JPS63102928A - Metallic film laminate - Google Patents

Metallic film laminate

Info

Publication number
JPS63102928A
JPS63102928A JP25036686A JP25036686A JPS63102928A JP S63102928 A JPS63102928 A JP S63102928A JP 25036686 A JP25036686 A JP 25036686A JP 25036686 A JP25036686 A JP 25036686A JP S63102928 A JPS63102928 A JP S63102928A
Authority
JP
Japan
Prior art keywords
metal
film laminate
metal layer
layer
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25036686A
Other languages
Japanese (ja)
Inventor
正憲 清水
苑田 卓宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gunze Ltd
Original Assignee
Gunze Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gunze Ltd filed Critical Gunze Ltd
Priority to JP25036686A priority Critical patent/JPS63102928A/en
Publication of JPS63102928A publication Critical patent/JPS63102928A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は透明基材への密着性に優れた透明な金属膜積層
体に関するものであり、かかる金属膜積層体を提示する
ことにより、もって産業上の利用に供さんとするもので
なる。
[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a transparent metal film laminate with excellent adhesion to a transparent substrate, and by presenting such a metal film laminate, It is intended for industrial use.

(従来の技術〉 従来より、金属膜積層体からなる透明導電性部材は各種
用途1例えば面発熱体、タッチパネル、電磁波シールド
材料等多くの用途に適応できるが、一般に透明基材に直
接物理的に導電性金属層を形成せしめたものは、どうし
ても透明基材面と金属面との密着性が不十分となり易い
傾向を有していた。
(Conventional technology) Conventionally, transparent conductive members made of metal film laminates can be applied to many applications such as surface heating elements, touch panels, and electromagnetic shielding materials. Those on which a conductive metal layer was formed tended to have insufficient adhesion between the transparent substrate surface and the metal surface.

一方、導電性金属層に適宜のバインダーを添加した場合
は、その導電性や透明性を阻害する原因となりかねず、
透明導電性部材として適応しにくい面があり、どうして
も何らかも物理的方法により直接、導電性金属層を形成
せざるを得なかった。しかしながら、金属層を直接透明
基材に密着せしめるには前記した通り、その強度が不足
し易い傾向にあり、このため何らかの中間層を介して、
金属層の密着強度を高める方法が必要に応じ行われる現
状であった。
On the other hand, if an appropriate binder is added to the conductive metal layer, it may impede its conductivity and transparency.
It is difficult to use as a transparent conductive member, and a conductive metal layer must be formed directly by some physical method. However, as mentioned above, when a metal layer is directly attached to a transparent substrate, its strength tends to be insufficient.
Currently, methods for increasing the adhesion strength of the metal layer are implemented as needed.

く問題点を解決するための手段〉 こうした現状に鑑み、本発明者らは金属層の密着強度が
向上し、しかも透明性の降下をきたさない中間層につい
て各種検討を繰り返した結果、ついに本発明に到達した
ものであり、その特徴とするところは金属膜積層体にお
ける透明基材の片面が、インジウム−スズ酸化物からな
る金属酸化層を1介して形成された導電性金属層である
点にある。
Measures to Solve the Problems> In view of the current situation, the present inventors have repeatedly conducted various studies on an intermediate layer that improves the adhesion strength of the metal layer and does not cause a decrease in transparency, and as a result, has finally developed the present invention. The unique feature is that one side of the transparent base material in the metal film laminate is a conductive metal layer formed through one metal oxide layer made of indium-tin oxide. be.

次に、問題点を解決するための手段を更に具体的に述べ
ることにする。
Next, the means for solving the problem will be described in more detail.

本発明に係る透明基材とは、ポリエチレンテレフタレー
ト、ポリエーテルサルホン、ボリアリレート、ポリカー
ボネート、ポリブチレンテレフタレート等の比較的透明
度の高い高分子材料を素材としたフィルム、シート等を
例示できる上に、ガラス等も例示でき、特に制限はない
、この際。
The transparent substrate according to the present invention can be exemplified by films, sheets, etc. made of relatively transparent polymeric materials such as polyethylene terephthalate, polyethersulfone, polyarylate, polycarbonate, polybutylene terephthalate, etc. Glass and the like can also be used, and there is no particular limitation in this case.

