JP2001060618A5 - Substrate adsorption and holding device and method for manufacturing an exposure device and device using the substrate adsorption and holding device - Google Patents
Substrate adsorption and holding device and method for manufacturing an exposure device and device using the substrate adsorption and holding device Download PDFInfo
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- JP2001060618A5 JP2001060618A5 JP1999233589A JP23358999A JP2001060618A5 JP 2001060618 A5 JP2001060618 A5 JP 2001060618A5 JP 1999233589 A JP1999233589 A JP 1999233589A JP 23358999 A JP23358999 A JP 23358999A JP 2001060618 A5 JP2001060618 A5 JP 2001060618A5
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- Prior art keywords
- substrate
- holding device
- roughness
- holding
- substrate adsorption
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- 239000000758 substrate Substances 0.000 title description 71
- 238000001179 sorption measurement Methods 0.000 title description 20
- 238000004519 manufacturing process Methods 0.000 title description 12
- 238000000034 method Methods 0.000 title description 2
- 230000003746 surface roughness Effects 0.000 description 4
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
Description
【特許請求の範囲】
【請求項１】 基板を支持する凸部を備え、該凸部上に支持される基板を吸着保持する基板吸着保持装置において、基板裏面側から吸着保持した際に基板表面に発生する凹凸やうねりを緩和する手段を備えていることを特徴とする基板吸着保持装置。
【請求項２】 基板を支持する凸部を備え、該凸部上に支持される基板を吸着保持する基板吸着保持装置において、基板裏面の粗さを吸収する粗さ吸収部材を介して基板を吸着保持することを特徴とする基板吸着保持装置。
【請求項３】 前記粗さ吸収部材が、基板を実質的に支持する凸部の上面と基板裏面との間に配されることを特徴とする請求項２記載の基板吸着保持装置。
【請求項４】 前記粗さ吸収部材が、基板に接する凸部の上面に配設されていることを特徴とする請求項２記載の基板吸着保持装置。
【請求項５】 前記粗さ吸収部材が、基板に接する凸部の上面に被覆されていることを特徴とする請求項２記載の基板吸着保持装置。
【請求項６】 前記粗さ吸収部材が、基板の吸着面に被覆されていることを特徴とする請求項２記載の基板吸着保持装置。
【請求項７】 基板を支持する凸部を備え、該凸部上に支持される基板を吸着保持する基板吸着保持装置において、前記凸部が粗さ吸収部材で構成されていることを特徴とする基板吸着保持装置。
【請求項８】 基板を支持する凸部を備え、該凸部上に支持される基板を吸着保持する基板吸着保持装置において、基板を実質的に支持する凸部の上面に基板裏面の粗さを吸収する薄板状の粗さ吸収部材を送り込む手段と、基板を前記薄板状の粗さ吸収部材上に送り込む手段とを備えていることを特徴とする基板吸着保持装置。
【請求項９】 基板の吸着保持が、負圧吸引と静電気力の少なくともいずれか一方の吸着力によって行なわれることを特徴とする請求項１ないし８のいずれか１項に記載の基板吸着保持装置。
【請求項１０】 前記粗さ吸収部材が基板の縦弾性率よりも低い縦弾性率を有する材料で形成されていることを特徴とする請求項２ないし８のいずれか１項に記載の基板吸着保持装置。
【請求項１１】 前記粗さ吸収部材の縦弾性率が１．３×１０11Ｎ／ｍ2 以下であることを特徴とする請求項２ないし１０のいずれか１項に記載の基板吸着保持装置。
【請求項１２】 前記粗さ吸収部材が基板裏面粗さのＰＶ値の１／２よりも厚く形成されていることを特徴とする請求項２ないし１１のいずれか１項に記載の基板吸着保持装置。
【請求項１３】 基板がシリコンウェハであり、前記粗さ吸収部材の厚さを１μｍ以上とすることを特徴とする請求項２ないし１２のいずれか１項に記載の基板吸着保持装置。
【請求項１４】 前記粗さ吸収部材が高分子化合物であることを特徴とする請求項２ないし１３のいずれか１項に記載の基板吸着保持装置。
【請求項１５】 前記粗さ吸収部材が金属、セラミック、カーボン繊維のいずれかあるいはこれらの複合材料であることを特徴とする請求項２ないし１３のいずれか１項に記載の基板吸着保持装置。
【請求項１６】 請求項１ないし１５のいずれか１項に記載の基板吸着保持装置および該基板吸着保持装置に吸着保持された基板に対して原版のパターンを露光転写する露光手段を備えていることを特徴とする露光装置。
【請求項１７】 請求項１６に記載の露光装置を用いて基板を露光する工程を含む製造工程によってデバイスを製造することを特徴とするデバイスの製造方法。
[Claims]
1. In a substrate suction holding device having a convex portion for supporting a substrate and sucking and holding a substrate supported on the convex portion, unevenness or waviness generated on the substrate surface when suction and holding is performed from the back surface side of the substrate. A substrate adsorption holding device characterized by being provided with means for alleviating the above.
