JPS63108632U - - Google Patents

Info

Publication number
JPS63108632U
JPS63108632U JP1987000107U JP10787U JPS63108632U JP S63108632 U JPS63108632 U JP S63108632U JP 1987000107 U JP1987000107 U JP 1987000107U JP 10787 U JP10787 U JP 10787U JP S63108632 U JPS63108632 U JP S63108632U
Authority
JP
Japan
Prior art keywords
bonding
substrate
moving
arm
holding frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987000107U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0525238Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987000107U priority Critical patent/JPH0525238Y2/ja
Publication of JPS63108632U publication Critical patent/JPS63108632U/ja
Application granted granted Critical
Publication of JPH0525238Y2 publication Critical patent/JPH0525238Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1987000107U 1987-01-06 1987-01-06 Expired - Lifetime JPH0525238Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987000107U JPH0525238Y2 (enExample) 1987-01-06 1987-01-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987000107U JPH0525238Y2 (enExample) 1987-01-06 1987-01-06

Publications (2)

Publication Number Publication Date
JPS63108632U true JPS63108632U (enExample) 1988-07-13
JPH0525238Y2 JPH0525238Y2 (enExample) 1993-06-25

Family

ID=30776792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987000107U Expired - Lifetime JPH0525238Y2 (enExample) 1987-01-06 1987-01-06

Country Status (1)

Country Link
JP (1) JPH0525238Y2 (enExample)

Also Published As

Publication number Publication date
JPH0525238Y2 (enExample) 1993-06-25

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