JPS6310593Y2 - - Google Patents

Info

Publication number
JPS6310593Y2
JPS6310593Y2 JP1981145814U JP14581481U JPS6310593Y2 JP S6310593 Y2 JPS6310593 Y2 JP S6310593Y2 JP 1981145814 U JP1981145814 U JP 1981145814U JP 14581481 U JP14581481 U JP 14581481U JP S6310593 Y2 JPS6310593 Y2 JP S6310593Y2
Authority
JP
Japan
Prior art keywords
conductive layer
copper foil
contact conductive
contact
paint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981145814U
Other languages
Japanese (ja)
Other versions
JPS5849817U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14581481U priority Critical patent/JPS5849817U/en
Publication of JPS5849817U publication Critical patent/JPS5849817U/en
Application granted granted Critical
Publication of JPS6310593Y2 publication Critical patent/JPS6310593Y2/ja
Granted legal-status Critical Current

Links

Description

【考案の詳細な説明】 本考案は、計算機やテレビジヨン用チユーナー
等のキースイツチを有する電子装置に用いるキー
スイツチ用プリント基板に関するものである。
[Detailed Description of the Invention] The present invention relates to a printed circuit board for a key switch used in electronic devices having a key switch, such as computers and television tuners.

キースイツチ用プリント基板は、キースイツチ
の固定接点を構成する所定のパターンの接点導電
層と電子部品相互間の配線を行なう銅箔回路とを
樹脂積層板の如き絶縁基板上に形成したものであ
る。絶縁基板上には接点導電層の対が必要な個数
だけ形成され、各接点導電層は所定の銅箔回路の
接点接続部に接続されている。そして装置に組込
まれる際には、対をなす接点導電層を短絡し得る
ように導電ゴム等からなる可動接点部材が配置さ
れ、各可動接点部材に対して押ボタンのようなキ
ー操作部材が設けられてキースイツチが構成され
る。従来キースイツチ用プリント基板の接点導電
層としては、銅箔からなるベースの上に金メツキ
を施したものが用いられていたが、コストの低減
を図るため最近ではカーボン塗料からなる接点導
電層が用いられるようになつた。ところが接点導
電層をカーボン塗料のみにより形成する場合、カ
ーボンの含有量が多いカーボン塗料を用いて接点
導電層の抵抗値を下げようとするとカーボン塗料
と基板との密着性が悪くなり、また微細なパター
ンで接点導電層を印刷することができなくなる。
したがつてカーボン塗料により接点導電層を形成
した場合、スイツチの動作抵抗が或程度大きくな
るのを避けられず、小さな動作抵抗を必要とする
用途には用いることができなかつた。またカーボ
ン塗料のみにより接点導電層を形成する場合に
は、銅箔回路と接点導電層との電気的な接続を良
好に行うことができない問題がある。これは銅箔
回路の鋭いエツジ部でカーボン塗料の肉厚が薄く
なつたり切れが生じることがあり、最悪の場合に
は断線状態が発生するからである。尚この種のプ
リント基板として、銅箔からなるベースの上にカ
ーボン塗料層を重ねた構造の接点導電層を用いた
ものが提案されたが、銅箔とカーボン塗料とは密
着性が悪いため、銅箔の上にカーボン塗料層を重
ねる構造とした場合両者間の接触抵抗が大きくな
り、スイツチの動作抵抗を小さくすることが困難
であつた。
A printed circuit board for a key switch is one in which a contact conductive layer having a predetermined pattern constituting a fixed contact of a key switch and a copper foil circuit for wiring between electronic components are formed on an insulating substrate such as a resin laminate. A required number of pairs of contact conductive layers are formed on the insulating substrate, and each contact conductive layer is connected to a contact connection portion of a predetermined copper foil circuit. When assembled into a device, a movable contact member made of conductive rubber or the like is arranged so as to short-circuit the pair of contact conductive layers, and a key operation member such as a push button is provided for each movable contact member. key switch is configured. Conventionally, the contact conductive layer of printed circuit boards for key switches has been made of gold plating on a base made of copper foil, but recently, in order to reduce costs, a contact conductive layer made of carbon paint has been used. I started to be able to do it. However, when the contact conductive layer is formed only with carbon paint, if an attempt is made to lower the resistance value of the contact conductive layer by using carbon paint with a high carbon content, the adhesion between the carbon paint and the substrate will deteriorate, and fine particles may It becomes impossible to print the contact conductive layer in a pattern.
Therefore, when the contact conductive layer is formed using carbon paint, the operational resistance of the switch inevitably increases to some extent, and the switch cannot be used for applications requiring low operational resistance. Further, when the contact conductive layer is formed using only carbon paint, there is a problem that electrical connection between the copper foil circuit and the contact conductive layer cannot be made satisfactorily. This is because the thickness of the carbon paint may become thin or break at the sharp edges of the copper foil circuit, and in the worst case, disconnection may occur. As this type of printed circuit board, one was proposed that used a contact conductive layer with a carbon paint layer layered on a base made of copper foil, but since the adhesion between the copper foil and carbon paint was poor, When a carbon paint layer is layered on top of a copper foil, the contact resistance between the two increases, making it difficult to reduce the operating resistance of the switch.

