JPS63108919A - Lead forming device - Google Patents

Lead forming device

Info

Publication number
JPS63108919A
JPS63108919A JP25295586A JP25295586A JPS63108919A JP S63108919 A JPS63108919 A JP S63108919A JP 25295586 A JP25295586 A JP 25295586A JP 25295586 A JP25295586 A JP 25295586A JP S63108919 A JPS63108919 A JP S63108919A
Authority
JP
Japan
Prior art keywords
mold
lead
forming
molding
fed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25295586A
Other languages
Japanese (ja)
Inventor
Keiichi Tamura
恵一 田村
Tsuyoshi Okuzono
奥園 強
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP25295586A priority Critical patent/JPS63108919A/en
Publication of JPS63108919A publication Critical patent/JPS63108919A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To high accurately and continuously produce leads by bending the end part of a lead outward at a given distance from the end and cutting the end after forming the lead outward into a rectangular shape. CONSTITUTION:ICs 1 before forming are sent to a feeding part 3 and are fed to a forming means 4 one by one. The end part (m) of a lead 20 of the IC 1 fed to a 1st forming die 100 is bent at a given distance (l) from the top end to be in a slant condition. The bottom of the lead 20 of the IC 1 fed to a 2nd forming die 200 is pressed inward and is corrected so that an expanded shape is made to be rectangular. Then, the end part (m) of the lead 20 is catched and is bent into a rectangular shape in a 3rd forming die 300. In a 4th forming die 400, a top end 25 of the end part (m) of the lead 20 is cut and a lead shape of formed ICs 1 is checked at an inspection part 5. A storage part 6 classifies the ICs 1 into acceptable products and off-spec products and stores them.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、電子部品のリードを表面実装可能な形状に
成形するリードフォーミング装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead forming device for forming leads of electronic components into a shape that can be surface mounted.

〔従来の技術〕[Conventional technology]

従来、DIP型電子部品の内DIP型ICを例にとると
、DIP型ICIは第8図に示すように1、DIP型I
CIの側部よりリード20がDIP型ICの下部方向に
垂直に突出しており、このリード20を第9図に示すよ
うに表面実装可能なように成形する際、このリード20
の端部mを、ペンチのような工具もしくは、2枚の板で
はさみこむような治具で強制的に折曲した後、ニッパの
ような切断工具で全リード20先端25を切断していた
Conventionally, if we take DIP type IC among DIP type electronic components as an example, DIP type ICI is 1, DIP type I as shown in Figure 8.
A lead 20 protrudes from the side of the CI perpendicularly toward the bottom of the DIP type IC.
After the end m is forcibly bent using a tool such as pliers or a jig such as sandwiching between two plates, the tips 25 of all the leads 20 are cut off using a cutting tool such as nippers.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来のリードフォーミング装置は、以上のように工具や
簡単な治具を用いて行なっていたため、高精度にフォー
ミングできず、又、1個ずつ人手によって行なうため生
産性に欠ける問題点があった。
Conventional lead forming devices use tools and simple jigs as described above, so forming cannot be performed with high precision, and the forming is performed manually one by one, resulting in a lack of productivity.

この発明は上記のような問題点を解消するためになされ
たもので、電子部品のリード20を、高精度かつ連続的
に生産するリードフォーミング装置を得ることを目的と
する。
The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a lead forming device that can continuously produce leads 20 for electronic components with high precision.

〔問題点を解決するための手段〕[Means for solving problems]

この発明のリードフォーミング装置は、電子部品1のリ
ード20の端部mを一定の長さlの所から外方向に傾斜
状態で折曲する第1成形型100と、この第1成形型1
00で成形された傾斜状態の端部mを直角に折曲する第
3成形型300と、この第3成形型300で成形された
端部mの先端25を切断する第4成形型400とから成
る成形手段4を設けた。
The lead forming device of the present invention includes a first mold 100 for bending an end m of a lead 20 of an electronic component 1 from a certain length l in an outwardly inclined state;
A third mold 300 that bends the inclined end m molded in 00 at a right angle, and a fourth mold 400 that cuts the tip 25 of the end m molded with this third mold 300. A forming means 4 is provided.

