JPS63108919A - Lead forming device - Google Patents

Abstract

PURPOSE:To high accurately and continuously produce leads by bending the end part of a lead outward at a given distance from the end and cutting the end after forming the lead outward into a rectangular shape. CONSTITUTION:ICs 1 before forming are sent to a feeding part 3 and are fed to a forming means 4 one by one. The end part (m) of a lead 20 of the IC 1 fed to a 1st forming die 100 is bent at a given distance (l) from the top end to be in a slant condition. The bottom of the lead 20 of the IC 1 fed to a 2nd forming die 200 is pressed inward and is corrected so that an expanded shape is made to be rectangular. Then, the end part (m) of the lead 20 is catched and is bent into a rectangular shape in a 3rd forming die 300. In a 4th forming die 400, a top end 25 of the end part (m) of the lead 20 is cut and a lead shape of formed ICs 1 is checked at an inspection part 5. A storage part 6 classifies the ICs 1 into acceptable products and off-spec products and stores them.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead forming device for forming leads of electronic components into a shape that can be surface mounted.

[Conventional technology]

Conventionally, if we take DIP type IC among DIP type electronic components as an example, DIP type ICI is 1, DIP type I as shown in Figure 8.
A lead 20 protrudes from the side of the CI perpendicularly toward the bottom of the DIP type IC.
After the end m is forcibly bent using a tool such as pliers or a jig such as sandwiching between two plates, the tips 25 of all the leads 20 are cut off using a cutting tool such as nippers.

[Problem that the invention seeks to solve]

Conventional lead forming devices use tools and simple jigs as described above, so forming cannot be performed with high precision, and the forming is performed manually one by one, resulting in a lack of productivity.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a lead forming device that can continuously produce leads 20 for electronic components with high precision.

[Means for solving problems]

The lead forming device of the present invention includes a first mold 100 for bending an end m of a lead 20 of an electronic component 1 from a certain length l in an outwardly inclined state;
A third mold 300 that bends the inclined end m molded in 00 at a right angle, and a fourth mold 400 that cuts the tip 25 of the end m molded with this third mold 300. A forming means 4 is provided.

[Effect]

The shaping means 4 shapes the end m of the lead 20 to a certain length E.
The lead 20 is gradually bent outward from the point to form the lead 20 outwardly at right angles, and then the tip 25 of the lead 20 is cut.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIGS. 1 to 7. In each figure, numeral 1 represents a DIP type electronic component, and in this embodiment, a DIP type IC (hereinafter abbreviated as IC) will be explained as an example. Reference numeral 20 indicates a lead, and a plurality of leads 20 are formed so as to project horizontally from the side of the ICI and extend downward.

FIG. 1 shows an overall configuration diagram of the lead forming apparatus of the present invention, and in the figure, 3 indicates the I.
A supply section is shown in which CI is supplied, and one ICI is separated and supplied to the molding means 4 in the subsequent process. The molding means 4 is
As shown in FIGS. 4 to 7, a first mold 100. Second mold 200, third mold 300, and fourth mold 40
It consists of four molds: 0.

As shown in FIGS. 4(a) and 4(b), the first mold 100 has an upper mold portion U that includes an upper mold 101 and an IC holding portion 102.
, a compression spring 103, and an upper mold base 104,
The lower mold part consists of a lower mold part 105, an IC positioning base 106 of the lower mold part, a compression spring 107, and a lower mold base 108. The upper mold 101 is formed symmetrically with the IC holding part 102 interposed therebetween, and one end thereof is formed on the upper mold base 1.
It is attached to 04. An inclined molding surface 101a is formed at the lower end of this upper mold 101. The above IC holding part 1
A compression spring 103 is interposed between the upper die base 104 and the upper mold base 104. The lower end of the lower mold 105 is attached to the lower mold base 108, and an inclined molding surface 105a corresponding to the inclined molding surface 101a is formed at the upper end. The lower mold 105 is formed symmetrically with respect to the positioning base 106. This IC positioning base 106 and lower die base 1
A compression spring 107 is interposed between 08 and 08.

This molding operation of the first mold 100 is performed by the IC holding part 102.
While pressing the ICI toward the IC positioning base 106, the end m of the lead 20 is sandwiched between the inclined molding surface 101a of the upper mold 101 and the inclined molding surface 105a of the lower mold 105 from a certain length l. In this way, the end m of the lead 20 is bent outward and tilted at a certain angle (see Fig. 3(b)).
)reference).