2. In a substrate suction holding device having a convex portion for supporting a substrate and sucking and holding a substrate supported on the convex portion, the substrate is held via a roughness absorbing member that absorbs the roughness of the back surface of the substrate. A substrate adsorption and holding device characterized by suction and holding.
3. The substrate adsorption holding device according to claim 2, wherein the roughness absorbing member is arranged between the upper surface of the convex portion that substantially supports the substrate and the back surface of the substrate.
4. The substrate suction holding device according to claim 2, wherein the roughness absorbing member is arranged on the upper surface of a convex portion in contact with the substrate.
5. The substrate adsorption holding device according to claim 2, wherein the roughness absorbing member is covered on the upper surface of a convex portion in contact with the substrate.
6. The substrate adsorption holding device according to claim 2 , wherein the roughness absorbing member is coated on the adsorption surface of the substrate.
7. A substrate suction holding device having a convex portion for supporting a substrate and sucking and holding a substrate supported on the convex portion, wherein the convex portion is composed of a roughness absorbing member. Substrate adsorption and holding device.
8. In a substrate suction holding device having a convex portion for supporting a substrate and sucking and holding a substrate supported on the convex portion, the roughness of the back surface of the substrate is on the upper surface of the convex portion that substantially supports the substrate. A substrate adsorption holding device comprising: a means for feeding a thin plate-shaped roughness absorbing member for absorbing a substrate, and a means for feeding a substrate onto the thin plate-shaped roughness absorbing member.
9. The substrate adsorption held, the substrate attracting and holding device according to any one of claims 1 to 8, characterized in that performed by negative pressure suction and one of the suction force at least one of electrostatic force ..
10. A substrate adsorption according to any one of claims 2 to 8 wherein the roughness absorbing member is characterized in that it is formed of a material having a low modulus of longitudinal elasticity than the longitudinal elastic modulus of the substrate Holding device.
11. The substrate suction holding device according to any one of claims 2 to 10 longitudinal elastic modulus of the roughness absorbing member, characterized in that it is 1.3 × 10 11 N / m 2 or less ..
12. The substrate adsorption holding according to any one of claims 2 to 11 , wherein the roughness absorbing member is formed to be thicker than 1/2 of the PV value of the substrate back surface roughness. apparatus.
13. substrate is a silicon wafer, substrate attracting and holding unit according to any one of claims 2 to 12, characterized in that the thickness of the roughness absorbing member or more 1 [mu] m.
14. The substrate adsorption holding device according to any one of claims 2 to 13 , wherein the roughness absorbing member is a polymer compound.
15. The roughness absorbing member metal, ceramic, substrate attracting and holding unit according to any one of claims 2 to 13 characterized in that it is a one or a composite material of the carbon fibers.
16. The substrate adsorption and holding device according to any one of claims 1 to 15 , and an exposure means for exposing and transferring the pattern of the original plate to the substrate sucked and held by the substrate adsorption and holding device. An exposure device characterized by this.
17. A method for manufacturing a device, which comprises manufacturing a device by a manufacturing process including a step of exposing a substrate using the exposure apparatus according to claim 16.
