JPS63119234A - X-ray mask for x-ray exposure device - Google Patents
X-ray mask for x-ray exposure deviceInfo
- Publication number
- JPS63119234A JPS63119234A JP61263726A JP26372686A JPS63119234A JP S63119234 A JPS63119234 A JP S63119234A JP 61263726 A JP61263726 A JP 61263726A JP 26372686 A JP26372686 A JP 26372686A JP S63119234 A JPS63119234 A JP S63119234A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- pattern
- ray
- holding substrate
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000004891 communication Methods 0.000 claims description 5
- 239000012528 membrane Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、Ｘ線露光装置におけるパターン転写用マスク
に係り、特にパターン面の平坦性の維持、搬送時のパタ
ーン面への異物付着の防止に好適なＸ線用マスクに関す
る。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a pattern transfer mask for an X-ray exposure device, and in particular, to maintenance of flatness of a pattern surface and prevention of foreign matter adhering to the pattern surface during transportation. The present invention relates to an X-ray mask suitable for.
従来Ｘ線用マスクは、特公昭５３−２４７８５号に。 The conventional X-ray mask was published in Japanese Patent Publication No. 53-24785.
記載のように枠材にパターン膜支持下層（以下メ。As described, attach the patterned membrane support lower layer (hereinafter referred to as ``me'') to the frame material.
ンプレンと称す）を張った構造をしており、枠材。It has a structure covered with a frame material.
外周部はパターン面に対して垂直となっていた。５Ｘ１
ｓ露光では、一般にマスクパターン面が下向き。The outer periphery was perpendicular to the pattern surface. 5X1
In s exposure, the mask pattern surface generally faces downward.
どなる様マスク裏面をマスクチャックに吸着して。Attach the back of the mask to the mask chuck.
使用するが、上記従来例の如きマスクを露光装置。However, a mask like the above conventional example is used in an exposure device.
外部からマスクチャックまで搬送し、装着するに。Transport it from the outside to the mask chuck and attach it.
は−度パターン面を搬送用チャックで吸着してマ、。Then, the patterned surface is adsorbed using a transport chuck.
スフチャックに受渡す必要があった。It had to be handed over to Sufchak.
上記従来技術ではパターン面を吸着せずにマス。 With the above conventional technology, the pattern surface is massed without being adsorbed.
り搬送を行う点について配慮がされておらず、パ。No consideration was given to the point of transportation by
ターン面に異物が付着するという問題があった。１゜ま
た、一般にＸ線用マスクに使用するマスク枠材はシリコ
ンの場合が多いが、シリコンはもろい性質を有している
ためこわれやすく、取扱いに注意を要する。従来技術で
は、この問題を解決する方法としてリング状のガラス基
板に接着によりマ、。There was a problem with foreign matter adhering to the turn surface. 1. Furthermore, the mask frame material generally used for X-ray masks is often made of silicon, but silicon has brittle properties and is easily broken, so care must be taken when handling it. In the conventional technology, as a way to solve this problem, a ring-shaped glass substrate is bonded.
スフを保持したものが知られている。しかし、マ。It is known that it retains sufu. But Ma.
スフを接着により固定保持したものは、接着剤の。If the cloth is fixed and held by adhesive, it is made of adhesive.
硬化時に発生する歪および使用時のマスクと接着。Distortion that occurs during curing and adhesion to the mask during use.
剤の熱膨張による歪によりマスクパターン面の平。The mask pattern surface becomes flat due to distortion due to thermal expansion of the agent.
坦性が損われるという欠点があった。 ５本発
明の目的は、マスクパターン面の平坦性を。There was a drawback that flatness was impaired. 5. The purpose of the present invention is to improve the flatness of the mask pattern surface.
損わず、しかもパターン面には接触せずに搬送可。It can be transported without damage and without contacting the pattern surface.
能なｘｉｉｉ光装置用ＸＩＩ用マスクを提供すること。To provide an XII mask for an XIII optical device that is capable of performing XIII.
にある。It is in.
〔問題点を解決するための手段） １０
上記目的は、マスク支持枠外周部にパターン側。[Means to solve the problem] 10
The above purpose is to create a pattern on the outer periphery of the mask support frame.
でマスク中心側に傾斜した斜面を形成し、この斜。This slope forms a slope that slopes toward the center of the mask.
面を利用してリング状の保持基板に機械的にマスクを挾
持することにより達成される。This is achieved by mechanically holding the mask on a ring-shaped holding substrate using its surfaces.
マスクを保持基板に機械的に保持することは、保持力を
適当に加減でき、接着による歪よりも十分少さな歪で保
持可能である。従ってマスク平坦性は損われない。更に
搬送時には、マスクを機械的保持により一体化した保持
基板の上下面を必要に応じて適当にハンドリングするこ
とにより、マ。By mechanically holding the mask on the holding substrate, the holding force can be adjusted appropriately, and the mask can be held with sufficiently less strain than that caused by adhesion. Therefore, mask flatness is not impaired. Furthermore, during transportation, the upper and lower surfaces of the holding substrate, on which the mask is mechanically held and integrated, are appropriately handled as necessary.