As shown in FIG. 5, the second mold 200 has an upper mold part U consisting of an upper mold 201, an IC holding part 202 of the upper mold part, a compression spring 203, and an upper mold base 204, and The mold part consists of a lower mold 205, an IC positioning base 206 of the lower mold part, and a lower mold base 207. The upper mold 201 has an inclined surface 201a formed inside its lower end. Above lower mold 2
05 has an inclined surface 205 corresponding to the inclined surface 201a.
a, a recess 205b that accommodates the end m of the lead 20,
Corner S of the dome 20 that occurs during molding with the first mold
Correction unit 20 that presses and corrects the spread (see Figure 3)
5c is formed. The molding operation of the second mold 200 is such that when the IC presser 202 presses the ICI toward the IC positioning base 206, the tip of the lower mold 205 slides on the inclined surface 201a, and the lower mold 205 slides on the inclined surface 201a. Around 1, it rotates from a tilted state to an upright state. At this time, the correction part 2 of the lower die 205
05c presses the base of the lead 2o inward to correct the widening of the corner S to a right angle.

In the third mold 300, as shown in FIG. 6, the upper mold part U consists of an upper mold 301 and an upper mold base 302, and the lower mold part includes a lower mold 303, an IC positioning base 304, It consists of a compression spring 305 and a lower die base 306. One end of the upper mold 301 is directly attached to the upper mold base 302, and horizontal molding surfaces 301 are attached to both sides of the lower end through hollow parts 301b.
This is a mold with a concave cross section. The lower mold 303 has a horizontal molding surface 303a corresponding to the horizontal molding surface 301a of the upper mold 301 at its upper end. The molding operation of the third mold 300 is performed by narrowing the end m of the lead 20 between the horizontal molding surface 303a at the upper end of the lower mold 303 and the horizontal molding surface 301a at the lower end of the upper mold 301 while holding down the ICI. Bend the end m of 20 at a right angle. In this way, the ends of the leads 20 are gradually shaped outward.

The fourth mold 400 is a mold for cutting the tip 25 of the end m of the lead 20 molded by the third mold 300, as shown in FIG. The upper mold part U of this fourth mold 400 includes a cutting mold 401 and an IC holding part 402 of the upper mold part.
, a compression spring 403, and an upper mold base 404,
The lower mold part includes a lower mold 405 and an IC positioning base 406.
, a compression spring 407 , and a lower die base 408 .

A blade portion 401a is formed inside the lower end of the cutting die 401 to facilitate cutting of the lead 2o.

A suppressing portion 402a that presses the end m of the lead 2o is formed at the lower end of the IC holding portion 402.

The upper end of the lower mold 405 is the upper surface 4 on which the lead 2o is placed.
05a, and a side wall 405b with which the blade portion 401a slides. This cutting operation of the fourth mold 400 is performed so that the end m of the lead 20 is placed on the upper surface 405a of the lower mold 405.
In the state in which the cutting die 401 is placed, the cutting die 401 is pressed against the lower die 40 while pressing this end m with the pressing part 402a of the IC holding part 402.
By slidingly contacting the upper side wall 405b of the lead 2
0. Cut the tip 25 of the end m.

Reference numeral 5 designates an inspection section, and this inspection section 5 has the function of checking the shape of the ICI lead molded by each of the above-mentioned molds. 6 indicates a storage section, and this storage section 6
The case is divided into a case for non-defective products and a case for defective products, and the entrance of the non-defective case is formed in a shape that matches the shape of a predetermined molded IC. Reference numeral 7 denotes a control section, which controls the apparatus. Reference numeral 8 denotes a base, on which each component of the apparatus is installed.

Next, the operation of the lead forming apparatus of the present invention constructed as described above will be explained with reference to FIGS. 2 and 3.

First, ICI before molding is fed into the supply section 3, and this ICI
The CIs are fed into the forming means 4 one by one. ICI lead 2 fed into the first mold 100 as the first stage molding
0 is bent into the shape shown in FIG. 3(a) by the press operation of the first mold 100. Next, the IC is fed into the second mold 200 as a second stage molding.
The I-glue 20 is bent into the shape shown in FIG. 3(b) by the pressing operation of the second mold 200 and the operation of the lower mold 205. Furthermore, the ICI lead 20 fed into the third mold 300 as a third stage molding is
By the pressing operation of the mold 300, it is bent into the shape shown in FIG. 3(c).

