JPS6119117B2 - - Google Patents
Info
- Publication number
- JPS6119117B2 JPS6119117B2 JP12611479A JP12611479A JPS6119117B2 JP S6119117 B2 JPS6119117 B2 JP S6119117B2 JP 12611479 A JP12611479 A JP 12611479A JP 12611479 A JP12611479 A JP 12611479A JP S6119117 B2 JPS6119117 B2 JP S6119117B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- shaped molded
- mold
- lead frame
- molded product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000047 product Substances 0.000 claims description 69
- 239000004065 semiconductor Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 15
- 238000005304 joining Methods 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000012768 molten material Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 9
- 238000002788 crimping Methods 0.000 claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 4
- 239000012467 final product Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 238000003860 storage Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
本発明はダイオードやトランジスターのような
半導体素子や、これら半導体の集積回路（以下半
導体類と称す）を気密収納するためのパツケージ
成形方法に関するものであり更に詳しくは予め成
形された、少なくとも１個が半導体類を収納する
ための窪みを有する２個の熱可塑性樹脂板状成形
品（以下板状成形品と称す）を合体用型に収容し
た状態で加熱した後、もしくは加熱しながら半導
体類を装着したリードフレームを挾み加圧合体さ
せる半導体類のパツケージ成形方法に於いて外観
上もしくは場合によつては半導体類の動作機能上
障害となるフラツシユを合体段皆で発生せしめな
いためのフラツトパツケージ及びデユアルインラ
インパツケージ等のパツケージ成形方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a package forming method for airtightly housing semiconductor elements such as diodes and transistors, and integrated circuits of these semiconductors (hereinafter referred to as semiconductors). after heating two thermoplastic resin plate-shaped molded products (hereinafter referred to as plate-shaped molded products), each of which has a recess for accommodating semiconductors, in a state where they are housed in a mold for combination, or In the package forming method for semiconductors, in which lead frames with semiconductors attached are sandwiched and pressed together while heating, flashing occurs at all stages of the assembly, which can impede the appearance or, in some cases, the operational function of the semiconductors. The present invention relates to a method for molding packages such as flat packages and dual-in-line packages to prevent damage.
従来最も普及しているエポキン樹脂のトランス
フア封止成形法に於いては成形時の樹脂粘度が
高々102ボイズオーダーであるため、リードフレ
ームの厚みのバラツキ、成形金形加工の精度及び
成形使用にともなう摩耗や寸法の狂い等によりリ
ードフレーム上にエポキン樹脂のフラツシユが発
生しやすく、外観上の問題はもとより鍍金の不均
一性、リードとソケツトとの接触不良や半田づけ
作業の妨げ等の原因となるため除去作業が必要と
なる等の欠点を有していた。 In the transfer encapsulation molding method of Epoquin resin, which is the most widely used conventional method, the resin viscosity during molding is on the order of 10 2 Boise at most, resulting in variations in the thickness of the lead frame, precision of mold processing, and molding usage. Epoquine resin tends to flash on the lead frame due to abrasion and dimensional deviations, which can cause not only appearance problems but also uneven plating, poor contact between leads and sockets, and interference with soldering work. This has disadvantages such as the need for removal work.
また２個の板状成形品による半導体類のパツケ
ージ成形方法においては使用する熱可塑性樹脂組
成物の本質的な流動特性および少なくとも板状成
形品の合体面のみを溶融流動させれば良いといつ
た成形方法の特殊性等のため合体時の樹脂組成物
の粘度は103〜104ボイズオーダーとエポキシ樹脂
に比べて格段に高く、フラツシユが本質的に発生
しにくい有利性はあるがそれでもなお第１図に示
したような従来提案されている窪み付金型１，
１′から板状成形品３，３′の溶融合体代２，２′
が突出している合体方法に於いては、合体用型の
温度を、板状成形品を構成する熱可塑性樹脂の流
動温度を考慮して適温に制御することによりフラ
ツシユの量を低減することはできても構造的な問
題からフラツシユを皆無にすることは出来なかつ
た。 In addition, in a semiconductor package molding method using two plate-shaped molded products, the essential flow characteristics of the thermoplastic resin composition used and the fact that at least only the combined surfaces of the plate-shaped molded products need to be melted and flowed are explained. Due to the special nature of the molding method, the viscosity of the resin composition when combined is on the order of 10 3 to 10 4 voids, which is much higher than that of epoxy resins, which has the advantage that flashing is essentially less likely to occur. A conventionally proposed mold with a recess 1 as shown in Fig. 1,
1' to the plate-shaped molded products 3, 3' melted melt 2, 2'
In the case of a joining method in which there is a pronounced However, due to structural problems, it was not possible to completely eliminate flash.