〔作用〕[Effect]

成形手段4により、リード20の端部mを一定の長さE
の所から外方に徐々に折曲し、このり一ド20を外方に
直角に成形し、次いで、このリード20の先端25を切
断する。
The shaping means 4 shapes the end m of the lead 20 to a certain length E.
The lead 20 is gradually bent outward from the point to form the lead 20 outwardly at right angles, and then the tip 25 of the lead 20 is cut.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明の一実施例を第1図乃至第7図に基づい
て説明する。各図において1はDIP型電子電子部品し
、本実施例ではDIP型IC(以後ICと略す)を例に
して説明する。20はリードを示し、このリード20は
上記ICIの側部より水平に突出した後下方向に延長す
る如く成形されて、複数本設けられているものである。
An embodiment of the present invention will be described below with reference to FIGS. 1 to 7. In each figure, numeral 1 represents a DIP type electronic component, and in this embodiment, a DIP type IC (hereinafter abbreviated as IC) will be explained as an example. Reference numeral 20 indicates a lead, and a plurality of leads 20 are formed so as to project horizontally from the side of the ICI and extend downward.

第1図は本発明のリードフォーミング装置の全体構成図
を示しており、図において3は、リード20成形前のI
CIが供給され、後工程の成形手段4へICIを1個分
離・供給する供給部を示している。上記成形手段4は、
第4図乃至第7図に示すように、第1成形型100.第
2成形型200、第3成形型300及び第4成形型40
0の4つの金型より成っている。
FIG. 1 shows an overall configuration diagram of the lead forming apparatus of the present invention, and in the figure, 3 indicates the I.
A supply section is shown in which CI is supplied, and one ICI is separated and supplied to the molding means 4 in the subsequent process. The molding means 4 is
As shown in FIGS. 4 to 7, a first mold 100. Second mold 200, third mold 300, and fourth mold 40
It consists of four molds: 0.

上記第1成形型100は、第4図(a)、(b)に示す
ように、上形部Uは、上型101と、IC押え部102
と、圧縮バネ103と、上型ベース104とより成り、
下型部りは、下型105と、下型部のIC位置決めベー
ス106と、圧縮バネ107と、下型ベース108とよ
り成る。上記上型101は上記IC押え部102を介し
て左右対称に形成されており、その一端は上型ベース1
04に取付けられている。この上型101の下端には傾
斜成形面101aが形成されている。上記IC押え部1
02と上型ベース104間に圧縮バネ103が介在され
る。上記下型105は、下端が下型ベース108に取付
けられ、上端には上記傾斜成形面101aと対応する傾
斜成形面105aが形成されている。この下型105は
上記位置決めベース106を介して左右対称に形成され
ている。このIC位置決めベース106と下型ベース1
08間に圧縮バネ107が介在される。
As shown in FIGS. 4(a) and 4(b), the first mold 100 has an upper mold portion U that includes an upper mold 101 and an IC holding portion 102.
, a compression spring 103, and an upper mold base 104,
The lower mold part consists of a lower mold part 105, an IC positioning base 106 of the lower mold part, a compression spring 107, and a lower mold base 108. The upper mold 101 is formed symmetrically with the IC holding part 102 interposed therebetween, and one end thereof is formed on the upper mold base 1.
It is attached to 04. An inclined molding surface 101a is formed at the lower end of this upper mold 101. The above IC holding part 1
A compression spring 103 is interposed between the upper die base 104 and the upper mold base 104. The lower end of the lower mold 105 is attached to the lower mold base 108, and an inclined molding surface 105a corresponding to the inclined molding surface 101a is formed at the upper end. The lower mold 105 is formed symmetrically with respect to the positioning base 106. This IC positioning base 106 and lower die base 1
A compression spring 107 is interposed between 08 and 08.