本考案の目的は、スイツチの動作抵抗を従来よ
り小さくすることができるようにしたキースイツ
チ用プリント基板を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a printed circuit board for a key switch that allows the operating resistance of the switch to be lower than that of the prior art.

本考案は、上記の目的を達成するため、フレー
ク状銀粉末を含む銀塗料からなる第1の導電層
と、該第1の導電層を覆うように形成されたカー
ボン塗料からなる第2の導電層とにより接点導電
層を形成したものである。銀塗料層とカーボン塗
料層とは密着性が良好であるため、両者間の接触
抵抗を十分小さくすることができ、本考案によれ
ばスイツチの動作抵抗を従来より大幅に小さくす
ることができる。
In order to achieve the above object, the present invention includes a first conductive layer made of silver paint containing flaky silver powder, and a second conductive layer made of carbon paint formed to cover the first conductive layer. A contact conductive layer is formed by the contact conductive layer. Since the silver paint layer and the carbon paint layer have good adhesion, the contact resistance between them can be made sufficiently small, and according to the present invention, the operating resistance of the switch can be made much smaller than before.

以下図面を参照して本考案のプリント基板を詳
細に説明する。
The printed circuit board of the present invention will be described in detail below with reference to the drawings.

第1図は本考案の一実施例の一部を示した平面
図であつて、同図において1は紙フエノール積層
板、紙エポキシ積層板、ガラスエポキシ積層板等
からなる絶縁基板で、絶縁基板1の表面には、所
定のパターンの銅箔回路2,2′がエツチングに
より形成されている。銅箔回路2,2′はキース
イツチを介して相互に接続されるもので、これら
の銅箔回路は両者の対向方向に平行に突出する接
点導電層接続部2a,2a′を有している。銅箔回
路2,2′の接続部2a,2a′には接点導電層3,
3′がそれぞれ接続される。
FIG. 1 is a plan view showing a part of an embodiment of the present invention, in which numeral 1 denotes an insulating substrate made of a paper phenol laminate, a paper epoxy laminate, a glass epoxy laminate, etc. Copper foil circuits 2, 2' having a predetermined pattern are formed on the surface of 1 by etching. The copper foil circuits 2, 2' are connected to each other via a key switch, and these copper foil circuits have contact conductive layer connecting portions 2a, 2a' projecting in parallel in opposing directions. Contact conductive layers 3,
3' are connected to each other.