前記したフィルム、シート等は無延伸のものであっても
、−軸、二軸等に延伸されていてもよいし、結晶性であ
っても非品性であってもよいことは勿論である。
It goes without saying that the films, sheets, etc. described above may be unstretched, or may be -axially or biaxially stretched, and may be crystalline or non-stretched. .

インジウム−スズ酸化物とは例えば、酸化スズを含む酸
化インジウム等をあげることができ、この際、酸化スズ
の含有量は特に制限はないが、一般には3〜20重量%
程度である。
Indium-tin oxide includes, for example, indium oxide containing tin oxide, and in this case, the content of tin oxide is not particularly limited, but is generally 3 to 20% by weight.
That's about it.

導電性金属層とは導電性の金属薄膜層のことで金属とし
ては例えば金、白銀、銀、パラジウム、ニッケル、クロ
ム及びこれらの合金等をあげることができ、特に限定さ
れるものでない、この様に、本発明は用途に応じ、適宜
の金属を用いればよく、例えば面発熱体としての利用に
供する場合は、その表面抵抗値が1〜500Ω/口、好
ましくは1〜10Ω/口程度の金属が望ましい。勿論、
前記表面抵抗値は単なる目安であって、特に制限を受け
るものでなく、例えば必要とする温度、加える電圧等に
応じ適宜の値に設定すればよい。この際、ある程度以上
の抵抗値でないと電圧を加えても電流が流れず、発熱し
ないこともあり注意が必要である。
The conductive metal layer refers to a conductive metal thin film layer, and examples of metals include gold, platinum, silver, palladium, nickel, chromium, and alloys thereof, and are not particularly limited. In the present invention, an appropriate metal may be used depending on the application. For example, when used as a surface heating element, a metal with a surface resistance value of 1 to 500 Ω/hole, preferably 1 to 10 Ω/hole is used. is desirable. Of course,
The surface resistance value is merely a guideline and is not particularly limited, and may be set to an appropriate value depending on the required temperature, applied voltage, etc., for example. At this time, care must be taken because unless the resistance value is above a certain level, current will not flow even if voltage is applied, and heat may not be generated.

透明基材に金属酸化層及び導電性金属層を形成せしめる
方法としては、例えばスパッタリング法、真空蒸着法、
イオンブレーティング法、化学メッキ法、気相法等をあ
げることができる。第1図に示したものは透明基材(1
)の片側にインジウム−スズ酸化物からなる金属酸化層
(2)をスパッタリング形式せしめ、更にその上に金属
層(3)をスパッタリング形式した透明金属膜積層体で
あり、この際、透明基材(1)及び各層(2)(3)の
厚さは特に制限はないが、通常、金属酸化層(2)は1
00OA”以下、好ましくは100〜500A”程度で
十分であり、金属層(3)も100OA’″以下、好マ
シくは100〜500 A”程度で十分である。
Examples of methods for forming a metal oxide layer and a conductive metal layer on a transparent substrate include sputtering method, vacuum evaporation method,
Examples include ion blating method, chemical plating method, and vapor phase method. The one shown in Figure 1 is a transparent base material (1
This is a transparent metal film laminate in which a metal oxide layer (2) made of indium-tin oxide is sputtered on one side of the transparent base material ( There is no particular restriction on the thickness of 1) and each layer (2) and (3), but usually the metal oxide layer (2) is 1
00 OA'' or less, preferably about 100 to 500 A'' is sufficient, and the metal layer (3) also has a thickness of 100 OA'' or less, preferably about 100 to 500 A''.

また、透明基材(1)の両側に金属酸化層(2)、金属
層(3)を付々形成せる態様のものも当然本発明の1実
施例の範囲である。
Naturally, an embodiment in which a metal oxide layer (2) and a metal layer (3) are formed on both sides of the transparent base material (1) is also within the scope of one embodiment of the present invention.

