JPS6297166U - - Google Patents

Info

Publication number
JPS6297166U
JPS6297166U JP18713985U JP18713985U JPS6297166U JP S6297166 U JPS6297166 U JP S6297166U JP 18713985 U JP18713985 U JP 18713985U JP 18713985 U JP18713985 U JP 18713985U JP S6297166 U JPS6297166 U JP S6297166U
Authority
JP
Japan
Prior art keywords
thickness adjustment
film
substrate surface
evaporation source
deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18713985U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18713985U priority Critical patent/JPS6297166U/ja
Publication of JPS6297166U publication Critical patent/JPS6297166U/ja
Pending legal-status Critical Current

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  • Physical Vapour Deposition (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、蒸着装置の側面概略図、第2図は、
真空蒸着室の要部拡大図、第3図は、膜厚調整マ
スクの平面図、第4図は、従来の蒸着装置を示す
側面概略図である。 尚図中1は、蒸着装置、2は真空蒸着室、5は
基板面、6は蒸発源、7はシヤツター、8は膜厚
調整マスク、9は開口である。
Figure 1 is a schematic side view of the vapor deposition apparatus, Figure 2 is
FIG. 3 is a plan view of a film thickness adjustment mask, and FIG. 4 is a schematic side view of a conventional vapor deposition apparatus. In the figure, 1 is a vapor deposition apparatus, 2 is a vacuum vapor deposition chamber, 5 is a substrate surface, 6 is an evaporation source, 7 is a shutter, 8 is a film thickness adjustment mask, and 9 is an opening.

Claims (1)

【実用新案登録請求の範囲】 (1) 蒸発源から気化した金属物質を基板面に蒸
着させるものであつて、該蒸発源と該基板面間に
は膜厚調整マスクを配備した蒸着膜の膜厚調整装
置。 (2) 前記膜厚調整マスクには略〓状の開口を設
けたことを特徴とする実用新案登録請求の範囲第
1項記載の蒸着膜の膜厚調整装置。
[Claims for Utility Model Registration] (1) A vapor deposition film in which a metal substance vaporized from an evaporation source is deposited on a substrate surface, and a film thickness adjustment mask is provided between the evaporation source and the substrate surface. Thickness adjustment device. (2) The apparatus for adjusting the thickness of a deposited film according to claim 1, wherein the film thickness adjustment mask is provided with a substantially square-shaped opening.
JP18713985U 1985-12-04 1985-12-04 Pending JPS6297166U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18713985U JPS6297166U (en) 1985-12-04 1985-12-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18713985U JPS6297166U (en) 1985-12-04 1985-12-04

Publications (1)

Publication Number Publication Date
JPS6297166U true JPS6297166U (en) 1987-06-20

Family

ID=31137336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18713985U Pending JPS6297166U (en) 1985-12-04 1985-12-04

Country Status (1)

Country Link
JP (1) JPS6297166U (en)

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