第2図乃至第4図に示したように、各接点導電
層は基板1の表面に形成されたフレーク状銀粉末
を含む銀塗料からなる第1の導電層31と、この
第1の導電層31を覆うように形成されたカーボ
ン塗料からなる第2の導電層32とからなつてい
る。接点導電層のパターンは任意であるが、本実
施例では接点導電層3,3′が共に略コの字形の
パターンに形成され、それぞれの中央部には銅箔
回路2,2′側に突出する銅箔回路接続部3a,
3a′が形成されてこれらの銅箔回路接続部3a,
3a′が銅箔回路2,2′の接点導電層接続部2a,
2a′の上に重合されている。ここで用いる銀塗料
は、フレーク状即ち薄片状の銀粉とフエノールレ
ジンやエポキシレジン等の樹脂バインダーとを
60:40の割合で混合したものが適当である。また
カーボン塗料としては例えば炭素粉と樹脂バイン
ダーとを50:50の割合で混合したものが適当であ
る。
As shown in FIGS. 2 to 4, each contact conductive layer includes a first conductive layer 31 made of silver paint containing flaky silver powder formed on the surface of the substrate 1, and a first conductive layer 31 formed on the surface of the substrate 1. 31 and a second conductive layer 32 made of carbon paint formed to cover the conductive layer 31. Although the pattern of the contact conductive layer is arbitrary, in this embodiment, both the contact conductive layers 3 and 3' are formed in a substantially U-shaped pattern, and a central portion of each has a protrusion toward the copper foil circuits 2 and 2'. Copper foil circuit connection part 3a,
3a' are formed and these copper foil circuit connection parts 3a,
3a' is the contact conductive layer connection part 2a of the copper foil circuit 2, 2',
2a' is polymerized. The silver paint used here consists of flaky or flaky silver powder and a resin binder such as phenol resin or epoxy resin.
A mixture of 60:40 is suitable. A suitable carbon paint is, for example, a mixture of carbon powder and a resin binder in a ratio of 50:50.

上記のような銀塗料により第1の導電層31を
形成して、この第1の導電層をカーボン塗料から
なる第2の導電層32で覆うようにすると、銀塗
料層とカーボン塗料層との密着性が良好なため、
両層間の接触抵抗を小さくして動作抵抗を低くす
ることができる。また上記第1の導電層を銅箔に
より形成した場合にはその鋭いエツジ部付近で第
2の導電層の肉厚が薄くなつたり切れが生じたり
することがあつたが、本考案のように第1の導電
層を銀塗料により形成した場合には該第1の導電
層に鋭いエツジ部が存在しないためこのような問
題はなく、第2の導電層により第1の導電層を常
に確実に被覆することができる。したがつて化学
的に安定なカーボン塗料による第2の導電層で銀
塗料による第1の導電層を完全に保護することが
でき、接点導電層の経年変化を防ぐことができ
る。またフレーク状の銀粉末を含む銀塗料は、粒
状の銀粉末を含む銀塗料と比べて、銅箔回路に塗
布した場合に銅箔回路のエツジによつて切れが生
じることが殆どないことが確認されている。これ
は、フレーク状の銀粉末は表面抵抗が大きいため
に、樹脂バインダ中の銀粉末の移動量が制限され
て、銅箔のエツジ部においても銀粉末が大幅に移
動することがないからであろうと推測される。
When the first conductive layer 31 is formed using silver paint as described above and the first conductive layer is covered with the second conductive layer 32 made of carbon paint, the difference between the silver paint layer and the carbon paint layer is Due to good adhesion,
By reducing the contact resistance between both layers, the operating resistance can be lowered. Furthermore, when the first conductive layer is formed of copper foil, the thickness of the second conductive layer may become thinner or breakage may occur near the sharp edges. When the first conductive layer is formed using silver paint, there is no such problem because there are no sharp edges in the first conductive layer, and the first conductive layer is always reliably coated with the second conductive layer. Can be coated. Therefore, the first conductive layer made of silver paint can be completely protected by the second conductive layer made of chemically stable carbon paint, and the contact conductive layer can be prevented from deteriorating over time. Additionally, it was confirmed that when silver paint containing flaky silver powder is applied to a copper foil circuit, it is less likely to break due to the edges of the copper foil circuit, compared to silver paint containing granular silver powder. has been done. This is because flaky silver powder has a high surface resistance, which limits the amount of silver powder movement in the resin binder, and prevents the silver powder from moving significantly at the edges of the copper foil. It is assumed that he is deaf.

