JPS63105348U - - Google Patents

Info

Publication number
JPS63105348U
JPS63105348U JP1986198845U JP19884586U JPS63105348U JP S63105348 U JPS63105348 U JP S63105348U JP 1986198845 U JP1986198845 U JP 1986198845U JP 19884586 U JP19884586 U JP 19884586U JP S63105348 U JPS63105348 U JP S63105348U
Authority
JP
Japan
Prior art keywords
heat radiator
lead wire
bent portion
resin
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986198845U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0720921Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986198845U priority Critical patent/JPH0720921Y2/ja
Publication of JPS63105348U publication Critical patent/JPS63105348U/ja
Application granted granted Critical
Publication of JPH0720921Y2 publication Critical patent/JPH0720921Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1986198845U 1986-12-26 1986-12-26 樹脂密封型半導体装置 Expired - Lifetime JPH0720921Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986198845U JPH0720921Y2 (ja) 1986-12-26 1986-12-26 樹脂密封型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986198845U JPH0720921Y2 (ja) 1986-12-26 1986-12-26 樹脂密封型半導体装置

Publications (2)

Publication Number Publication Date
JPS63105348U true JPS63105348U (enFirst) 1988-07-08
JPH0720921Y2 JPH0720921Y2 (ja) 1995-05-15

Family

ID=31159915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986198845U Expired - Lifetime JPH0720921Y2 (ja) 1986-12-26 1986-12-26 樹脂密封型半導体装置

Country Status (1)

Country Link
JP (1) JPH0720921Y2 (enFirst)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856359A (ja) * 1981-09-30 1983-04-04 Toshiba Corp 半導体装置
JPS6115744U (ja) * 1984-06-30 1986-01-29 ロ−ム株式会社 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856359A (ja) * 1981-09-30 1983-04-04 Toshiba Corp 半導体装置
JPS6115744U (ja) * 1984-06-30 1986-01-29 ロ−ム株式会社 半導体装置

Also Published As

Publication number Publication date
JPH0720921Y2 (ja) 1995-05-15

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