本発明はこのような欠点に鑑みてなされたもの
であり、以下本発明を実施の態様を示す図面によ
り詳細に説明する。 The present invention has been made in view of these drawbacks, and will be described in detail below with reference to drawings showing embodiments.
第２図に於いて予め成形した少なくとも１個
（第２図では２個とも）が、半導体類を収納する
ための窪み５，５′を有し、溶融合体後にリード
フレーム４の表面６または裏面７と接する面をそ
れぞれ同一平面内に含む仮想断面８，８′の輪郭
をリードフレーム面に平行な面の最大輪郭とした
形状の２個の板状成形品３，３′を、該仮想断面
８，８′の輪郭即ち合体後の最終製品に於いてリ
ードフレーム表裏面とそれぞれ接する部分の輪郭
と同一形状でかつ少なくとも該板状成形品３，
３′の溶融合体代２，２′の厚み分を深さとし、更
に合体前に板状成形品の溶融合体代２，２′がリ
ードフレームを固定する合体用型１０，１０′の
型面１１，１１′よりも突出しない形状とした板
状成形品収容窪み１２，１２′に収容する。 In FIG. 2, at least one (both in FIG. 2) pre-formed parts have recesses 5, 5' for accommodating semiconductors, and after the molten material is formed, the front surface 6 or the back surface of the lead frame 4 is formed. Two plate-shaped molded products 3, 3' each having a shape in which the contours of the virtual cross sections 8, 8' including the surfaces in contact with the lead frame 7 in the same plane are the maximum contours of the surfaces parallel to the lead frame surface. 8 and 8', that is, in the final product after assembly, the shape is the same as the outline of the parts that contact the front and back surfaces of the lead frame, respectively, and at least the plate-shaped molded product 3,
The depth is equal to the thickness of the molten material margins 2, 2' of 3', and the mold surfaces 11 of the merging molds 10, 10' to which the molten material margins 2, 2' of the plate-shaped molded products fix the lead frame before joining. , 11'.
第３図は上記の仮想断面、仮想断面の輪郭およ
び溶融合体代の理解をしやすくする為に示した透
視概念図であり、それぞれ８，９および２の番号
を付して示し、特に仮想断面にはハツチングを施
してある。 FIG. 3 is a perspective conceptual diagram shown to facilitate understanding of the virtual cross section, the contour of the virtual cross section, and the molten mass, and is shown with numbers 8, 9, and 2, respectively, and especially the virtual cross section. is hatched.
板状成形品を合体用型の板状成形品収容窪みに
収容した後種々の加熱手段例えば種々の加熱源に
よる伝熱、対流および輻射により、また伝熱の特
殊例として超音波振動により熱エネルギーを板状
成形品の溶融合体代２，２′に与え前三者の加熱
方法にあつては溶融合体代を軟化溶融させた後２
個の合体用型でリードフレームを表裏両側より挾
み固定した後、合体用型と独立して板状成形品を
リードフレームに圧着する板状成形品圧着機１
３，１３′により板状成形品をリードフレームに
圧着合体させる。 After the plate-shaped molded products are accommodated in the plate-shaped molded product storage recesses of the mold for combining, thermal energy is generated by various heating means, such as heat transfer, convection, and radiation from various heating sources, and as a special example of heat transfer, by ultrasonic vibration. is applied to the molten mixture 2 and 2' of the plate-shaped molded product, and in the case of the first three heating methods, after softening and melting the molten mixture, 2
Plate-shaped molded product crimping machine 1 that clamps and fixes the lead frame from both the front and back sides with a combination mold, and then crimps the plate-shaped molded product to the lead frame independently of the combination mold.
