JPS6298242U - - Google Patents
Info
- Publication number
- JPS6298242U JPS6298242U JP18984985U JP18984985U JPS6298242U JP S6298242 U JPS6298242 U JP S6298242U JP 18984985 U JP18984985 U JP 18984985U JP 18984985 U JP18984985 U JP 18984985U JP S6298242 U JPS6298242 U JP S6298242U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor chip
- fixed
- terminal part
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18984985U JPS6298242U (en18) | 1985-12-10 | 1985-12-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18984985U JPS6298242U (en18) | 1985-12-10 | 1985-12-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6298242U true JPS6298242U (en18) | 1987-06-23 |
Family
ID=31142516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18984985U Pending JPS6298242U (en18) | 1985-12-10 | 1985-12-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6298242U (en18) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0629348A (ja) * | 1992-05-12 | 1994-02-04 | Akira Kitahara | 表面実装部品及びその半製品 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5313877A (en) * | 1976-07-23 | 1978-02-07 | Hitachi Ltd | Semiconductor device |
-
1985
- 1985-12-10 JP JP18984985U patent/JPS6298242U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5313877A (en) * | 1976-07-23 | 1978-02-07 | Hitachi Ltd | Semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0629348A (ja) * | 1992-05-12 | 1994-02-04 | Akira Kitahara | 表面実装部品及びその半製品 |