JPS63115300U - - Google Patents

Info

Publication number
JPS63115300U
JPS63115300U JP648287U JP648287U JPS63115300U JP S63115300 U JPS63115300 U JP S63115300U JP 648287 U JP648287 U JP 648287U JP 648287 U JP648287 U JP 648287U JP S63115300 U JPS63115300 U JP S63115300U
Authority
JP
Japan
Prior art keywords
integrated element
suction head
circuit board
printed circuit
deviation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP648287U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP648287U priority Critical patent/JPS63115300U/ja
Publication of JPS63115300U publication Critical patent/JPS63115300U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
JP648287U 1987-01-20 1987-01-20 Pending JPS63115300U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP648287U JPS63115300U (enrdf_load_stackoverflow) 1987-01-20 1987-01-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP648287U JPS63115300U (enrdf_load_stackoverflow) 1987-01-20 1987-01-20

Publications (1)

Publication Number Publication Date
JPS63115300U true JPS63115300U (enrdf_load_stackoverflow) 1988-07-25

Family

ID=30789035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP648287U Pending JPS63115300U (enrdf_load_stackoverflow) 1987-01-20 1987-01-20

Country Status (1)

Country Link
JP (1) JPS63115300U (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59195800A (ja) * 1983-04-22 1984-11-06 三菱電機株式会社 駐車場における駐車状況表示方法
JPS601900A (ja) * 1983-06-17 1985-01-08 松下電器産業株式会社 認識付電子部品実装装置
JPS60201696A (ja) * 1984-03-27 1985-10-12 松下電器産業株式会社 フラツトパツケ−ジの半田付方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59195800A (ja) * 1983-04-22 1984-11-06 三菱電機株式会社 駐車場における駐車状況表示方法
JPS601900A (ja) * 1983-06-17 1985-01-08 松下電器産業株式会社 認識付電子部品実装装置
JPS60201696A (ja) * 1984-03-27 1985-10-12 松下電器産業株式会社 フラツトパツケ−ジの半田付方法

Similar Documents

Publication Publication Date Title
JPS63115300U (enrdf_load_stackoverflow)
JP2811899B2 (ja) 電子部品実装装置
US4682723A (en) Mask for wave soldering machine
JP3901783B2 (ja) 電子部品装着機
CN223201129U (zh) 一种电路板印刷机械手上料装置
JPS6464334A (en) Apparatus for mounting semiconductor wafer
JP2007030329A (ja) スクリーン印刷機
JPS62293799A (ja) プリント基板へのクリ−ム半田印刷方法
JP3863205B2 (ja) 電子部品の装着方法および電子部品装着装置
JP3986652B2 (ja) 基板の搬送装置
KR0124806Y1 (ko) 전자부품조립장치
JP2646082B2 (ja) 半導体チップのピックアップ装置
JPH08274500A (ja) 実装機の部品吸着状態検出装置
JP2811930B2 (ja) 電子部品実装装置および電子部品実装方法
JP2636465B2 (ja) 電子部品実装装置
JP2503291Y2 (ja) 印字装置の通帳頁めくり機構
JPH0513993A (ja) 電子部品装着ヘツド
JP4124872B2 (ja) 電子部品供給装置およびその吸着ノズルの高さ調節方法
JPH0424076U (enrdf_load_stackoverflow)
JPS6121171Y2 (enrdf_load_stackoverflow)
JPS62118668U (enrdf_load_stackoverflow)
JP2874374B2 (ja) 電子部品の移載ヘッド
JPS644756Y2 (enrdf_load_stackoverflow)
JPS6331042U (enrdf_load_stackoverflow)
JPH01153637U (enrdf_load_stackoverflow)