【０００１】
【発明の属する技術分野】
本発明は、半導体デバイスを製造する半導体製造装置、液晶素子を製造する液晶基板製造装置、磁気ヘッド製造装置、マイクロマシンの製造等に用いられる基板吸着保持装置に関し、さらに、このような基板保持装置を用いた露光装置およびデバイス製造方法に関するものである。
[0001]
[Technical field to which the invention belongs]
The present invention relates to a semiconductor manufacturing apparatus for manufacturing a semiconductor device, a liquid crystal substrate manufacturing apparatus for manufacturing a liquid crystal element, a magnetic head manufacturing apparatus, a substrate attracting and holding unit that is used in the manufacture or the like of the micro-machine, further, such a substrate holding apparatus The present invention relates to an exposure apparatus and a device manufacturing method using the above.
そこで、本発明は、上記の従来技術の有する未解決の課題に鑑みてなされたものであって、裏面の粗さの大きいウェハ等の基板であっても、裏面の粗さの影響を基板表面に及ぼすことなく、良好な平坦度を得るとともに平面方向の局所的な歪みをなくすように吸着保持することができる基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイスの製造方法を提供することを目的とするものである。 Therefore, the present invention has been made in view of the unsolved problems of the above-mentioned prior art, and even a substrate such as a wafer having a large back surface roughness is affected by the back surface roughness. manufacturing method for an exposure apparatus and device was used without the suction holding to it can Ru substrate attracting and holding unit and the substrate attracting and holding unit so as to eliminate localized distortion of the planar direction with obtaining a good flatness that on Is intended to provide.
【００１５】
【課題を解決するための手段】
上記目的を達成するために、本発明の基板吸着保持装置は、基板を支持する凸部を備え、該凸部上に支持される基板を吸着保持する基板吸着保持装置において、基板裏面側から吸着保持した際に基板表面に発生する凹凸やうねりを緩和する手段を備えていることを特徴とする。
0015.
[Means for solving problems]
In order to achieve the above object, the substrate suction holding device of the present invention is provided with a convex portion that supports the substrate, and is attracted from the back surface side of the substrate in a substrate suction holding device that sucks and holds the substrate supported on the convex portion. It is characterized in that it is provided with means for alleviating irregularities and waviness generated on the surface of the substrate when it is held.
本発明の基板吸着保持装置においては、前記粗さ吸収部材が基板の縦弾性率よりも低い縦弾性率を有する材料で形成されていることが好ましく、また、前記粗さ吸収部材の縦弾性率が１．３×１０11Ｎ／ｍ2 以下であることが好ましい。
本発明の基板吸着保持装置においては、前記粗さ吸収部材が基板裏面粗さのＰＶ値の１／２よりも厚く形成されていることが好ましく、また、基板がシリコンウェハである場合には、前記粗さ吸収部材の厚さを１μｍ以上とすることが好ましい。
In the substrate adsorption and holding device of the present invention, it is preferable that the roughness absorbing member is made of a material having a longitudinal elastic modulus lower than the longitudinal elastic modulus of the substrate, and the longitudinal elastic modulus of the roughness absorbing member. Is preferably 1.3 × 10 11 N / m 2 or less.
In the substrate adsorption holding device of the present invention, it is preferable that the roughness absorbing member is formed to be thicker than 1/2 of the PV value of the substrate back surface roughness, and when the substrate is a silicon wafer, The thickness of the roughness absorbing member is preferably 1 μm or more.
本発明の基板吸着保持装置においては、前記粗さ吸収部材は高分子化合物であることが好ましく、また、前記粗さ吸収部材を金属、セラミック、カーボン繊維のいずれかあるいはこれらの複合材料で形成することもできる。 In the substrate adsorption and holding device of the present invention, the roughness absorbing member is preferably a polymer compound, and the roughness absorbing member is formed of any one of metal, ceramic, carbon fiber, or a composite material thereof. You can also do it.