この第1成形型100の成形動作は、IC押え部102
でICIをIC位置決めベース106側に押圧した状態
で、上型101の傾斜成形面101aと下型105の傾
斜成形面105aとでリード20の端部mを、一定の長
さlの所から挟み込むようにしてリード20の端部mを
外方向に折曲して、一定角度に傾斜させる(第3図(b
)参照)。
This molding operation of the first mold 100 is performed by the IC holding part 102.
While pressing the ICI toward the IC positioning base 106, the end m of the lead 20 is sandwiched between the inclined molding surface 101a of the upper mold 101 and the inclined molding surface 105a of the lower mold 105 from a certain length l. In this way, the end m of the lead 20 is bent outward and tilted at a certain angle (see Fig. 3(b)).
)reference).

上記第2成形型200は、第5図に示すように、上型部
Uが上型201と、上型部のIC押え部202と、圧縮
バネ203と、上型ベース204とより成り、下型部り
が下型205と、下型部のIC位置決めベース206と
、下型ベース207とより成る。上記上型201は下端
の内側に傾斜面201aが形成されている。上記下型2
05の上端には傾斜面201aと対応する傾斜面205
aと、リード20の端部mを収納する凹部205bと、
上記第1成形型での成形時に生じたり−ド20の角部S
(第3図参照)の広がりを押圧して矯正する矯正部20
5cが形成されている。この第2成形型200の成形動
作は、IC押え部202でICIをIC位置決めベース
206方向に押圧すると、下型205の先@には傾斜面
201a上を摺動して、この下型205は1頃斜状態か
ら直立状態に回動する。この際、下型205の矯正部2
05cはリード2oの根元を内側方向に押圧し、上記角
部Sの広がりを直角に矯正する。
As shown in FIG. 5, the second mold 200 has an upper mold part U consisting of an upper mold 201, an IC holding part 202 of the upper mold part, a compression spring 203, and an upper mold base 204, and The mold part consists of a lower mold 205, an IC positioning base 206 of the lower mold part, and a lower mold base 207. The upper mold 201 has an inclined surface 201a formed inside its lower end. Above lower mold 2
05 has an inclined surface 205 corresponding to the inclined surface 201a.
a, a recess 205b that accommodates the end m of the lead 20,
Corner S of the dome 20 that occurs during molding with the first mold
Correction unit 20 that presses and corrects the spread (see Figure 3)
5c is formed. The molding operation of the second mold 200 is such that when the IC presser 202 presses the ICI toward the IC positioning base 206, the tip of the lower mold 205 slides on the inclined surface 201a, and the lower mold 205 slides on the inclined surface 201a. Around 1, it rotates from a tilted state to an upright state. At this time, the correction part 2 of the lower die 205
05c presses the base of the lead 2o inward to correct the widening of the corner S to a right angle.

上記第3成形型300は、第6図に示すように、上型部
Uは、上型301と、上型ベース302とより成り、下
型部は下型303と、IC位置決めベース304と、圧
縮バネ305と、下型ベース306とから成る。上記上
型301は一端を直接上型ベース302に取付け、下端
の両側には中空部301bを介して、水平成形面301
aを形成した断面凹状の金型である。上記下型303は
上端に上記上型301の水平成形面301aと対応する
水平成形面303aが形成されている。この第3成形型
300の成形動作は、ICIを押えつつ下型303の上
端の水平成形面303aと上型301の下端の水平成形
面301aとでリード20の端部mを狭むことによりリ
ード20の端部mを直角に折曲する。このように、リー
ド20の端「ツ徐々に外方に成形されることになる。
In the third mold 300, as shown in FIG. 6, the upper mold part U consists of an upper mold 301 and an upper mold base 302, and the lower mold part includes a lower mold 303, an IC positioning base 304, It consists of a compression spring 305 and a lower die base 306. One end of the upper mold 301 is directly attached to the upper mold base 302, and horizontal molding surfaces 301 are attached to both sides of the lower end through hollow parts 301b.
This is a mold with a concave cross section. The lower mold 303 has a horizontal molding surface 303a corresponding to the horizontal molding surface 301a of the upper mold 301 at its upper end. The molding operation of the third mold 300 is performed by narrowing the end m of the lead 20 between the horizontal molding surface 303a at the upper end of the lower mold 303 and the horizontal molding surface 301a at the lower end of the upper mold 301 while holding down the ICI. Bend the end m of 20 at a right angle. In this way, the ends of the leads 20 are gradually shaped outward.