3 and 13', the plate-shaped molded product is crimped and joined to the lead frame.
超音波振動による溶融合体代の加熱の場合は摩
擦発熱の性質上２個の合体用型の板状成形品収容
窪みに板状成形品を収容した後、合体用型でリー
ドフレームを表裏両面より挾み固定し、板状成形
品圧着機１３，１３′を兼ねた超音波振動工具ホ
ーンにより加圧しながら超音波振動を加え板状成
形品をリードフレームに圧着合体させる。 In the case of heating the molten material by ultrasonic vibration, due to the nature of frictional heat generation, after the plate-shaped molded product is accommodated in the plate-shaped molded product storage recess of the two merging molds, the lead frame is heated from both the front and back sides using the merging mold. The plate-shaped molded product is clamped and fixed, and ultrasonic vibration is applied while applying pressure using an ultrasonic vibrating tool horn that also serves as the plate-shaped molded product crimping machine 13, 13' to press and bond the plate-shaped molded product to the lead frame.
板状成形品圧着機を兼ねた超音波振動工具ホー
ンの数は１個または２個いずれの方式でも良好裏
に適用できる。 Either one or two ultrasonic vibrating tool horns that also serve as a press-bonding machine for a plate-like molded product can be used with good results.
いずれにしても板状成形品の仮想断面の輪郭９
がリードフレーム面に平行な面の最大輪郭となる
ような板状成形品と該最大輪郭と同じ形状でかつ
少なくとも板状成形品の溶融合体代２の厚み分を
深さとし合体前に合体用型の型面１１でリードフ
レームを表裏両面より挾み固定する上で障害とな
る型面１１からの板状成形品溶融合体代２の突出
が生じないような形状の板状成形品収容窪み１２
を有する合体用型を用いることが必要である。 In any case, the outline of the virtual cross section of the plate-shaped molded product 9
A plate-shaped molded product having the maximum contour of a plane parallel to the lead frame surface and a joining mold having the same shape as the maximum contour and having a depth equal to at least the thickness of the molten metal 2 of the plate-shaped molded product before joining. A plate-shaped molded product storage recess 12 is shaped so that the plate-shaped molded product molten body 2 does not protrude from the mold surface 11, which would be an obstacle when sandwiching and fixing the lead frame from both sides of the mold surface 11.
It is necessary to use a merging mold with
即ち溶融合体代２が軟化溶融した板状成形品が
板状成形品圧着機によつてリードフレームに向つ
て表裏両面から圧着されると溶融合体代が変形し
流動をはじめるが板状成形品３の仮想断面の輪郭
が、収容されている合体用型の板状成形品収容窪
み１２の形状と同一である為流動樹脂が仮想断面
の輪郭を越えて流動することが防止でき、一方リ
ードフレームは合体用型の型面によつて表裏両面
に密着固定されているため第２図に於けるリード
フレームのダム１４と合体用型の型面１１，１
１′およびリードによつて形成される意図したフ
ラツシユ溜め１５には樹脂が流動するが型面とリ
ード表裏面の間には流動しえず有害なフラツシユ
を形成することが防止できる。 That is, when the plate-shaped molded product in which the molten metal material 2 softens and melts is pressed against the lead frame from both sides by the plate-shaped molded product crimping machine, the molten metal material deforms and begins to flow, but the plate-shaped molded product 3 Since the outline of the imaginary cross-section of the lead frame is the same as the shape of the plate-shaped molded product storage recess 12 of the mold for combining, it is possible to prevent the fluid resin from flowing beyond the outline of the imaginary cross-section. Since both the front and back sides are closely fixed by the mold surfaces of the merging mold, the dam 14 of the lead frame and the mold surfaces 11 and 1 of the merging mold in FIG.
The resin flows into the intended flash reservoir 15 formed by the mold surface 1' and the lead, but cannot flow between the mold surface and the front and back surfaces of the lead, thereby preventing the formation of harmful flash.