本発明に係る金属膜積層体の用途としては面発熱体、タ
ッチパネル、電磁波シールド材料、エレクトロルミネッ
センス、熱線遮断材料、防眩パネル等を例示でき、特に
制限はなく、必要に応じ、あらゆる用途に適応可能であ
る。
Applications of the metal film laminate according to the present invention include surface heating elements, touch panels, electromagnetic shielding materials, electroluminescence, heat ray shielding materials, anti-glare panels, etc., and there are no particular limitations, and the metal film laminate can be applied to any application as necessary. It is possible.

〈実施例1〉 二軸に延伸された1004の厚さを有する透明なポリエ
チレンテレタレートフィルムの片面に、インジウム−ス
ズ酸化物(酸化スズ5重量%を含有する酸化インジウム
)をスパッタリングにより形成し、厚さ200A@の金
属酸化層を得た0次いで、前記形成された金属酸化層に
、更に金をスパッタリングにより形成せしめ、厚さ20
0A”の金属層を得た。
<Example 1> Indium-tin oxide (indium oxide containing 5% by weight of tin oxide) was formed on one side of a biaxially stretched transparent polyethylene terethalate film having a thickness of 1004 mm by sputtering, A metal oxide layer with a thickness of 200 A was obtained.Next, gold was further formed on the formed metal oxide layer by sputtering, and a thickness of 20 A was obtained.
A metal layer of 0A" was obtained.

これらのスパッタリング条件は以下である。These sputtering conditions are as follows.

金属酸化層    金属層 ガス    アルゴン+酸素  アルゴン圧力    
I X I O丁orr    I X 10Torr
印加電圧  1w /cra”     1w /cm
!こうして得た透明導電性の金属膜積層体は、表面抵抗
値が20.6Ω/口、透明度は69.8%であり、JI
S−LO849に準じ荷重100g、試験布ナイロンタ
フタ15番の条件で摩擦テストを行なったところ 〔テスト後の抵抗/テスト前の抵抗=1.02)で、テ
スト前後の抵抗値はほとんど不変であった。このことか
らも摩擦による金属層の剥離はほとんどないものと云え
る。また、テープ剥離スラト(J I 5−DO202
)も良好であった。
Metal oxide layer Metal layer gas Argon + oxygen Argon pressure
I X I O Torr I X 10Torr
Applied voltage 1w/cra” 1w/cm
! The thus obtained transparent conductive metal film laminate had a surface resistance value of 20.6 Ω/hole, a transparency of 69.8%, and a JI
A friction test was conducted according to S-LO849 under the conditions of a load of 100g and a test cloth of nylon taffeta No. 15 (resistance after test/resistance before test = 1.02), and the resistance value before and after the test was almost unchanged. Ta. From this, it can be said that there is almost no peeling of the metal layer due to friction. In addition, tape peeling slat (J I 5-DO202
) were also good.

これに対し、同じポリエチレンテレフタレートフィルム
に、直接同じ条件で金をスパッタリングして得た透明導
電性フィルムは、表面抵抗値が20.007口、透明度
は70.0%であり、摩擦テストの結果は〔テスト後の
抵抗/テスト前の抵抗〕の値が極めて大きい数値を示し
た。この数値はスパッタリングされた金属層がほとんど
剥離されたことを示していると云える0以上のことから
も本発明の格別なる効果が解かる。
On the other hand, a transparent conductive film obtained by sputtering gold directly onto the same polyethylene terephthalate film under the same conditions had a surface resistance of 20.007 mm, a transparency of 70.0%, and a friction test result of The value of [resistance after test/resistance before test] was extremely large. The fact that this value is greater than 0, which indicates that most of the sputtered metal layer has been peeled off, reveals the exceptional effect of the present invention.