上記第4成形型400は、第7図に示すように、上記第
3成形型300で成形されたリード20の端部mの先端
25を切断する金型である。この第4成形型400の上
型部Uは、切断型401と、上型部のIC押え部402
と、圧縮バネ403と、上型ベース404とから成り、
下型部りは、下型405と、IC位置決めベース406
と、圧縮バネ407と、下型ベース408とから成って
いる。
The fourth mold 400 is a mold for cutting the tip 25 of the end m of the lead 20 molded by the third mold 300, as shown in FIG. The upper mold part U of this fourth mold 400 includes a cutting mold 401 and an IC holding part 402 of the upper mold part.
, a compression spring 403, and an upper mold base 404,
The lower mold part includes a lower mold 405 and an IC positioning base 406.
, a compression spring 407 , and a lower die base 408 .

上記切断型401の下端内側にはリード2oを切断しや
すいように刃部401aが形成しである。
A blade portion 401a is formed inside the lower end of the cutting die 401 to facilitate cutting of the lead 2o.

上記IC押え部402の下端は、リード2oの端部mを
押圧する抑圧部402aが形成されている。
A suppressing portion 402a that presses the end m of the lead 2o is formed at the lower end of the IC holding portion 402.

上記下型405の上端は、リード2oを載置する上面4
05aと、上記刃部401aが摺接する側壁405bと
から形成している。この第4成形型400の切断動作は
、下型405の上面405aの上にリード20の端部m
を設置させた状態ス、この端部mをIC押え部402の
押圧部402aで押圧しつつ、切断型401を下型40
5の上部側壁405bに摺接させることによりリード2
0の端部mの先端25を切断する。
The upper end of the lower mold 405 is the upper surface 4 on which the lead 2o is placed.
05a, and a side wall 405b with which the blade portion 401a slides. This cutting operation of the fourth mold 400 is performed so that the end m of the lead 20 is placed on the upper surface 405a of the lower mold 405.
In the state in which the cutting die 401 is placed, the cutting die 401 is pressed against the lower die 40 while pressing this end m with the pressing part 402a of the IC holding part 402.
By slidingly contacting the upper side wall 405b of the lead 2
0. Cut the tip 25 of the end m.

5は検査部を示しており、この検査部5は上記各成形型
によって成形されたICIのリード形状をチェックする
機能を果たす。6は収納部を示しており、この収納部6
は良品用ケースと不良品ケ −スに分かれており、良品
用ケースの入口は所定の成形ICの形状に合わせた形状
に形成されている。7はコントロール部を示し、本装置
の制御を行なうものである。8はベースを示し、このベ
ース8に本装置の各構成要素が設置される。
Reference numeral 5 designates an inspection section, and this inspection section 5 has the function of checking the shape of the ICI lead molded by each of the above-mentioned molds. 6 indicates a storage section, and this storage section 6
The case is divided into a case for non-defective products and a case for defective products, and the entrance of the non-defective case is formed in a shape that matches the shape of a predetermined molded IC. Reference numeral 7 denotes a control section, which controls the apparatus. Reference numeral 8 denotes a base, on which each component of the apparatus is installed.

次に、以上のように構成された本発明のリードフォーミ
ング装置の作用を第2図、第3図をもとに説明する。
Next, the operation of the lead forming apparatus of the present invention constructed as described above will be explained with reference to FIGS. 2 and 3.