【００２８】
【発明の実施の形態】
本発明の基板吸着保持装置において、先ず、ウェハ等の基板の裏面の粗さが基板表面に影響するメカニズムについて図２を参照して説明する。
[0028]
BEST MODE FOR CARRYING OUT THE INVENTION
In the substrate adsorption holding device of the present invention, first, the mechanism by which the roughness of the back surface of a substrate such as a wafer affects the substrate surface will be described with reference to FIG.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11233589A JP2001060618A (en) | 1999-08-20 | 1999-08-20 | Substrate suction holding method, substrate suction holding device, aligner using the substrate suction holding device and manufacturing method the device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11233589A JP2001060618A (en) | 1999-08-20 | 1999-08-20 | Substrate suction holding method, substrate suction holding device, aligner using the substrate suction holding device and manufacturing method the device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001060618A JP2001060618A (en) | 2001-03-06 |
| JP2001060618A5 true JP2001060618A5 (en) | 2006-10-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11233589A Withdrawn JP2001060618A (en) | 1999-08-20 | 1999-08-20 | Substrate suction holding method, substrate suction holding device, aligner using the substrate suction holding device and manufacturing method the device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001060618A (en) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007013619A1 (en) * | 2005-07-28 | 2007-02-01 | Kyocera Corporation | Sample holder, sample suction apparatus using such sample holder and sample processing method using such sample suction apparatus |
| JP4848697B2 (en) * | 2005-07-29 | 2011-12-28 | 大日本印刷株式会社 | Exposure method using work stage of exposure machine |
| JP2007158075A (en) * | 2005-12-06 | 2007-06-21 | Dainippon Screen Mfg Co Ltd | Substrate heat treatment apparatus |
| US8003919B2 (en) | 2005-12-06 | 2011-08-23 | Dainippon Screen Mfg. Co., Ltd. | Substrate heat treatment apparatus |
| JP2007158077A (en) * | 2005-12-06 | 2007-06-21 | Dainippon Screen Mfg Co Ltd | Substrate heat treatment apparatus |
| JP2007158076A (en) * | 2005-12-06 | 2007-06-21 | Dainippon Screen Mfg Co Ltd | Substrate heat treatment apparatus |
| JP4771845B2 (en) * | 2006-03-22 | 2011-09-14 | 東京エレクトロン株式会社 | Substrate processing method and storage medium |
| US7985699B2 (en) | 2006-03-22 | 2011-07-26 | Tokyo Electron Limited | Substrate processing method and storage medium |
| JP4826466B2 (en) * | 2006-12-26 | 2011-11-30 | 大日本印刷株式会社 | Exposure method using work stage of exposure machine |
| US7791708B2 (en) * | 2006-12-27 | 2010-09-07 | Asml Netherlands B.V. | Lithographic apparatus, substrate table, and method for enhancing substrate release properties |
| JP5059450B2 (en) * | 2007-03-06 | 2012-10-24 | 東京エレクトロン株式会社 | Substrate mounting table and substrate processing apparatus |
| JP5196838B2 (en) * | 2007-04-17 | 2013-05-15 | リンテック株式会社 | Manufacturing method of chip with adhesive |
| JP4985392B2 (en) * | 2007-12-28 | 2012-07-25 | 株式会社ニコン | Substrate holding apparatus, exposure apparatus, and device manufacturing method |
| JP2009302149A (en) * | 2008-06-10 | 2009-12-24 | Nikon Corp | Exposure device, and device manufacturing method |
| JP5209403B2 (en) * | 2008-08-07 | 2013-06-12 | 株式会社ディスコ | Processing equipment equipped with a bite tool |
| JP5293211B2 (en) * | 2009-01-14 | 2013-09-18 | Ｔｏｔｏ株式会社 | Electrostatic chuck and method of manufacturing electrostatic chuck |
| JP5305012B2 (en) * | 2009-02-22 | 2013-10-02 | ウシオ電機株式会社 | Work stage and exposure apparatus equipped with the work stage |
| US8768665B2 (en) * | 2010-01-08 | 2014-07-01 | Kla-Tencor Technologies Corporation | Site based quantification of substrate topography and its relation to lithography defocus and overlay |
| CN108336011B (en) * | 2012-11-30 | 2022-08-02 | 株式会社尼康 | Carrying-in method, carrying system, exposure apparatus, and device manufacturing method |
| JP6774714B2 (en) * | 2016-07-25 | 2020-10-28 | 株式会社アドテックエンジニアリング | Work stage and exposure equipment |
| JP6894034B2 (en) * | 2016-07-25 | 2021-06-23 | 株式会社アドテックエンジニアリング | Work suction holding method, work stage and exposure equipment |
| JP7014590B2 (en) * | 2017-12-21 | 2022-02-01 | 日本特殊陶業株式会社 | Vacuum suction member |
-
1999
- 1999-08-20 JP JP11233589A patent/JP2001060618A/en not_active Withdrawn
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