スフパターン面には一切触れずに搬送ができ、異。It is unique because it can be transported without touching the surface of the fabric pattern.
物付着の心配がなし・。No need to worry about things sticking to it.
以下、本発明の一実施例を第１図、第２図によ。 An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.
り説明する。例えば、ＸｇＪ露光装置として特開昭。I will explain. For example, JP-A-Sho as an XgJ exposure device.
５７−１６９２４２号がある。このＸ線露光装置に装。There is No. 57-169242. mounted on this X-ray exposure device.
着されるＸＭマスクについて説明する。第１図は。The XM mask worn will be explained. Figure 1 is.
断面図を示し、第２図は第１図のＡ検図を示した。A cross-sectional view is shown, and FIG. 2 shows an A inspection drawing of FIG. 1.
ものである。図において１は軟Ｘ線吸収パターン、。It is something. In the figure, 1 is a soft X-ray absorption pattern.
膜、２はメンブレン、６はマスク支持枠を示し、。2 is a membrane, and 6 is a mask support frame.
メンブレン２は厚さ数μｍ、マスク支持枠３は厚。The membrane 2 is several μm thick, and the mask support frame 3 is thick.
さ０．５〜２ｍである。マスク支持枠６の外周部にはパ
ターン側でマスク中心側に傾斜した斜面４が形成しであ
る。本発明の特徴はこの斜面４を利用。５して、平坦に
加工された取付面を有する保持基板５にマスクを機械的
に保持する点にある。すなわち保持基板５には、固定保
持具６と弾性体７によってマスク中心向に付勢する可動
保持具８が設けてあり、可動保持具８をマスク支持枠３
に形成し・ ３ ・
た斜面４に押し付けることで、マスクを保持基板。The height is 0.5 to 2 m. On the outer periphery of the mask support frame 6, a slope 4 is formed which is inclined toward the mask center on the pattern side. The feature of the present invention is to utilize this slope 4. 5, the mask is mechanically held on a holding substrate 5 having a flat mounting surface. That is, the holding substrate 5 is provided with a movable holder 8 that is urged toward the center of the mask by a fixed holder 6 and an elastic body 7, and the movable holder 8 is attached to the mask support frame 3.
3. Hold the mask by pressing it against the slope 4 formed on the substrate.
５に確実に保持することが可能となる。弾性体７゜の中
心向の付勢力は、マスクの重量を支える程度。5 can be reliably maintained. The biasing force toward the center of the elastic body 7° is sufficient to support the weight of the mask.
で十分であり数１０ ｇの力である。９，１０は搬逃時
の搬送チャック、マスクチャック等への接触面。A force of several tens of grams is sufficient. Reference numerals 9 and 10 are surfaces that come into contact with the transport chuck, mask chuck, etc. during transport and escape.
を示す。マスクを露光装置外部からマスクパター。shows. Putter the mask from outside the exposure equipment.
りまで搬送し、装着する際保持基板５の上下面９゜１０
をハンドリングすることによりマスクパター。When transporting and mounting the holding board 5, the upper and lower surfaces of the holding board 5
By handling the mask putter.
ン面には一切触れずに搬送が可能となる。１１，１２゜
は真空吸着用の連通穴を示す。連通穴を通して７スフを
真空吸着することにより、マスク支持枠３゜を保持基板
５のマスク取付面に完全に密着させる。It is possible to transport the product without touching the surface at all. 11 and 12 degrees indicate communicating holes for vacuum suction. The mask support frame 3° is brought into close contact with the mask mounting surface of the holding substrate 5 by vacuum suctioning the 7 blocks through the communication hole.
ことが可能となる。マスク支持枠３の厚さが薄く。becomes possible. The thickness of the mask support frame 3 is thin.
マスクの剛性が低い場合に特に有効である。連通。This is particularly effective when the mask has low rigidity. Communication.
穴１１は接触面９を、連通穴１２は接触面１０を・・１
゜ンドリングする際使用する。The hole 11 connects the contact surface 9, the communication hole 12 connects the contact surface 10...1
Used when winding.
以上説明したように本発明によれば、マスク支持枠外周
部にパターン側でマスク中心側に傾斜した斜面を設け、
この斜面を利用してリング状の保・ ４ ・
持基板に機械的にマスクを保持したので、マスクパター
ン面の平坦性が損われず、十分な面精度が維持できるよ
うになった。また搬送時には保持基板の上下面のみハン
ドリングし、マスクパターン面には接触しないようにし
たので異物付着の心配−もな（なった。As explained above, according to the present invention, an inclined surface is provided on the outer peripheral part of the mask support frame on the pattern side and inclined toward the mask center side,
Since the mask was mechanically held on the ring-shaped holding substrate using this slope, the flatness of the mask pattern surface was not impaired and sufficient surface precision could be maintained. Furthermore, since only the upper and lower surfaces of the holding substrate were handled during transportation, and the mask pattern surface was not contacted, there was no need to worry about foreign matter adhering.
