the inner surface of the hole has side walls that approach each other as they move downward.
JP1987013180U 1987-01-31 1987-01-31 Projection electrode structure Expired - Lifetime JPH0744018Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987013180U JPH0744018Y2 (en) 1987-01-31 1987-01-31 Projection electrode structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987013180U JPH0744018Y2 (en) 1987-01-31 1987-01-31 Projection electrode structure

Publications (2)

Publication Number Publication Date
JPS63121448U true JPS63121448U (en) 1988-08-05
JPH0744018Y2 JPH0744018Y2 (en) 1995-10-09

Family

ID=30801996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987013180U Expired - Lifetime JPH0744018Y2 (en) 1987-01-31 1987-01-31 Projection electrode structure

Country Status (1)

Country Link
JP (1) JPH0744018Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0364925A (en) * 1989-07-26 1991-03-20 Internatl Business Mach Corp <Ibm> Integrated circuit packaging structure and formation thereof
JP2007012826A (en) * 2005-06-29 2007-01-18 Nippon Inter Electronics Corp Electrode structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58157147A (en) * 1982-03-12 1983-09-19 Mitsubishi Electric Corp Hybrid integrated circuit substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58157147A (en) * 1982-03-12 1983-09-19 Mitsubishi Electric Corp Hybrid integrated circuit substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0364925A (en) * 1989-07-26 1991-03-20 Internatl Business Mach Corp <Ibm> Integrated circuit packaging structure and formation thereof
JP2007012826A (en) * 2005-06-29 2007-01-18 Nippon Inter Electronics Corp Electrode structure
JP4666608B2 (en) * 2005-06-29 2011-04-06 日本インター株式会社 Method for manufacturing electrode structure

Also Published As

Publication number Publication date
JPH0744018Y2 (en) 1995-10-09

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