更に好ましいことには前述のように本発明で使
用する板状成形品を構成する熱可塑性樹脂の流動
時の粘度は103〜104ボイズオーダーとエポキシ樹
脂に比べて格段に高く、リードフレーム自体の厚
みのバラツキや合体用型の加工精度および型の使
用にともなう摩耗や寸法の狂い等によりリードフ
レームと合体用型の型面間に微細な隙間が生じて
も有害なフラツシユを形成することを防ぐことが
可能となる。 More preferably, as mentioned above, the viscosity of the thermoplastic resin constituting the plate-shaped molded product used in the present invention during flow is on the order of 10 3 to 10 4 voids, which is much higher than that of epoxy resin, and the lead frame itself Even if a minute gap is created between the lead frame and the mold surface of the lead frame and the mold surface due to variations in the thickness of the lead frame, machining accuracy of the lead frame, wear due to the use of the mold, or deviations in dimensions, harmful flash may be formed. It is possible to prevent this.
第４図〜第６図は本発明に係る良好な結果の得
られる板状成形品の形状を合体用型の形状との関
係に於いて示したものであり特に第４図は第２図
に示した溶融合体代２の側面全面が合体用型１０
の板状成形品収容窪み１２の表面に密着した形状
であり、前述のように加熱溶融された流動樹脂が
仮想断面の輪郭を越えないという点で最も好まし
い形状である。 Figures 4 to 6 show the shape of the plate-shaped molded product that yields good results according to the present invention in relation to the shape of the merging mold. The entire side surface of the molten material 2 shown is the joining mold 10.
This shape is in close contact with the surface of the plate-shaped molded product accommodation recess 12, and is the most preferable shape in that the heated and melted fluid resin does not exceed the contour of the imaginary cross section as described above.
フラツシユを少なくする配慮から板状成形品収
容窪み１２の表面の温度を低く設定した場合、板
状成形品の溶融合体代を加熱しても板状成形品収
容窪み１２の表面に密着した部分の溶融合体代の
温度が所定の加熱時間を経過した後もなお充分に
上昇せず、フラツシユは発生しないが板状成形品
とリードフレーム間の密着性が充分得られない場
合がある。このような問題は加熱時間を長くする
ことで解決できるが第５図もしくは第６図に示し
たように仮想断面の輪郭をもつた一定の厚みを有
する溶融合体代の角１６の一部（第５図）もしく
は全部（第６図）を型の内面に接触しないように
切り欠いた形状の板状成形品も好適に使用でき
る。 If the temperature of the surface of the plate-shaped molded product housing recess 12 is set low to reduce flashing, even if the molten mass of the plate-shaped molded product is heated, the portion of the plate-shaped molded product that is in close contact with the surface of the plate-shaped molded product housing recess 12 may be heated. Even after the predetermined heating time has elapsed, the temperature of the molten melt still does not rise sufficiently, and although flashing does not occur, sufficient adhesion between the plate-shaped molded product and the lead frame may not be obtained. Such a problem can be solved by increasing the heating time, but as shown in FIG. 5) or a plate-shaped molded product in which the entire part (FIG. 6) is notched so as not to come into contact with the inner surface of the mold can also be suitably used.
本発明に用いられる熱可塑性樹脂としてはそれ
ぞれの半導体類のパツケージに対する要求特性に
応じて種々の種類のものが用いられるが、高い耐
熱性（耐熱変形性及び耐熱劣化性）と低い透湿性
及び一定水準以上の電気、機械特性に加え更に一
定水準以上の成形性を有することが必要である。 Various types of thermoplastic resins are used in the present invention depending on the characteristics required for the package of each semiconductor type, but the thermoplastic resins have high heat resistance (heat deformation resistance and heat deterioration resistance), low moisture permeability, and constant In addition to electrical and mechanical properties that exceed standards, it is also necessary to have moldability that exceeds a certain level.