先ず、成形前のICIが供給部3に送り込まれ、このI
CIを1個づつ成形手段4へ送り込む。第1段階成形と
して第1成形型100に送り込まれたICIのリード2
0は、この第1成形型100がプレス動作することによ
り第3図(a)に示すような形状に折曲される。次に第
2段階成形として第2成形型200に送り込まれたIC
Iのり−ド20は、この第2成形型200のプレス動作
と下型205の動作により第3図(b)に示すような形
状に折曲される。さらに第3段階成形として第3成形型
300に送り込まれたICIのリード20は、この第3
成形型300のプレス動作により第3図(c)に示すよ
うな形状に折曲される。
First, ICI before molding is fed into the supply section 3, and this ICI
The CIs are fed into the forming means 4 one by one. ICI lead 2 fed into the first mold 100 as the first stage molding
0 is bent into the shape shown in FIG. 3(a) by the press operation of the first mold 100. Next, the IC is fed into the second mold 200 as a second stage molding.
The I-glue 20 is bent into the shape shown in FIG. 3(b) by the pressing operation of the second mold 200 and the operation of the lower mold 205. Furthermore, the ICI lead 20 fed into the third mold 300 as a third stage molding is
By the pressing operation of the mold 300, it is bent into the shape shown in FIG. 3(c).

そして最終段階の成形として第4成形型400に送り込
まれたICIのリード20の先端25は、この第4成形
型のプレス動作により切断され、第3図(d)に示すよ
うな形状のICIが成形される。上記成形手段4により
成形されたICIは検査部5に送り込まれ、101の各
リード20間ピッチとり−ド20先端の水平曲げ状態を
、所定の値と検討比較されそのデータが出力されて良品
/不良品に振り分けられる。そして、この振り分けられ
たICIはそれぞれ良品/不良品別に収納部6の良品ケ
ース、不良品ケースに収納される。成形手段4のプレス
動作に代表される成形動作は、コントロール部8に組み
込まれた各成形型のメカ情報を、演算処理後に各成形型
に連動しているアクチュエータ(図示しない)に出力す
ることにより連続的に動作する。本発明のリードフォー
ミング装置は各要素が連続的に動作するように、各工程
はコントロール部8によりシーケンス制御を主体とした
コントロールが行なわれる。
The tip 25 of the ICI lead 20 fed into the fourth mold 400 as the final stage of molding is cut by the pressing operation of this fourth mold, resulting in an ICI having the shape shown in FIG. 3(d). molded. The ICI molded by the molding means 4 is sent to the inspection section 5, where the pitch between each lead 20 of 101 and the horizontal bending state of the tip of the lead 20 are examined and compared with a predetermined value, and the data is outputted to determine whether the product is good or not. Sorted as defective products. The sorted ICIs are stored in a non-defective case and a defective case in the storage section 6, respectively, according to whether they are non-defective or non-defective. The molding operation represented by the pressing operation of the molding means 4 is performed by outputting the mechanical information of each mold built into the control section 8 to an actuator (not shown) linked to each mold after calculation processing. Operates continuously. In the lead forming apparatus of the present invention, each process is controlled mainly by sequence control by the control section 8 so that each element operates continuously.

尚、上記実施例では成形手段4として4つの成形型を構
成した例を示したが、ICIのリード20の成形におけ
る要求精度により、この型構成は変更が可能である。
In the above embodiment, an example was shown in which four molds were used as the molding means 4, but this mold configuration can be changed depending on the accuracy required in molding the ICI lead 20.

例えば第2成形型200を除いた型構成にしても、リー
ド20の成形精度をある程度確保できる。
For example, even with a mold configuration that excludes the second mold 200, the molding accuracy of the lead 20 can be ensured to some extent.