接点導電層をカーボン塗料のみにより形成した
場合スイツチの動作抵抗を500Ω以下にすること
は困難であつたが、フレーク状銀粉末と樹脂バイ
ンダーとを60:40の割合で混合した銀塗料により
乾燥後の膜厚が10〜15μの第1の導電層を形成
し、炭素粉と樹脂バインダーとを50:50の割合で
混合したカーボン塗料により乾燥後の膜厚が約
15μの第2の導電層を形成したところ、本考案の
接点導電層による場合のスイツチの動作抵抗は50
Ωまで小さくすることができ、実に従来の1/10ま
で動作抵抗を引下げることができることが明らか
になつた。尚上記の実施において、第1の導電層
の面積抵抗は約100mΩ/□であり、第2の導電
層の面積抵抗は約50Ω/□であつた。
It was difficult to reduce the operating resistance of the switch to 500 Ω or less when the contact conductive layer was formed only with carbon paint, but after drying, it was possible to reduce the operating resistance of the switch to less than 500 Ω using silver paint made by mixing flaky silver powder and resin binder at a ratio of 60:40. A first conductive layer with a film thickness of 10 to 15μ is formed, and the film thickness after drying is approximately
When a second conductive layer of 15 μm was formed, the operating resistance of the switch using the contact conductive layer of the present invention was 50 μm.
It has become clear that it is possible to reduce the operating resistance to 1/10 of the conventional resistance. In the above implementation, the sheet resistance of the first conductive layer was approximately 100 mΩ/□, and the sheet resistance of the second conductive layer was approximately 50 mΩ/□.

尚第2図において、4は上記実施例のプリント
基板を用いてキースイツチを構成する場合に使用
する可動接点部材の一例を示したもので、この可
動接点部材は例えば導電ゴムからなり、図示しな
いキー操作部材により操作されて接点導電層3,
3′に接触する位置と接点導電層3,3′から離れ
る位置との間を変位する。
In FIG. 2, reference numeral 4 indicates an example of a movable contact member used when constructing a key switch using the printed circuit board of the above embodiment. The contact conductive layer 3 is operated by the operating member;
3' and a position away from the contact conductive layers 3, 3'.

第1図にはプリント基板の一部のみを示してあ
るが、実際には基板上に同様のパターンの接点導
電層が必要な個数だけ設けられており、各接点導
電層に接続される銅箔回路及び他の電子部品が接
続される銅箔回路が所定のパターンで設けられて
いる。また上記の例では基板の片側にのみ回路が
形成されているが、基板の両面に回路が形成され
る場合にも本考案を適用できるのは勿論である。
Although only a part of the printed circuit board is shown in Figure 1, the required number of contact conductive layers with a similar pattern are actually provided on the board, and copper foil is connected to each contact conductive layer. Copper foil circuits are provided in a predetermined pattern to which circuits and other electronic components are connected. Further, in the above example, the circuit is formed only on one side of the substrate, but it goes without saying that the present invention can also be applied to a case where the circuit is formed on both sides of the substrate.

上記実施例では銅箔回路2,2′に接続部2a,
2a′を突設しているが、このような接続部を特に
設けることなく銅箔回路の所定の部分に接点導電
層の一部を重ねて接続するようにしてもよい。
In the above embodiment, the copper foil circuits 2, 2' have connection parts 2a,
Although the contact conductive layer 2a' is provided in a protruding manner, a portion of the contact conductive layer may be overlapped and connected to a predetermined portion of the copper foil circuit without providing such a connecting portion in particular.

