JPS6294979A - Image sensor sealed with transparent plastic - Google Patents

Abstract

PURPOSE:To reduce extremely the number of sealing parts without deteriorating characteristics concerning light incidence to a solid state image sensor to achieve cost-reduction, by sealing the solid state image sensor with transparent plastic. CONSTITUTION:An image sensor 2 is stuck on a lead-frame 1, and wiring is performed with a wire 3. At least the surface of the image sensor 2 is covered with a protection film 4 like silicon oxide film, etc. This unit is sealed by a transfer molding or mold-dip forming of transparent plastic 5 like acrylic resin, etc. and a hard coat 6 is made on the surface of the transparent plastic by forming a silicon oxide film, etc. sticking glass and the like. Thus it is possible to make the transparent plastic 5, the hard coat 6, or the protection film 4 to obtain a filtering action. Further, it is also possible to give the preventing action of irregular reflection of light by spreading block point on the surface of transparent plastic 6 except a light incidence window.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a sealing structure for a solid-state image sensor.

[Summary of the invention]

The present invention relates to the sealing of solid-state image sensors, and is based on sealing with transparent plastic.
The transparent plastic encapsulation of the sensor is characterized by forming a protective film on the surface of the solid-state image sensor and applying a node coat to the surface of the transparent plastic encapsulation body.

[Conventional technology]

Conventionally, solid-state image sensors have typically been sealed with ceramics, as shown in cross-section in FIG. That is, the lead frame 11 is sealed to the ceramic patch 12 with body melting point glass, the image sensor 16 is pasted on the lead frame 11, wiring is done with the wire 14, and the glass window 15 is sealed. It was customary to consist of

[Problems and Objectives to be Solved by the Invention] According to the above-mentioned prior art, a total of four points are required to form a package: one lead frame, two ceramic molded bodies, and one glass window. However, there are problems in that the number of parts is large and the cost is high.

[Means to solve the problem]

The present invention takes steps to employ a transparent plastic encapsulation to encapsulate a solid-state image sensor in order to eliminate many of the packaging components that are problematic in the prior art.

[Effect]

By sealing the solid-state image sensor with transparent plastic and soil, there is basically only one lead frame as a package component, and the optical transparency of the solid-state image sensor is not impaired. -There is an effect called.

〔Example〕

The present invention will be described in detail below using the F1 implementation sequence.

FIG. 1 is a cross-sectional view of a quick-cut plastic seal two image sensor showing one embodiment of the invention.

In other words, an image sensor 2 is pasted on the lead frame 1 and wired with wires 6, and at least the surface of the image sensor 2 is covered with a protective film 4 made of silicon oxide film or the like, and is coated with acrylic resin. The transparent plastic 5 is sealed by transfer molding or dip molding into a mold, and the surface of the transparent plastic is coated with a hard coat 6 by forming a silicon oxide film or pasting glass.

The transparent plastic 5, the node coat 6, or the protective film 4 can have a filtering effect that partially transmits characteristic wavelengths, and furthermore, the surface of the transparent plastic 6 except for the light entrance window can be coated with black paint. It can also be applied to provide an effect to prevent diffused reflection of light.

〔Effect of the invention〕

By encapsulating a solid-state image sensor with transparent plastic as in the present invention, the number of encapsulating parts can be greatly reduced without impairing the light incidence characteristics of the solid-state image sensor, and the number of encapsulating parts can be reduced. This has the effect of making it possible to reduce the cost of large-scale solid-state image sensors.

[Brief explanation of drawings]

FIG. 241 is an Ifr side view of a transparent plastic sealed image sensor showing one embodiment of the present invention, and FIG. 2 is a F cross-sectional view of a ceramic sealed image sensor showing an embodiment of the prior art. 1.11... Lead frame 2.13... Image sensor 12... Ceramic pancage 3.14
...Wire 4...Protective film 5...Transparent plastic 6...-1...Hard coat 15... ...Glass window. Above 迭迭B Month Aras ÷ Tsuk Seal Image Sensor Alrim Figure 1 Ceramic Rough I Dimension North Image Sensor Cross Section Bacteria Figure 2

Claims (3)

[Claims] (1) A transparent plastic-sealed image sensor characterized by a solid-state image sensor sealed with transparent plastic such as acrylic resin. (2) Solid-state image sensor or solid-state image sensor
The transparent plastic-sealed image sensor according to claim 1, characterized in that a protective film of silicon oxide or silicon nitride is formed on at least the surface of the color filter formed on the sensor surface. (3) The transparent plastic seal according to claim 1, characterized in that the surface of the transparent plastic seal of the solid-state image sensor is hard coated with a film such as silicon oxide or pasted with glass or the like. Stop image sensor.