一方、リード20の成形精度向上のために第4成形型の
後に、精度検討用として第3成形型を手押して操作する
ような第5成形型を構成するようにしてもよい。
On the other hand, in order to improve the molding accuracy of the lead 20, a fifth mold may be constructed after the fourth mold, which is operated by manually pushing the third mold for examining the accuracy.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明のリードフォーミング装置によ
れば、電子部品1のリード20の端部を外方直角に成形
後その先端を切断する成形手段4を具備したので、これ
によりリード20の成形精度を向上させた社かi電子部
品1を量産できるため、生産性の向上2作業の迅速化が
図れる。
As described above, the lead forming apparatus of the present invention includes the forming means 4 for forming the ends of the leads 20 of the electronic component 1 outward at right angles and then cutting the tips. Since electronic components 1 with improved accuracy can be mass-produced, productivity can be improved and work can be done more quickly.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図乃至第7図は本発明のリードフォーミング装置を
示しており、第1図は全体構成を示す斜視図、第2図は
工程順序を示すフローチャート図、第3図は成形手段4
によるリード20の形状変化を示す説明図、第4図は第
1成形型の構成及び動作説明図、第5図は第2成形型の
構成及び動作説明図、第6図は第3成形型の構成及び動
作説明図、第7図は第4成形型の構成及び動作説明図、
第8図は成形前のICを示す斜視図、第9図は成形後の
ICを示す斜視図である。 20・・・リード、3・・・供給部、4・・・成形手段
、5・・・検査部、6・・・収納部、7・・・コントロ
ール部、8・・・ベース、100〜400・・・第1〜
第4成形型。 代理人  大  岩  増  雄(ほか2名)第3図 ^                  寸第8凹 手続補正書(1錨 昭和  年  月  日 2、発明の名称 リードフォーミング装置 3、補正をする者 代表者志岐守哉 三菱電機株式会社内 5、補正の対象 発明の詳細な説明の欄。 6、補正の内容 (1)明細書第11頁第11行目「精度検討用として」
とあるのを削除する。 (2)同書第11頁第11行目「を手押」とあるのを「
と同一型構成の成形型として」と補正する。 (3)同書第11頁第12行目「して操作するような」
とあるのを削除する。 以上
1 to 7 show the lead forming apparatus of the present invention, FIG. 1 is a perspective view showing the overall configuration, FIG. 2 is a flowchart showing the process order, and FIG. 3 is a forming means 4.
FIG. 4 is an explanatory diagram of the configuration and operation of the first mold, FIG. 5 is an explanatory diagram of the configuration and operation of the second mold, and FIG. 6 is an explanatory diagram of the configuration and operation of the third mold. An explanatory diagram of the configuration and operation, FIG. 7 is an explanatory diagram of the configuration and operation of the fourth mold,
FIG. 8 is a perspective view showing the IC before molding, and FIG. 9 is a perspective view showing the IC after molding. 20... Lead, 3... Supply section, 4... Molding means, 5... Inspection section, 6... Storage section, 7... Control section, 8... Base, 100-400 ... 1st ~
Fourth mold. Agent: Masuo Oiwa (and 2 others) Figure 3: No. 8 recess procedure amendment form (1 Anchor Showa year, month, day 2, Name of invention: Lead forming device 3, Person making the amendment Representative: Moriya Shiki, Mitsubishi Electric Co., Ltd. 5. Column for detailed explanation of the invention subject to amendment. 6. Contents of amendment (1) Page 11, line 11 of the specification "For accuracy review"
Delete that. (2) In the same book, page 11, line 11, the phrase “press by hand” was replaced with “
``as a mold with the same mold configuration as ``. (3) Same book, page 11, line 12, “like operating by doing”
Delete that. that's all

Claims (2)

