JPS6311119B2 - - Google Patents

Info

Publication number
JPS6311119B2
JPS6311119B2 JP58072859A JP7285983A JPS6311119B2 JP S6311119 B2 JPS6311119 B2 JP S6311119B2 JP 58072859 A JP58072859 A JP 58072859A JP 7285983 A JP7285983 A JP 7285983A JP S6311119 B2 JPS6311119 B2 JP S6311119B2
Authority
JP
Japan
Prior art keywords
light beam
light
workpiece
liquid tank
printed board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58072859A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59199187A (ja
Inventor
Mitsukyo Tani
Keikichi Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58072859A priority Critical patent/JPS59199187A/ja
Publication of JPS59199187A publication Critical patent/JPS59199187A/ja
Publication of JPS6311119B2 publication Critical patent/JPS6311119B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0002—Soldering by means of dipping in a fused salt bath

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP58072859A 1983-04-27 1983-04-27 光ビ−ム加工装置 Granted JPS59199187A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58072859A JPS59199187A (ja) 1983-04-27 1983-04-27 光ビ−ム加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58072859A JPS59199187A (ja) 1983-04-27 1983-04-27 光ビ−ム加工装置

Publications (2)

Publication Number Publication Date
JPS59199187A JPS59199187A (ja) 1984-11-12
JPS6311119B2 true JPS6311119B2 (cs) 1988-03-11

Family

ID=13501493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58072859A Granted JPS59199187A (ja) 1983-04-27 1983-04-27 光ビ−ム加工装置

Country Status (1)

Country Link
JP (1) JPS59199187A (cs)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834378U (cs) * 1971-08-25 1973-04-25

Also Published As

Publication number Publication date
JPS59199187A (ja) 1984-11-12

Similar Documents

Publication Publication Date Title
US5466908A (en) Method and apparatus for cutting patterns of printed wiring boards and method and apparatus for cleaning printed wiring boards
US6642485B2 (en) System and method for mounting electronic components onto flexible substrates
TWI740428B (zh) 雷射式焊接方法和其裝置
CN88100726A (zh) 聚焦对流软熔式焊接方法和设备
US6441339B1 (en) Apparatus for manufacturing circuit modules
US4446358A (en) Preheater for use in mass soldering apparatus
KR19990087513A (ko) 기판 건조 방법 및 장치
WO2005065876A1 (ja) リフロー炉および熱風吹き出し型ヒーター
JPS57104217A (en) Surface heat treatment
US7026582B2 (en) Vector transient reflow of lead free solder for controlling substrate warpage
JP3735069B2 (ja) はんだ付けされた電子部品の取り外し方法及びその装置
JPS6311119B2 (cs)
JPH09186448A (ja) リフローはんだ付け方法およびリフローはんだ付け装置
JPH04296092A (ja) リフロー装置
JP4200000B2 (ja) リフローはんだ付け方法およびはんだ付け装置
JPH05245624A (ja) ハンダリフロー装置及びハンダリフロー方法
JPH02114696A (ja) リフロー半田付け方法及びその装置
JPH09246712A (ja) リフロー半田付け方法とその装置
CN214291265U (zh) 一种回流焊接装置
JPH088527A (ja) 赤外線加熱装置
JPH0444390A (ja) レーザ半田付け方法とその装置
TW202034413A (zh) 電子部件的回流及返工裝置
JP3062699B2 (ja) プリント基板のリフロー方法及びリフロー炉
JPS6128445A (ja) 紫外線照射装置
JPH0481268A (ja) 光ビームはんだ付け装置