JPS59199187A - 光ビ−ム加工装置 - Google Patents

光ビ−ム加工装置

Info

Publication number
JPS59199187A
JPS59199187A JP58072859A JP7285983A JPS59199187A JP S59199187 A JPS59199187 A JP S59199187A JP 58072859 A JP58072859 A JP 58072859A JP 7285983 A JP7285983 A JP 7285983A JP S59199187 A JPS59199187 A JP S59199187A
Authority
JP
Japan
Prior art keywords
light beam
light
workpiece
printed board
processing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58072859A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6311119B2 (cs
Inventor
Mitsukiyo Tani
光清 谷
Keikichi Ando
安藤　圭吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58072859A priority Critical patent/JPS59199187A/ja
Publication of JPS59199187A publication Critical patent/JPS59199187A/ja
Publication of JPS6311119B2 publication Critical patent/JPS6311119B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0002—Soldering by means of dipping in a fused salt bath

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP58072859A 1983-04-27 1983-04-27 光ビ−ム加工装置 Granted JPS59199187A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58072859A JPS59199187A (ja) 1983-04-27 1983-04-27 光ビ−ム加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58072859A JPS59199187A (ja) 1983-04-27 1983-04-27 光ビ−ム加工装置

Publications (2)

Publication Number Publication Date
JPS59199187A true JPS59199187A (ja) 1984-11-12
JPS6311119B2 JPS6311119B2 (cs) 1988-03-11

Family

ID=13501493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58072859A Granted JPS59199187A (ja) 1983-04-27 1983-04-27 光ビ−ム加工装置

Country Status (1)

Country Link
JP (1) JPS59199187A (cs)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834378U (cs) * 1971-08-25 1973-04-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834378U (cs) * 1971-08-25 1973-04-25

Also Published As

Publication number Publication date
JPS6311119B2 (cs) 1988-03-11

Similar Documents

Publication Publication Date Title
CN88100726A (zh) 聚焦对流软熔式焊接方法和设备
GB1102621A (en) Method and apparatus for fluxing and soldering connections on printed circuit boards
US4446358A (en) Preheater for use in mass soldering apparatus
US3879164A (en) Method of isothermally heating articles with radiation
KR19990087513A (ko) 기판 건조 방법 및 장치
JPH0299266A (ja) リフローはんだ付け装置
US20050001019A1 (en) Vector transient reflow of lead free solder for controlling substrate warpage
JP3735069B2 (ja) はんだ付けされた電子部品の取り外し方法及びその装置
JP2001144426A (ja) リフローはんだ付け装置
JPS59199187A (ja) 光ビ−ム加工装置
JP3226651B2 (ja) リフロー炉およびリフロー炉用冷却装置
JPH09186448A (ja) リフローはんだ付け方法およびリフローはんだ付け装置
JP4200000B2 (ja) リフローはんだ付け方法およびはんだ付け装置
JPH05245624A (ja) ハンダリフロー装置及びハンダリフロー方法
JPH02114696A (ja) リフロー半田付け方法及びその装置
JPH11289149A (ja) 薄型電子回路部品の製造装置及び薄型電子回路部品
JPS59150665A (ja) はんだ付け方法
JPH09246712A (ja) リフロー半田付け方法とその装置
JPH038565A (ja) リフロー装置
JP3062699B2 (ja) プリント基板のリフロー方法及びリフロー炉
JPH088527A (ja) 赤外線加熱装置
JP2001320163A (ja) リフロー装置およびその基板加熱方法
JPS59174272A (ja) リフロ−炉
CN214291265U (zh) 一种回流焊接装置
JPH0444390A (ja) レーザ半田付け方法とその装置