【特許請求の範囲】[Claims] (1)電子部品1より電子部品1の下部方向に突出する
リード20の端部mを、一定の長さlの所から外方向に
直角に折曲した後、その端部mの先端25を切断する成
形手段4を具備するリードフォーミング装置において、 上記成形手段4は、上記リード20の端部mを、一定の
長さlの所から外方向に傾斜状態で折曲する第1成形型
100と、この第1成形型100で成形された傾斜状態
の端部mを直角に折曲する第3成形型300と、この第
3成形型300で成形された端部mの先端25を切断す
る第4成形型400とから成ることを特徴とするリード
フォーミング装置。
(1) After bending the end m of the lead 20 protruding from the electronic component 1 toward the bottom of the electronic component 1 at a right angle outward from a certain length l, the tip 25 of the end m is bent. In a lead forming apparatus equipped with a forming means 4 for cutting, the forming means 4 includes a first forming die 100 that bends the end m of the lead 20 from a certain length l in an outwardly inclined state. A third mold 300 is used to bend the inclined end m formed by the first mold 100 at right angles, and a tip 25 of the end m molded by the third mold 300 is cut. A lead forming device comprising a fourth mold 400.
(2)第1成形型100の後段には、リード20の根元
側を内方向に押圧する下型205を含む第2成形型20
0が設置されて成ることを特徴とする特許請求の範囲第
1項記載のリードフォーミング装置。
(2) At the rear stage of the first mold 100, a second mold 20 including a lower mold 205 that presses the root side of the lead 20 inward
2. The lead forming apparatus according to claim 1, wherein a lead forming apparatus is provided with a lead forming apparatus having a lead forming apparatus.
JP25295586A 1986-10-24 1986-10-24 Lead forming device Pending JPS63108919A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25295586A JPS63108919A (en) 1986-10-24 1986-10-24 Lead forming device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25295586A JPS63108919A (en) 1986-10-24 1986-10-24 Lead forming device

Publications (1)

Publication Number Publication Date
JPS63108919A true JPS63108919A (en) 1988-05-13

Family

ID=17244487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25295586A Pending JPS63108919A (en) 1986-10-24 1986-10-24 Lead forming device

Country Status (1)

Country Link
JP (1) JPS63108919A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4907628A (en) * 1988-10-28 1990-03-13 Fancort Industries, Inc. Process and device for forming leads
US4945953A (en) * 1989-05-02 1990-08-07 The United States Of America As Represented By The United States Department Of Energy Surface mount component jig
US5012664A (en) * 1988-12-12 1991-05-07 Micron Technology, Inc. Progressive form die
JPH03219661A (en) * 1990-01-25 1991-09-27 Y K C:Kk Outer lead bending device for semiconductor package
US5135034A (en) * 1990-02-28 1992-08-04 Kabushiki Kaisha Toshiba Outer lead forming apparatus for semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5339460A (en) * 1976-09-22 1978-04-11 Hitachi Ltd Device for bending lead wires into form
JPS5622416A (en) * 1979-07-31 1981-03-03 Canon Inc Digital information setting unit
JPS59215758A (en) * 1983-05-23 1984-12-05 Yamada Seisakusho:Kk Forming method of semiconductor lead

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5339460A (en) * 1976-09-22 1978-04-11 Hitachi Ltd Device for bending lead wires into form
JPS5622416A (en) * 1979-07-31 1981-03-03 Canon Inc Digital information setting unit
JPS59215758A (en) * 1983-05-23 1984-12-05 Yamada Seisakusho:Kk Forming method of semiconductor lead

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4907628A (en) * 1988-10-28 1990-03-13 Fancort Industries, Inc. Process and device for forming leads
US5012664A (en) * 1988-12-12 1991-05-07 Micron Technology, Inc. Progressive form die
US4945953A (en) * 1989-05-02 1990-08-07 The United States Of America As Represented By The United States Department Of Energy Surface mount component jig
JPH03219661A (en) * 1990-01-25 1991-09-27 Y K C:Kk Outer lead bending device for semiconductor package
US5135034A (en) * 1990-02-28 1992-08-04 Kabushiki Kaisha Toshiba Outer lead forming apparatus for semiconductor device

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