JPS6294569U - - Google Patents

Info

Publication number
JPS6294569U
JPS6294569U JP1985186442U JP18644285U JPS6294569U JP S6294569 U JPS6294569 U JP S6294569U JP 1985186442 U JP1985186442 U JP 1985186442U JP 18644285 U JP18644285 U JP 18644285U JP S6294569 U JPS6294569 U JP S6294569U
Authority
JP
Japan
Prior art keywords
terminal
chassis
circuit board
shield plate
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985186442U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0411349Y2 (US20080094685A1-20080424-C00004.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985186442U priority Critical patent/JPH0411349Y2/ja
Publication of JPS6294569U publication Critical patent/JPS6294569U/ja
Priority to US07/267,658 priority patent/US4841414A/en
Application granted granted Critical
Publication of JPH0411349Y2 publication Critical patent/JPH0411349Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi-Conductor Connections (AREA)
  • Structure Of Receivers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP1985186442U 1985-12-03 1985-12-03 Expired JPH0411349Y2 (US20080094685A1-20080424-C00004.png)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1985186442U JPH0411349Y2 (US20080094685A1-20080424-C00004.png) 1985-12-03 1985-12-03
US07/267,658 US4841414A (en) 1985-12-03 1988-11-03 High frequency apparatus chassis and circuit board construction

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985186442U JPH0411349Y2 (US20080094685A1-20080424-C00004.png) 1985-12-03 1985-12-03

Publications (2)

Publication Number Publication Date
JPS6294569U true JPS6294569U (US20080094685A1-20080424-C00004.png) 1987-06-16
JPH0411349Y2 JPH0411349Y2 (US20080094685A1-20080424-C00004.png) 1992-03-19

Family

ID=16188519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985186442U Expired JPH0411349Y2 (US20080094685A1-20080424-C00004.png) 1985-12-03 1985-12-03

Country Status (2)

Country Link
US (1) US4841414A (US20080094685A1-20080424-C00004.png)
JP (1) JPH0411349Y2 (US20080094685A1-20080424-C00004.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009021798A (ja) * 2007-07-11 2009-01-29 Mitsumi Electric Co Ltd チューナ装置

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI84216C (fi) * 1989-02-03 1991-10-25 Nokia Mobira Oy Foerfarande foer tillverkning av en stomme foer en radiotelefon samt enligt foerfarandet tillverkad stomme.
US5241453A (en) * 1991-11-18 1993-08-31 The Whitaker Corporation EMI shielding device
US5357404A (en) * 1991-11-18 1994-10-18 The Whitaker Corporation EMI shield, and assembly using same
US5302923A (en) * 1992-07-16 1994-04-12 Hewlett-Packard Company Interconnection plate having high frequency transmission line through paths
US5354951A (en) * 1993-03-15 1994-10-11 Leader Tech, Inc. Circuit board component shielding enclosure and assembly
JPH07105759B2 (ja) * 1993-03-30 1995-11-13 山一電機株式会社 光電変換器
GB2297654B (en) * 1995-02-03 1998-09-09 Cliff Electron Components Ltd A circuit board assembly and a method of manufacturing such an assembly
US5566053A (en) * 1995-10-11 1996-10-15 Chou; Jonie Electric receptacle assembly
US5841637A (en) * 1996-03-25 1998-11-24 Intellikey Corporation ESD-protective housing for electronically operated lock
DE19618481C1 (de) * 1996-05-08 1997-08-14 Telefunken Microelectron Elektronikmodul mit Steckkontakten und leitender Abdeckkappe
JP2850860B2 (ja) * 1996-06-24 1999-01-27 住友金属工業株式会社 電子部品の製造方法
DE19636181A1 (de) * 1996-09-06 1998-03-12 Philips Patentverwaltung HF-Modul, z. B. Tuner
DE59812848D1 (de) * 1997-10-11 2005-07-14 Conti Temic Microelectronic Gehäuse zur Aufnahme elektronischer Bauelemente
US6194655B1 (en) 1999-03-01 2001-02-27 Leader Tech, Inc. Circuit board component shielding enclosure and assembly having opposing covers interfitted with upper and lower portions of enclosure
JP4061005B2 (ja) * 1999-03-31 2008-03-12 シャープ株式会社 発光ダイオードおよびその製造方法並びに発光ダイオードの電気配線基板への搭載方法
US6404309B1 (en) * 2000-06-09 2002-06-11 Thomson Licensing, S.A. Tuner with non-edge RF input pin/lead
JP4747409B2 (ja) * 2000-11-09 2011-08-17 ソニー株式会社 受信装置
US6524120B2 (en) * 2001-03-22 2003-02-25 Mobicom Corp. Article comprising EMI shielding
KR100411255B1 (ko) * 2001-06-11 2003-12-18 삼성전기주식회사 케이블 모뎀 튜너 모듈의 히트싱크
JP2006505931A (ja) * 2002-11-08 2006-02-16 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 高周波装置
JP4107160B2 (ja) * 2003-05-23 2008-06-25 株式会社村田製作所 複合電子部品
JP2008153541A (ja) * 2006-12-19 2008-07-03 Toshiba Corp 基板取付構造
JP2009158548A (ja) * 2007-12-25 2009-07-16 Toshiba Corp シールドケース、配線基板、及び電子部品モジュール
TWI418175B (zh) * 2009-12-24 2013-12-01 Delta Electronics Inc 網路通訊零件
TWI525782B (zh) * 2011-01-05 2016-03-11 矽品精密工業股份有限公司 半導體封裝件及其製法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5467288U (US20080094685A1-20080424-C00004.png) * 1977-10-21 1979-05-12

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3721746A (en) * 1971-10-01 1973-03-20 Motorola Inc Shielding techniques for r.f. circuitry
US4063788A (en) * 1976-06-21 1977-12-20 Motorola, Inc. Chassis captivation arrangement for vibration attenuation
DE2932015C2 (de) * 1978-08-07 1983-12-29 Mitsumi Electric Co., Ltd., Tokyo Abschirmvorrichtung für Hochfrequenzschaltungen
US4306205A (en) * 1978-10-31 1981-12-15 Murata Manufacturing Co., Ltd. High frequency apparatus
JPS5910827Y2 (ja) * 1978-12-28 1984-04-04 株式会社村田製作所 電子チユ−ナの仮固定構造
JPS5887896A (ja) * 1981-11-20 1983-05-25 アルプス電気株式会社 高周波回路機器の組立構造

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5467288U (US20080094685A1-20080424-C00004.png) * 1977-10-21 1979-05-12

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009021798A (ja) * 2007-07-11 2009-01-29 Mitsumi Electric Co Ltd チューナ装置

Also Published As

Publication number Publication date
JPH0411349Y2 (US20080094685A1-20080424-C00004.png) 1992-03-19
US4841414A (en) 1989-06-20

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