JPS63112336U - - Google Patents

Info

Publication number
JPS63112336U
JPS63112336U JP242687U JP242687U JPS63112336U JP S63112336 U JPS63112336 U JP S63112336U JP 242687 U JP242687 U JP 242687U JP 242687 U JP242687 U JP 242687U JP S63112336 U JPS63112336 U JP S63112336U
Authority
JP
Japan
Prior art keywords
wafer
support plate
semiconductor wafer
wafer support
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP242687U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP242687U priority Critical patent/JPS63112336U/ja
Publication of JPS63112336U publication Critical patent/JPS63112336U/ja
Pending legal-status Critical Current

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  • Weting (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の半導体ウエハのウエツト処
理用治具の第1の実施例を示す斜視図、第2図は
同第1の実施例の断面図、第3図はこの考案の第
2の実施例を示す断面図である。 1…ウエハ支持板、2…突起、3…脚片、5…
半導体ウエハ。
Fig. 1 is a perspective view showing a first embodiment of the semiconductor wafer wet processing jig of this invention, Fig. 2 is a sectional view of the first embodiment, and Fig. 3 is a second embodiment of the jig of this invention. It is a sectional view showing an example. DESCRIPTION OF SYMBOLS 1... Wafer support plate, 2... Protrusion, 3... Leg piece, 5...
semiconductor wafer.

Claims (1)

【実用新案登録請求の範囲】 (a) 上方を向いた外側面あるいは内側面の下端
にウエハずり落ち防止用の突起を設けた環状斜面
板からなるウエハ支持板と、 (b) このウエハ支持板の下端数個所に設けられ
た脚片とからなる半導体ウエハのウエツト処理用
治具。
[Claims for Utility Model Registration] (a) A wafer support plate consisting of an annular sloped plate provided with a protrusion on the lower end of the upwardly facing outer or inner surface to prevent the wafer from falling; (b) this wafer support plate A semiconductor wafer wet processing jig consisting of leg pieces installed at several locations on the lower end of the semiconductor wafer.
JP242687U 1987-01-13 1987-01-13 Pending JPS63112336U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP242687U JPS63112336U (en) 1987-01-13 1987-01-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP242687U JPS63112336U (en) 1987-01-13 1987-01-13

Publications (1)

Publication Number Publication Date
JPS63112336U true JPS63112336U (en) 1988-07-19

Family

ID=30781256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP242687U Pending JPS63112336U (en) 1987-01-13 1987-01-13

Country Status (1)

Country Link
JP (1) JPS63112336U (en)

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