JPS61213133A - Manufacture of containment case for electronic parts - Google Patents

Abstract

PURPOSE:To prevent generation of cut-off looseness and burrs, by a method wherein press bonding treatment is applied to an elastic member whose cut-off end face has been heated at the temperature falling within a specific range and hardness is specific. CONSTITUTION:In case of manufacture of containment case for electronic parts by extruding thermoplastic resin continuously through an extruding machine and cutting off the same in a predetermined length, press bonding treatment is applied to an lastic member whose cut-off end face has been heated at 100 deg.C-150 deg.C and hardness is Hs:30 deg.-90 deg.. At a press bonding process of the end face, thermocompression bonding of a heat-resisting rubber layer 3 formed unitarily with a hot plate is applied to a cut-off face of the case. With this construction, as for the manufactured case for electronic parts, the case which possesses neither whitening on the cut-off face nor cut-off looseness nor cut-off burrs and is superior in an external appearance is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a case for storing electronic components such as ICs.

[Conventional technology and problems]

Thermoplastic resin cases that can store multiple electronic components in an array are extremely effective as protective cases for transporting electronic components, and can also be used by being directly loaded into automatic electronic component insertion machines. It is widely used and demand has increased rapidly in recent years. Conventionally, the manufacturing of electronic component storage cases has generally consisted of a continuous extrusion process from an extruder and a cutting process into predetermined dimensions.

In the above-mentioned cutting process, cutting with a saw tooth or cutting with a knife-like blade is used.

However, cutting with a saw tooth requires a separate process to remove chips remaining on the cut surface with air, etc., and the dimensional accuracy after cutting is also low, and cutting with a knife-shaped blade causes whitening of the cut surface, sagging, and Cutting burrs are likely to occur, and these not only impair the appearance, but especially cutting sag and cutting burrs have drawbacks such as obstructing the insertion and removal of electronic components.

[Means for solving problems]

The present invention can overcome the drawbacks of the conventional cutting process, and is a method for manufacturing electronic component storage cases by continuously extruding thermoplastic resin from an extruder and cutting it into a predetermined length. , the cut end surface was heated to 100°C to 150°C.
The above-mentioned improved manufacturing method is characterized in that an elastic member having a hardness Hs of 30° to 90° heated to 0° C. is compressed.

In the case of the present invention, a thermoplastic resin is used as a material for the six cases including storage cases for electronic components such as IC1 resistors, and preferably a transparent material is used. In the extrusion process, these thermoplastic resins are continuously extruded from an extruder.

The extruder may be of any type conventionally used, and by selecting a die, cases can be manufactured according to the shape of various electronic components. The knife-shaped blade used in the second cutting step is preferably one with an appropriate thickness. For example, if the thickness is less than 0.1 mm, the strength necessary for cutting cannot be obtained, and if it is more than 2.0 mm, a good cross-sectional shape cannot be obtained. Since it becomes impossible to obtain such an amount, those having an amount of 0.1 to 2.0 an are advantageously employed. A suitable shape of the knife-like blade is, for example, the shape shown in FIG. 2, and it is effective to rotate this as necessary.

Furthermore, in the end face crimping process, a heat resistant rubber layer 3 formed integrally with the hot plate 2 is heat crimped onto the cut surface of the case, and the heat resistant rubber used for this rubber layer is preferably silicone rubber. , and various other heat-resistant rubbers are also used. These heat-resistant rubbers have a hardness of Hs (JIS 6301
If the hardness) is less than 30°, it is difficult to repair end face deformation, and on the other hand, if Hs exceeds 90', deformation (sag) of the end face will occur, which is undesirable for practical purposes, so it is preferable that Hs is in the range of 30' to 90°. . Further, in order to obtain a good finish, it is desirable that the temperature of the hot plate is in the range of 100°C to 150°C. Furthermore, the pressing force of the heat-treated plate to the end surface of the case is adjusted by the air cylinder stroke and air pressure, and the pressing time is freely set by a timer built into the device.

Such heat treatment eliminates cut edges, cut sag, and adhering cut powder on the cut surface, and effectively eliminates the whitening phenomenon.

〔Example〕

Next, this will be explained with reference to the attached drawings showing one embodiment; FIG. 1 is a perspective view showing a state in which a heat treatment plate is brought close to bond the end face of an IC case by thermocompression.

1 is a heat-treated plate, 2 is a hot plate, and 3 is a heat-resistant rubber layer.

FIGS. 2A to 2C are front views showing some examples of cutting blades.

The cross-sectional shape is about 15mm on the bottom side, about 8mm on the top side, and about 13mm in height.
IC cases made of vinyl chloride with a trapezoidal shape of m are extruded one after another from an extruder, passed through a sizing table and a cooling tank, and taken by a take-up machine.
It was cut to 01m. The cut surface had whitening and cracks, but the cut surface of the case.

When it was pressed for 5 seconds with a silicone rubber layer having a hardness of Hs 60' heated to about 130° C., all of the above-mentioned whitening, cutting edges, etc. on the cut surface disappeared.

〔Effect of the invention〕

As described above, the case for electronic components manufactured by the method according to the present invention has an excellent appearance because there is no whitening of the cut surface, no sagging, and no cutting edges, and it does not interfere with the insertion and removal of electronic components. In addition, by adjusting the thermocompression bonding force, it is not only possible to correct any whitening, etc. that occurs on the cut surface, but also to correct the dimensions of the case, which prevents defective products and improves dimensional accuracy. The practical effects are extremely large, such as improving the

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing a state where the heat treatment plate is placed close to the end face of the IC case for thermocompression bonding, and (a) to (a) in Fig.
D) is a front view showing an example of a cutting blade. In the diagram

Claims (1)

[Claims] 1) In a method of manufacturing an electronic component storage case by continuously extruding a thermoplastic resin from an extruder and cutting it into a predetermined length, the cut end surface is heated to 100 ° C. to 150 ° C. Hardness Hs: 30 The improved manufacturing method described above, characterized in that the elastic member is crimped at an angle of 90° to 90°.