JPS63110583A - Method of reinforcing connection of lead wire - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applied to the process in which lead wires of electronic components, etc. are attached and assembled to element substrates, etc. during the manufacturing process.
The present invention relates to a lead wire connection reinforcing method that is effective when problems occur unless sufficient lead wire connection strength is maintained.

BACKGROUND OF THE INVENTION Conventionally, this type of lead wire connection method has been described, for example, in Figs.
The configuration was as shown in FIG. 6 and 7, after the lead wire 1 is aligned with the thin film electrode extension part 3 provided on the upper part of the element substrate 2, the electrode rods 42L, 4b
When the current 6 flows from the electrode rod 4a to the electrode rod 4b via the lead wire 1, the lead wire 1 generates heat due to the inherent internal resistance of the lead wire 1, and the thin film electrode extension portion 3 The metal thin film layer melts. At this time, as shown in FIG. 6, the lead wire 1 is deformed from a circular shape to an elliptical shape due to pressure and heat generation, but the metal thin film layer of the thin film electrode extraction part 3 partially covers the lead wire M1. As a result, the lead wire 1 and the thin film electrode extension part 3 were connected.

Problems to be Solved by the Invention In such a conventional method, the strength of the connection between the lead wire 1 and the thin film electrode extension part 3 depends on the deformed state of the lead wire 1 and the thin film electrode that has melted and wrapped around the lead wire 1. This is determined by the sum of the strength of the contact surface of the deformed portion of the metal layer door a1 of the lead-out portion 3 and the strength of the contact surface between the element substrate 2 and the thin-film electrode lead-out portion 3. Therefore, if the metal layer of the thin film electrode extension part 3 is thin, the contact area due to wrapping around the lead wire 1 is small, so there is no strength, and the bonding strength between the element substrate 2 and the metal layer of the thin film electrode extension part 3 is reduced. If is small, the connection strength between the lead wire 1 and the thin film electrode extension part 3 will be small as a result. Furthermore, even if an attempt is made to increase the amount of deformation of the lead wire 1 to increase the amount of wraparound, the element substrate 2
However, there was a problem in that it was brittle and easily cracked, making it impossible to obtain the desired sufficient connection strength. The present invention is intended to solve these problems, and aims to improve the connection strength between the lead wire 1 and the thin film electrode extension portion 3 without causing cracking of the element substrate 2.

Means for Solving the Problems In order to solve this problem, the present invention involves bonding a reinforcing metal film onto an element substrate having a thin film electrode so as to be connected to the thin film electrode, and reinforcing the reinforcing metal film. A lead wire serving as an electrode terminal is positioned and held on top, two electrode rods are pressurized and held from above the lead wire, and a current is applied to the two electrode rods to melt the reinforcing metal film. The lead wire is connected to the thin film electrode.

Function: With this configuration, the reinforcing metal film can be bonded to the thin film electrode lead-out portion of the element substrate without applying extreme overload to the element substrate.
By pressurizing and generating heat on the lead wire above the reinforcing metal film, the reinforcing metal film melts and covers the lead wire, improving the connection strength of the lead wire.

Embodiment FIG. 1 is a perspective view showing a method for reinforcing the connection of lead wires according to an embodiment of the present invention, and the numbers in the figure are the same as those in the conventional example.

Now, as shown in FIG. 1, when the lead wire 1 is about to connect to the thin film electrode extension part 3 printed on the element substrate 2,
It is assumed that a reinforcing metal film 6 is laminated on the lead-out part 3. The metal film 6 overlaps a part of the lead-out part 3, and the rest is widely bonded to the element substrate 2. The overlapping part does not require mechanically sufficient bonding strength, but is intended for electrical continuity. The lead wire 1 is set at a position away from this overlapping part, and a current of 6 is applied to the electrode rod 4. When the lead wire 1 flows, the lead wire 1 is heated and deformed as shown in FIG. 3, and the metal film 6 solidifies so as to cover the lead wire 1.

As a result, the connection area is increased compared to the conventional case shown in FIG. 6, and the connection strength can be improved.

In this case, the material of the metal film 6 is the same as the material of the thin film electrode extraction part 3.
-Pd to Pt, FiA to lead wire 1
This was done using g-plated Ni wire.

In FIG. 4, the tip of the lead wire 1 is made flat.

In this way, the electrode rods 42L and 4b can be easily held under pressure.

Effects of the Invention To improve the reliability of the connection when an electrical signal is led to the outside using a lead wire from the element board in small electronic components, etc., and when a problem occurs due to insufficient connection strength and some reinforcement is required. can be produced, and its industrial value is a dog.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing a lead wire connection reinforcement method according to an embodiment of the present invention, Fig. 2 is a sectional view of the same embodiment as seen from the lead wire side, and Fig. 3 is a perspective view showing a lead wire connection reinforcement method according to the embodiment. 4 is a sectional view showing a reinforced state; FIG. 4 is a perspective view showing another embodiment of the present invention; FIG. 6 is a perspective view showing a conventional state;
This figure is a cross-sectional view of a conventional example as seen from the lead wire side, and FIG. 7 is a cross-sectional view showing a state in which connections are made by the conventional method. 1...Lead wire, 2...Element board, 3
・・Mark・Thin film at the pole extraction part, 4・・・・Electrode rod, 6・
・Group・Reinforcing metal film, 6...Current path, 7...
...Ceramic layer. Name of agent Patent attorney Toshio Nakao and one other person Figure 3 Figure 5 Figure 6 Figure 7

Claims (1)

[Claims] A reinforcing metal film is bonded onto the element substrate having the thin film electrode so as to be connected to the thin film electrode, and on the reinforcing metal film,
Lead wires that will become electrode terminals are aligned and held, two electrode rods are pressed and held from above the lead wires, and a current is passed through the two electrode rods to melt the reinforcing metal film and close the leads. A method for reinforcing the connection of a lead wire, the method comprising connecting the wire to the thin film electrode.