代表例としてはポリプエニレンオキサイドや、
ポリエーテルサルフオン、ポリスルフオン、フエ
ノキシ樹脂、ポリアセタール等のエーテル系樹
脂、ポリエチレンテレフタレート、ポリプチレン
テレフタレート、ポリアリレート等のエステル系
樹脂、ポリカーポネート等の炭酸エステル系樹
脂、ポリアミド系樹脂の中でも吸水率の低いグレ
ード、ポリフエニレンサルフアイド等の樹脂及び
これら樹脂の一部とガラス繊維を中心とした充填
剤との組み合わせ等をあげることが出来る。 Typical examples include polypenylene oxide,
Among ether resins such as polyether sulfone, polysulfon, phenoxy resin, and polyacetal, ester resins such as polyethylene terephthalate, polybutylene terephthalate, and polyarylate, carbonate ester resins such as polycarbonate, and polyamide resins, the water absorption rate is the highest. Examples include low grade resins, such as polyphenylene sulfide, and combinations of some of these resins and fillers, mainly glass fibers.
また合体用型の材質としては熱伝導性及び耐久
性にすぐれた金属型が好ましいが、熱硬化性樹脂
に金属粉等を均質混合したいわゆる樹脂型も使用
可能である。 Further, as the material for the joining mold, a metal mold having excellent thermal conductivity and durability is preferable, but a so-called resin mold made by homogeneously mixing a thermosetting resin with metal powder or the like can also be used.
実施例
熱変形温度（ASTM Ｄ−648、18.6Kg／cm2）が
260℃以上のポリフエニレンサルフアイド樹脂を
用いて第１表実施例１〜３に示したうな半導体類
を収納するための窪みを有する種々の形状からな
る２個１対の板状成形品を射出成形により成形し
た。Example Heat distortion temperature (ASTM D-648, 18.6Kg/cm 2 )
Using polyphenylene sulfide resin at a temperature of 260°C or higher, a pair of plate-shaped molded products of various shapes having recesses for accommodating semiconductors such as those shown in Examples 1 to 3 of Table 1 were made. Molded by injection molding.
次いで第１表に図示したように合体用型に板状
成形品を収容した後溶融合体代を500℃の熱風に
５〜７秒間あて、半導体回路を装着したリードフ
レームを表裏両面から合体用型の型面で挾み、こ
の直後に板状成形品圧着機により板状成形品をリ
ードフレームに向けて仮想断面が、リードフレー
ムに接触するまで押圧した。 Next, as shown in Table 1, after placing the plate-shaped molded product in the merging mold, the molten mixture is exposed to hot air at 500°C for 5 to 7 seconds, and the lead frame with the semiconductor circuit attached is placed in the merging mold from both the front and back sides. Immediately after this, the plate-shaped molded product was pressed against the lead frame using a plate-shaped molded product crimping machine until the imaginary cross section came into contact with the lead frame.
合体品はいずれもリードフレームのダムと合体
用型の型面およびリードによつて形成される意図
したフラツシユ溜めにフラツシユが形成されたの
みで板状成形品の周辺に有害なフラツシユの発生
は認められなかつた。 In all of the combined products, flash was only formed in the intended flash reservoir formed by the dam of the lead frame, the surface of the mold for combination, and the lead, and no harmful flash was observed around the plate-shaped molded product. I couldn't help it.
比較例
実施例に記載したのと同様に、第１表比較例欄
に記載したような形状の板状成形品を成形し合体
を行なつたが、比較例１および２のように合体前
に板状成形品の溶融合体代がリードフレームを固
定する合体用型の型面よりも突出している場合に
は合体用型の型面をリードフレームの表裏両面に
密着させることが因難となり板状成形品の周辺に
フラツシユが発生した。Comparative Example In the same manner as described in Examples, plate-shaped molded products having the shapes as described in the Comparative Example column of Table 1 were molded and combined, but as in Comparative Examples 1 and 2, before combining. If the molten mass of the plate-shaped molded product protrudes beyond the mold surface of the joining mold that fixes the lead frame, it will be difficult to make the mold surface of the joining mold come into close contact with both the front and back surfaces of the lead frame, resulting in a plate-shaped product. Flashing occurred around the molded product.
比較例３のように合体用型の板状成形品収容窪
みの寸法よりも小さい板状成形品を使用した場合
にはリードフレレーム上にフラツシユは認められ
なかつたが板状成形品のリードフレームに近接し
た部分の外観はこの部分が一旦流動した樹脂によ
り形成されている為、艷のない粗面状であつた。
As in Comparative Example 3, when a plate-shaped molded product smaller than the dimension of the plate-shaped molded product accommodation recess of the joining mold was used, no flash was observed on the lead frame, but the lead frame of the plate-shaped molded product The appearance of the area close to the area was rough, with no ridges, as this area was formed from resin that had once flowed.