第１図は本発明の一実施例を示す断面図、第２図は第１
図におけるＡ検図である。
１・・・軟Ｘ線吸収パターン膜、２・・・メンブレン、
３・・・マスク支持枠、４・・・斜面、５・・・保持基
板、６・・・固定保持具、７・・・弾性体、８・・・可
動保持具、９．１０・・・ハンドリング接触面、１１
、１２・・・連通穴。FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG.
This is the A inspection map in the figure. 1... Soft X-ray absorption pattern film, 2... Membrane,
3... Mask support frame, 4... Slope, 5... Holding board, 6... Fixed holder, 7... Elastic body, 8... Movable holder, 9.10... Handling contact surface, 11
, 12...Communication hole.
Claims (1)
支持枠とから成るパターン転写用マスクにおいて、マス
ク支持枠外周部にパターン側でマスク中心側に傾斜した
斜面を設け、この斜面を利用してリング状の保持基板に
機械的にマスクを挾持して成ることを特徴とするＸ線露
光装置用Ｘ線用マスク。 ２、保持基板に真空吸着用の連通穴を有することを特徴
とする特許請求の範囲第１項記載のＸ線露光装置用Ｘ線
用マスク。[Claims] 1. In a pattern transfer mask comprising a soft X-ray absorbing pattern film and a pattern film supporting lower layer mask support frame, an inclined surface is provided on the outer periphery of the mask support frame on the pattern side toward the center of the mask, An X-ray mask for an X-ray exposure apparatus, characterized in that the mask is mechanically held on a ring-shaped holding substrate using this slope. 2. The X-ray mask for an X-ray exposure apparatus according to claim 1, wherein the holding substrate has a communication hole for vacuum suction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26372686A JPH0666250B2 (en) | 1986-11-07 | 1986-11-07 | Masking equipment for proximity exposure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26372686A JPH0666250B2 (en) | 1986-11-07 | 1986-11-07 | Masking equipment for proximity exposure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63119234A true JPS63119234A (en) | 1988-05-23 |
| JPH0666250B2 JPH0666250B2 (en) | 1994-08-24 |
Family
ID=17393450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26372686A Expired - Lifetime JPH0666250B2 (en) | 1986-11-07 | 1986-11-07 | Masking equipment for proximity exposure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0666250B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02181908A (en) * | 1989-01-09 | 1990-07-16 | Canon Inc | X-ray mask structure body, x-ray aligner and x-ray exposure |
| JPH10242033A (en) * | 1997-02-28 | 1998-09-11 | Canon Inc | Mask retainer, aligner, device manufacturing method and mask structure body |
| JPH10242032A (en) * | 1997-02-28 | 1998-09-11 | Canon Inc | Mask retainer, aligner, device manufacturing method and mask structure body |
| KR100294561B1 (en) * | 1997-02-28 | 2001-10-25 | 미다라이 후지오 | Mask holding device, exposure device, device manufacturing device and mask structure |
| JP2010135578A (en) * | 2008-12-05 | 2010-06-17 | Toppan Printing Co Ltd | Mask holder, and exposure device |
| JP2011137951A (en) * | 2009-12-28 | 2011-07-14 | Lasertec Corp | Pellicle mounting device, pellicle mounting method, and method of manufacturing patterned substrate |
-
1986
- 1986-11-07 JP JP26372686A patent/JPH0666250B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02181908A (en) * | 1989-01-09 | 1990-07-16 | Canon Inc | X-ray mask structure body, x-ray aligner and x-ray exposure |
| JPH10242033A (en) * | 1997-02-28 | 1998-09-11 | Canon Inc | Mask retainer, aligner, device manufacturing method and mask structure body |
| JPH10242032A (en) * | 1997-02-28 | 1998-09-11 | Canon Inc | Mask retainer, aligner, device manufacturing method and mask structure body |
| KR100294561B1 (en) * | 1997-02-28 | 2001-10-25 | 미다라이 후지오 | Mask holding device, exposure device, device manufacturing device and mask structure |
| JP2010135578A (en) * | 2008-12-05 | 2010-06-17 | Toppan Printing Co Ltd | Mask holder, and exposure device |
| JP2011137951A (en) * | 2009-12-28 | 2011-07-14 | Lasertec Corp | Pellicle mounting device, pellicle mounting method, and method of manufacturing patterned substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0666250B2 (en) | 1994-08-24 |
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