以上のように、本考案によれば、フレーク状銀
粉末を含む銀塗料からなる第1の導電層をカーボ
ン塗料からなる第2の導電層で覆う2重構造の接
点導電層を用い、第1及び第2の導電層の密着性
を良好にしたので、両層の接触抵抗を十分に小さ
くして接点導電層の抵抗値を小さくすることがで
き、キースイツチの動作抵抗を従来より大幅に低
くすることができる利点がある。特に第1の導電
層をフレーク状銀粉末を含む銀塗料から形成する
と、接点導電層の銅箔回路接続部を銅箔回路の接
点導電層接続部に重合する場合においても、銅箔
回路の鋭いエツジ部によつて第1の導電層が簡単
に切れることがないので、接点導電層と銅箔回路
との間の電気的な接続を確実に行える利点があ
る。
As described above, according to the present invention, a double structure contact conductive layer is used in which a first conductive layer made of a silver paint containing flaky silver powder is covered with a second conductive layer made of a carbon paint, and a first conductive layer is used. And since the adhesion of the second conductive layer is improved, the contact resistance of both layers can be sufficiently reduced to reduce the resistance value of the contact conductive layer, and the operating resistance of the key switch can be significantly lowered than before. There is an advantage that it can be done. In particular, if the first conductive layer is formed from a silver paint containing flaky silver powder, even when the copper foil circuit connection portion of the contact conductive layer is superposed on the contact conductive layer connection portion of the copper foil circuit, the sharpness of the copper foil circuit Since the first conductive layer is not easily cut by the edge portion, there is an advantage that the electrical connection between the contact conductive layer and the copper foil circuit can be ensured.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の一部を示した平面
図、第2図及び第3図はそれぞれ第1図の−
線切断拡大断面図及び−線切断拡大断面図、
第4図は第3図の−線断面端面図である。 1……絶縁基板、2,2′……銅箔回路、3,
3′……接点導電層、31……第1の導電層、3
2……第2の導電層。
FIG. 1 is a plan view showing a part of an embodiment of the present invention, and FIGS. 2 and 3 are respectively -
An enlarged sectional view taken along the line and an enlarged sectional view taken along the - line,
FIG. 4 is a sectional end view taken along the line -- in FIG. 3. 1...Insulating board, 2, 2'...Copper foil circuit, 3,
3'...Contact conductive layer, 31...First conductive layer, 3
2...Second conductive layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] キースイツチ用接点導電層と該接点導電層に接
続される銅箔回路とを絶縁基板上に形成してなる
キースイツチ用プリント基板において、前記接点
導電層はフレーク状銀粉末を含む銀塗料からなる
第1の導電層と該第1の導電層を覆うように形成
されたカーボン塗料からなる第2の導電層とから
なり、前記接点導電層の銅箔回路接続部が前記銅
箔回路の接点導電層接続部に重合されていること
を特徴とするキースイツチ用プリント基板。
In a printed circuit board for a key switch comprising a key switch contact conductive layer and a copper foil circuit connected to the contact conductive layer formed on an insulating substrate, the contact conductive layer includes a first layer made of a silver paint containing flaky silver powder. and a second conductive layer made of carbon paint formed to cover the first conductive layer, and the copper foil circuit connection portion of the contact conductive layer is the contact conductive layer connection of the copper foil circuit. A printed circuit board for a key switch, characterized in that part of the printed circuit board is polymerized.
JP14581481U 1981-09-30 1981-09-30 Printed circuit board for key switch Granted JPS5849817U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14581481U JPS5849817U (en) 1981-09-30 1981-09-30 Printed circuit board for key switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14581481U JPS5849817U (en) 1981-09-30 1981-09-30 Printed circuit board for key switch

Publications (2)

Publication Number Publication Date
JPS5849817U JPS5849817U (en) 1983-04-04
JPS6310593Y2 true JPS6310593Y2 (en) 1988-03-29

Family

ID=29938732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14581481U Granted JPS5849817U (en) 1981-09-30 1981-09-30 Printed circuit board for key switch

Country Status (1)

Country Link
JP (1) JPS5849817U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2904734B2 (en) * 1995-11-15 1999-06-14 ユニデン株式会社 switch

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123032A (en) * 1974-08-21 1976-02-24 Tokyo Shibaura Electric Co SEISHIGAJUSHINSOCHI
JPS54103580A (en) * 1978-01-31 1979-08-15 Matsushita Electric Ind Co Ltd Printed circuit board with key wiring
JPS5617624B2 (en) * 1973-08-09 1981-04-23

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6235228Y2 (en) * 1979-07-18 1987-09-08

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5617624B2 (en) * 1973-08-09 1981-04-23
JPS5123032A (en) * 1974-08-21 1976-02-24 Tokyo Shibaura Electric Co SEISHIGAJUSHINSOCHI
JPS54103580A (en) * 1978-01-31 1979-08-15 Matsushita Electric Ind Co Ltd Printed circuit board with key wiring

Also Published As

Publication number Publication date
JPS5849817U (en) 1983-04-04

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