以上詳述したように本発明に於いては次のよう
な効果が達成される。 As detailed above, the present invention achieves the following effects.
溶融合体後にリードフレームの表裏両面とそれ
ぞれ接する面をそれぞれ同一平面内に含む仮想断
面の輪郭をリードフレーム面に平行な面の最大輪
郭とした形状の２個の板状成形品を、この最大輪
郭と同一形状でかつ少なくとも板状成形品の溶融
合体代の厚み分を深さとし更に合体前に板状成形
品の合体代がリードフレームを固定する合体用型
の型面よりも突出しない形状の板状成形品収容窪
みを有する２個の合体用型にそれぞれ収容し、溶
融合体代を加熱した後、もしくは加熱しながらリ
ードフレームを挾み、合体用型と独立して板状成
形品をリードフレームに圧着することにより従来
外観上はもとよりリードへの鍍金の不均一性、リ
ードとソケツトとの接触不良や半田づけ作業の妨
げとなつていた有害なフラツシユを皆無にするこ
とが可能となつた。 After molten fusion, two plate-shaped molded products each having a shape in which the outline of a virtual cross section including the surfaces in contact with both the front and back surfaces of the lead frame in the same plane are the maximum outline of a plane parallel to the lead frame surface, and the maximum outline A plate having the same shape as and having a depth equal to at least the thickness of the molten material of the plate-shaped molded product, and further, the joining thickness of the plate-shaped molded product does not protrude beyond the mold surface of the joining mold for fixing the lead frame before joining. The plate-shaped molded product is housed in two merging molds each having a recess for accommodating the molded product, and after or while heating the molten material, the lead frame is sandwiched between them, and the plate-shaped molded product is placed between the lead frames independently of the merging mold. By crimping the leads, it is now possible to completely eliminate the harmful flash that previously caused not only the appearance but also uneven plating on the leads, poor contact between the leads and sockets, and hindering soldering work.
第１図は従来提案の合体法を示す断面図、第２
図は本発明に係る合体法を示す断面図、第３図は
本発明に係る板状成形品の透視概念図、第４図〜
第６図は本発明に係る板状成形品の形状を示す断
面図であり第７図は合体後の半導体パツケージを
示す斜視図である。
１，１′……窪み付金型、２，２′……溶融合体
代、３，３′……板状成形品、４……リードフレ
ーム、５，５′……半導体収納窪み、６……リー
ドフレームの表面、７……リードフレームの裏
面、８，８′……仮想断面、９……仮想断面の輪
郭、１０，１０′……合体用型、１１，１１′……
合体用型の型面、１２，１２′……板状成形品収
容窪み、１３，１３′……板状成形品圧着機、１
４……ダム、１５……意図したフラツシュ溜め、
１６……溶融合体代の角。
Figure 1 is a cross-sectional view showing the previously proposed merging method;
The figure is a sectional view showing the combining method according to the present invention, FIG. 3 is a perspective conceptual diagram of a plate-shaped molded product according to the present invention, and FIGS.
FIG. 6 is a sectional view showing the shape of a plate-shaped molded product according to the present invention, and FIG. 7 is a perspective view showing a semiconductor package after being combined. 1, 1'...Mold with recess, 2, 2'...Melted material allowance, 3, 3'...Plate-shaped molded product, 4...Lead frame, 5, 5'...Semiconductor storage recess, 6... ...Surface of lead frame, 7... Back side of lead frame, 8, 8'... Virtual cross section, 9... Outline of virtual cross section, 10, 10'... Mold for combination, 11, 11'...
Mold surface of the combining mold, 12, 12'... Recess for storing plate-shaped molded product, 13, 13'...... Plate-shaped molded product crimping machine, 1
4...Dam, 15...Intended flash reservoir,
16...Angle of molten material.