〈実施例2〉 実施例(1)で得た透明導電性フィルムを、面発熱体と
して使用すべく巾X長さが80mmX 100mmにな
るようにカットし、巾方向の両側に引き出し回路を印刷
して12V(1,IA)の電圧を加えた所、常温の状態
で透明導電性フィルムは45℃の温度になった。尚、こ
の12Vとは多くの自動車のバッテリー電圧に相当し、
このことからも、本例で得られた透明導電性フィルムは
自動車のガラス用面発熱体として好適に利用され得るこ
とが解る。
<Example 2> The transparent conductive film obtained in Example (1) was cut to have a width x length of 80 mm x 100 mm in order to be used as a surface heating element, and an extraction circuit was printed on both sides in the width direction. When a voltage of 12 V (1, IA) was applied to the transparent conductive film, the temperature reached 45° C. at room temperature. In addition, this 12V corresponds to the battery voltage of many cars,
This also shows that the transparent conductive film obtained in this example can be suitably used as a surface heating element for automobile glass.

(発明の効果〉 未発明は以上の通りであり、本発明の金属膜積層体は金
属層の密着強度が従来のものに比して著しく向上してい
るため、繰り返しの使用に対しても簡単に金属層の剥離
が起ることもなく、各種用途への適応が可能であり、今
後更に多くの用途への展望が期待されている。
(Effects of the invention) As described above, the metal film laminate of the present invention has significantly improved adhesion strength of the metal layer compared to the conventional one, so it is easy to use repeatedly. It does not cause peeling of the metal layer and can be applied to a variety of applications, and is expected to have even more applications in the future.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係る金属膜積層体の一実施例を示す断
面図である。
FIG. 1 is a sectional view showing an embodiment of a metal film laminate according to the present invention.

Claims (1)

【特許請求の範囲】[Claims] 透明基材の片面が、インジウム−スズ酸化物からなる金
属酸化層を介して形成された導電性金属層であることを
特徴とする金属膜積層体。
A metal film laminate, characterized in that one side of a transparent substrate is a conductive metal layer formed through a metal oxide layer made of indium-tin oxide.
JP25036686A 1986-10-20 1986-10-20 Metallic film laminate Pending JPS63102928A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25036686A JPS63102928A (en) 1986-10-20 1986-10-20 Metallic film laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25036686A JPS63102928A (en) 1986-10-20 1986-10-20 Metallic film laminate

Publications (1)

Publication Number Publication Date
JPS63102928A true JPS63102928A (en) 1988-05-07

Family

ID=17206852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25036686A Pending JPS63102928A (en) 1986-10-20 1986-10-20 Metallic film laminate

Country Status (1)

Country Link
JP (1) JPS63102928A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02253593A (en) * 1989-03-27 1990-10-12 Mitsui Toatsu Chem Inc Luminous element
JPH08262146A (en) * 1995-03-17 1996-10-11 Ichiro Toda Cloud chamber
WO2012173192A1 (en) * 2011-06-17 2012-12-20 日東電工株式会社 Conductive laminate, transparent conductive laminate with patterned wiring, and optical device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5463185A (en) * 1977-10-31 1979-05-21 Teijin Ltd Laminate
JPS58206008A (en) * 1982-05-26 1983-12-01 コニカ株式会社 Method of forming transparent conductive laminate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5463185A (en) * 1977-10-31 1979-05-21 Teijin Ltd Laminate
JPS58206008A (en) * 1982-05-26 1983-12-01 コニカ株式会社 Method of forming transparent conductive laminate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02253593A (en) * 1989-03-27 1990-10-12 Mitsui Toatsu Chem Inc Luminous element
JPH08262146A (en) * 1995-03-17 1996-10-11 Ichiro Toda Cloud chamber
WO2012173192A1 (en) * 2011-06-17 2012-12-20 日東電工株式会社 Conductive laminate, transparent conductive laminate with patterned wiring, and optical device
JP2013001009A (en) * 2011-06-17 2013-01-07 Nitto Denko Corp Conductive laminate, transparent conductive laminate with patterned wiring and optical device
TWI551925B (en) * 2011-06-17 2016-10-01 Nitto Denko Corp A conductive laminate, a transparent conductive laminate having a pattern wiring, and an optical device
US9674946B2 (en) 2011-06-17 2017-06-06 Nitto Denko Corporation Conductive laminate, transparent conductive laminate with patterned wiring, and optical device

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