JPS6296847U - - Google Patents
Info
- Publication number
- JPS6296847U JPS6296847U JP18921685U JP18921685U JPS6296847U JP S6296847 U JPS6296847 U JP S6296847U JP 18921685 U JP18921685 U JP 18921685U JP 18921685 U JP18921685 U JP 18921685U JP S6296847 U JPS6296847 U JP S6296847U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- lead frame
- cavity
- injected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18921685U JPS6296847U (US07655688-20100202-C00086.png) | 1985-12-09 | 1985-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18921685U JPS6296847U (US07655688-20100202-C00086.png) | 1985-12-09 | 1985-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6296847U true JPS6296847U (US07655688-20100202-C00086.png) | 1987-06-20 |
Family
ID=31141306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18921685U Pending JPS6296847U (US07655688-20100202-C00086.png) | 1985-12-09 | 1985-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6296847U (US07655688-20100202-C00086.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0217381U (US07655688-20100202-C00086.png) * | 1988-07-20 | 1990-02-05 | ||
| JPH02260547A (ja) * | 1989-03-31 | 1990-10-23 | Polyplastics Co | 電子部品の樹脂封止方法、樹脂封止用成形金型及び電子部品封止成形品 |
| JP2013131557A (ja) * | 2011-12-20 | 2013-07-04 | Toshiba Corp | 半導体装置およびその製造方法 |
-
1985
- 1985-12-09 JP JP18921685U patent/JPS6296847U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0217381U (US07655688-20100202-C00086.png) * | 1988-07-20 | 1990-02-05 | ||
| JPH02260547A (ja) * | 1989-03-31 | 1990-10-23 | Polyplastics Co | 電子部品の樹脂封止方法、樹脂封止用成形金型及び電子部品封止成形品 |
| JP2013131557A (ja) * | 2011-12-20 | 2013-07-04 | Toshiba Corp | 半導体装置およびその製造方法 |