Claims (1)
窪みを有する２個の熱可塑性樹脂板状成形品を合
体用型に収容した状態で加熱した後、もしくは加
熱しながら半導体類を装着したリードフレームを
挾み、加圧合体させる半導体類のパツケージ成形
方法に於いて、 (a) 溶融合体後にリードフレームの表裏両面とそ
れぞれ接する面をそれぞれ同一平面内に含む仮
想断面の輪郭をリードフレーム面に平行な面の
最大輪郭とした形状の２個の熱可塑性樹脂板状
成形品と。 (b) 該最大輪郭即ち合体後の最終製品に於いてリ
ードフレーム表裏面とそれぞれ接する部分の輪
郭と同一形状でかつ少なくとも該板状成形品の
溶融合体代の厚み分を深さとし、更に合体前に
板状成形品の合体代がリードフレームを固定す
る合体用型の型面よりも突出しない形状の板状
成形品収容窪みを有する合体用型と。 (c) 合体用型と独立して板状成形品をリードフレ
ームに圧着する板状成形品用圧着機。 とを用いることを特徴とする半導体類のパツケー
ジ成形方法。 ２ 板状成形品の最大輪郭の厚みが溶融合体代の
厚みと同一である特許請求の範囲第１項記載の半
導体類のパツケージ成形方法。 ３ 板状成形品の最大輪郭の厚みが溶融合体代の
厚みより小さい特許請求の範囲第１項記載の半導
体類のパツケージ成形方法。[Scope of Claims] 1. After or while heating two thermoplastic resin plate molded products, at least one of which has a recess for accommodating semiconductors, in a mold for merging, or while heating In a semiconductor package forming method in which lead frames equipped with lead frames are held together and pressed together, Two thermoplastic resin plate-shaped molded products with the maximum outline of the plane parallel to the lead frame surface. (b) The maximum contour is the same as the contour of the parts that contact the front and back surfaces of the lead frame in the final product after combining, and the depth is at least equal to the thickness of the molten mixture of the plate-shaped molded product, and and a mold for merging having a recess for accommodating a molded plate having a shape such that the merging width of the molded plate does not protrude beyond the mold surface of the mold for merging to which the lead frame is fixed. (c) A crimping machine for plate-shaped molded products that crimps the plate-shaped molded products to the lead frame independently of the joining mold. A method for molding packages for semiconductors, characterized by using the following methods. 2. The method for molding a semiconductor package according to claim 1, wherein the thickness of the maximum outline of the plate-shaped molded product is the same as the thickness of the molten material. 3. The method for molding a semiconductor package according to claim 1, wherein the thickness of the maximum contour of the plate-shaped molded product is smaller than the thickness of the molten material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12611479A JPS5648155A (en) | 1979-09-27 | 1979-09-27 | Package forming method for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12611479A JPS5648155A (en) | 1979-09-27 | 1979-09-27 | Package forming method for semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5648155A JPS5648155A (en) | 1981-05-01 |
| JPS6119117B2 true JPS6119117B2 (en) | 1986-05-15 |
Family
ID=14926974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12611479A Granted JPS5648155A (en) | 1979-09-27 | 1979-09-27 | Package forming method for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5648155A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5919359A (en) * | 1982-07-23 | 1984-01-31 | Hitachi Chem Co Ltd | Forming method for package of semiconductors |
| JPS62224949A (en) * | 1986-03-27 | 1987-10-02 | S M C:Kk | Ic package |
| US5156983A (en) * | 1989-10-26 | 1992-10-20 | Digtial Equipment Corporation | Method of manufacturing tape automated bonding semiconductor package |
| JPH06252283A (en) * | 1993-02-24 | 1994-09-09 | Kyocera Corp | Semiconductor device |
| TW466720B (en) * | 2000-05-22 | 2001-12-01 | Siliconware Precision Industries Co Ltd | Semiconductor package with flash-prevention structure and manufacture method |
| KR100415281B1 (en) * | 2001-06-29 | 2004-01-16 | 삼성전자주식회사 | Double-side Mounting Circuit Board and Multi Chip Package including the Such a Circuit Board |
-
1979
- 1979-09-27 JP JP12611479A patent/JPS5648155A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5648155A (en) | 1981-05-01 |
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