JPS63107024A - エツチング装置 - Google Patents

エツチング装置

Info

Publication number
JPS63107024A
JPS63107024A JP16929786A JP16929786A JPS63107024A JP S63107024 A JPS63107024 A JP S63107024A JP 16929786 A JP16929786 A JP 16929786A JP 16929786 A JP16929786 A JP 16929786A JP S63107024 A JPS63107024 A JP S63107024A
Authority
JP
Japan
Prior art keywords
electrode
etching
substrate
etched
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16929786A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0519299B2 (enExample
Inventor
Masahata Shibagaki
真果 柴垣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP16929786A priority Critical patent/JPS63107024A/ja
Publication of JPS63107024A publication Critical patent/JPS63107024A/ja
Publication of JPH0519299B2 publication Critical patent/JPH0519299B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
JP16929786A 1986-07-18 1986-07-18 エツチング装置 Granted JPS63107024A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16929786A JPS63107024A (ja) 1986-07-18 1986-07-18 エツチング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16929786A JPS63107024A (ja) 1986-07-18 1986-07-18 エツチング装置

Publications (2)

Publication Number Publication Date
JPS63107024A true JPS63107024A (ja) 1988-05-12
JPH0519299B2 JPH0519299B2 (enExample) 1993-03-16

Family

ID=15883906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16929786A Granted JPS63107024A (ja) 1986-07-18 1986-07-18 エツチング装置

Country Status (1)

Country Link
JP (1) JPS63107024A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0779651A3 (en) * 1995-10-03 1997-08-06 Hitachi, Ltd. Method and apparatus for plasma processing
JP2017139428A (ja) * 2016-02-05 2017-08-10 東京エレクトロン株式会社 プラズマ処理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58209111A (ja) * 1982-05-31 1983-12-06 Toshiba Corp プラズマ発生装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58209111A (ja) * 1982-05-31 1983-12-06 Toshiba Corp プラズマ発生装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0779651A3 (en) * 1995-10-03 1997-08-06 Hitachi, Ltd. Method and apparatus for plasma processing
US6156663A (en) * 1995-10-03 2000-12-05 Hitachi, Ltd. Method and apparatus for plasma processing
JP2017139428A (ja) * 2016-02-05 2017-08-10 東京エレクトロン株式会社 プラズマ処理装置
US10665428B2 (en) 2016-02-05 2020-05-26 Tokyo Electron Limited Plasma processing apparatus

Also Published As

Publication number Publication date
JPH0519299B2 (enExample) 1993-03-16

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