The tip 25 of the ICI lead 20 fed into the fourth mold 400 as the final stage of molding is cut by the pressing operation of this fourth mold, resulting in an ICI having the shape shown in FIG. 3(d). molded. The ICI molded by the molding means 4 is sent to the inspection section 5, where the pitch between each lead 20 of 101 and the horizontal bending state of the tip of the lead 20 are examined and compared with a predetermined value, and the data is outputted to determine whether the product is good or not. Sorted as defective products. The sorted ICIs are stored in a non-defective case and a defective case in the storage section 6, respectively, according to whether they are non-defective or non-defective. The molding operation represented by the pressing operation of the molding means 4 is performed by outputting the mechanical information of each mold built into the control section 8 to an actuator (not shown) linked to each mold after calculation processing. Operates continuously. In the lead forming apparatus of the present invention, each process is controlled mainly by sequence control by the control section 8 so that each element operates continuously.

In the above embodiment, an example was shown in which four molds were used as the molding means 4, but this mold configuration can be changed depending on the accuracy required in molding the ICI lead 20.

For example, even with a mold configuration that excludes the second mold 200, the molding accuracy of the lead 20 can be ensured to some extent.

On the other hand, in order to improve the molding accuracy of the lead 20, a fifth mold may be constructed after the fourth mold, which is operated by manually pushing the third mold for examining the accuracy.

〔Effect of the invention〕

As described above, the lead forming apparatus of the present invention includes the forming means 4 for forming the ends of the leads 20 of the electronic component 1 outward at right angles and then cutting the tips. Since electronic components 1 with improved accuracy can be mass-produced, productivity can be improved and work can be done more quickly.

[Brief explanation of the drawing]

1 to 7 show the lead forming apparatus of the present invention, FIG. 1 is a perspective view showing the overall configuration, FIG. 2 is a flowchart showing the process order, and FIG. 3 is a forming means 4.
FIG. 4 is an explanatory diagram of the configuration and operation of the first mold, FIG. 5 is an explanatory diagram of the configuration and operation of the second mold, and FIG. 6 is an explanatory diagram of the configuration and operation of the third mold. An explanatory diagram of the configuration and operation, FIG. 7 is an explanatory diagram of the configuration and operation of the fourth mold,
FIG. 8 is a perspective view showing the IC before molding, and FIG. 9 is a perspective view showing the IC after molding. 20... Lead, 3... Supply section, 4... Molding means, 5... Inspection section, 6... Storage section, 7... Control section, 8... Base, 100-400 ... 1st ~
Fourth mold. Agent: Masuo Oiwa (and 2 others) Figure 3: No. 8 recess procedure amendment form (1 Anchor Showa year, month, day 2, Name of invention: Lead forming device 3, Person making the amendment Representative: Moriya Shiki, Mitsubishi Electric Co., Ltd. 5. Column for detailed explanation of the invention subject to amendment. 6. Contents of amendment (1) Page 11, line 11 of the specification "For accuracy review"
Delete that. (2) In the same book, page 11, line 11, the phrase “press by hand” was replaced with “
``as a mold with the same mold configuration as ``. (3) Same book, page 11, line 12, “like operating by doing”
Delete that. that's all

Claims (2)

[Claims] (1) After bending the end m of the lead 20 protruding from the electronic component 1 toward the bottom of the electronic component 1 at a right angle outward from a certain length l, the tip 25 of the end m is bent. In a lead forming apparatus equipped with a forming means 4 for cutting, the forming means 4 includes a first forming die 100 that bends the end m of the lead 20 from a certain length l in an outwardly inclined state. A third mold 300 is used to bend the inclined end m formed by the first mold 100 at right angles, and a tip 25 of the end m molded by the third mold 300 is cut. A lead forming device comprising a fourth mold 400. (2) At the rear stage of the first mold 100, a second mold 20 including a lower mold 205 that presses the root side of the lead 20 inward
2. The lead forming apparatus according to claim 1, wherein a lead forming apparatus is provided with a lead forming apparatus having a lead forming apparatus.