JPS6292603A - Manufacture of plane antenna - Google Patents

Abstract

PURPOSE:To uniformize the thickness of a dielectric base by increasing the size of the dielectric base larger than an antenna base and arranging a base frame having the same thickness as that of the base at the peripheral part of a ground conductor base so as to apply high temperature press. CONSTITUTION:The size of a protection film 2, the ground conductor base 4 and an adhesion film 6 is formed the same as that of the antenna base 1 and the dielectric base 3 is formed larger than the base 1. The base frame 11 made of a metallic plate giving the same thickness as that of the base 4 is arranged to the peripheral of the ground conductor base 4. A cushion member 8, a mirror plate 7, the base frame 11 and a removing paper 10 are arranged on a heater plate 9, the ground conductor base 4 is placed to the inside of the base frame 11, an antenna circuit is placed on the base 4 via the adhesion film 6, the dielectric base 3 and the adhesive film 6, the removing paper 10, the mirror plate 7 and the cushion member 8 are placed and high temperature press is applied from both the heating plates 9. At the end of press, excessive part of the base plate 3 is cut off.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Part!#) The present invention relates to a method of manufacturing a flat antenna used for microwave communication, satellite broadcasting, etc.

(Background Art) A general antenna substrate is shown in FIG. 2. In the figure, an antenna substrate 11' is formed on top, a protective film 2 degrees, a microstrip line 5, a dielectric substrate 3 degrees, and a ground conductor substrate 4, in this order.

The conventional method for cutting the antenna board 1 is as shown in FIG. Illr-formed valley materials were laminated and bonded using a high-temperature press to become conductive. The order of stacking is 8t of cushioning material on top of the hot plate 9.
- Place the metal plate 7 on this cushioning material. Place the release paper IO on top, then layer the adhesive film 6 on top of the flat ground conductor 4, put the dielectric substrate 3 on top of it, write the adhesive film 6 on top of it, and put the microelectrode on it. An antenna circuit printed board r consisting of a strip line 5 and a protective film 2 is mounted. Furthermore, release paper 10. Kinban 7. The entire cushioning material 8 is placed on top and bottom heating plates 9 and heated and stacked.

Protective film 2... Burnable film such as FIJ, such as polyethylene terephthalate (100 μmW) Microstrip line 5... For example, steel foil (
35 μm#) Dielectric substrate 3...Low dielectric constant Teflon or polyethylene (1+W thickness) Ground conductor substrate 4...Aluminum plate (2 touch thickness)
Adhesive film 6...°Low polar polyolefin sheet (100μm thick) When high temperature pressing is performed using this construction and the materials used, the vj dielectric substrate melts and the natural flow causes the external flows out. As a result, the thickness of the outer periphery of the end surface of the antenna substrate 1 is thinner than that of the inside thereof.

This results in dielectric substrate 3 )! 81. The drawback is that non-uniformity in power leads to impedance mismatches.

(Objective of the invention) 7f1: The invention was proposed to improve all the above-mentioned drawbacks, and it is to provide a method for manufacturing a planar antenna in which the thickness of the dielectric substrate 3 is uniform and impedance mismatch is small. With the goal.

(Disclosure of the Invention) The antenna substrate manufactured by the conventional manufacturing method is
The dielectric substrate melted in the bath flows out of the antenna substrate, resulting in a thin wall near the outer periphery. Therefore, the basic idea of the present invention is to press a larger size in consideration of the spillage.

However, it is uneconomical to mold the entire antenna board to a larger finished size as an antenna board and then cut it to a predetermined size, resulting in a large loss of material.

Therefore, a feature of the present invention is to attempt to manufacture all antenna substrates with a uniform dielectric substrate thickness while reducing material loss.

FIG. 1 shows a method of manufacturing an antenna according to the present invention.

In the figure, 2 is a protective film, 4 is a ground conductor board, and 6 is a protective film.
03 is an adhesive film, and its dimensions are the same as those of the antenna substrate. 03 is a dielectric substrate, and its dimensions are made larger to compensate for the thinning caused by outflow during melting. Approximately 100m 113).

Reference numeral 7 indicates the end plate of the press, 8 indicates the cushioning material, and 9 indicates the hot plate of the press. An underframe 11 made of a metal plate or a hard heat-resistant material (hereinafter simply referred to as a metal plate) having the same thickness as the ground conductor substrate 4 is disposed around the outer periphery of the ground 4-piece substrate 4.

The manufacturing order is as follows: Place the cushioning material 8° mirror plate 7 on the hot plate 9, arrange the 11 underframes on the mirror plate 7, place the release paper 10 on the underframe 11, and place the ground conductor board inside the underframe 11. 4, and a film 6° dielectric substrate 3. Place the antenna circuit tray consisting of the microstrip line 5 and protective film 2 again through the adhesive film 6, place the release paper 1 (J, inkstone plate 7, and 8 pieces of cushioning material), and heat the area to high temperature on both heating plates 9. Press, make all the materials conductive, and form the antenna board.

When the pressing is completed, the dielectric substrate 3 formed into a larger size is
Since the antenna board 3 area is protruding, this t=i;
7J# to finish the antenna board 1.

Note that the release paper 10f was used to prevent the adhesive film 6 and the dielectric substrate 3 from adhering to the stand 11 during high-temperature pressing.

(Effect of the invention) As mentioned above, a dielectric substrate is placed on the surface of the ground conductor substrate via an adhesive film, and gold Mffi is placed on the dielectric substrate In the method of manufacturing an antenna substrate by laminating a microstrip line consisting of a protective film L and a printed board consisting of a protective film L and adhesively bonding them by high-temperature pressing, the dielectric substrate is
A dielectric material is formed by placing an underframe made of a metal plate larger in size than the antenna board and having the same thickness as the grounding conductor board around the outer periphery of the grounding conductor board, and performing high-temperature pressing. Antenna substrates with uniform substrate thickness can be used.

[Brief explanation of drawings]

FIG. 1 shows a manufacturing method of a planar antenna according to the present invention, FIG. 2 shows a structure of a general planar antenna, and FIG. 3 shows a conventional manufacturing method.

Claims (1)

[Claims] A dielectric substrate is placed on the surface of the ground conductor substrate via an adhesive film, and a microstrip line made of metal foil and a printed board made of a protective film are laminated on the surface of the dielectric substrate via an adhesive film. In the method of manufacturing an antenna substrate by adhesively bonding by high-temperature pressing, the dielectric substrate has a size larger than that of the antenna substrate, and the ground conductor substrate is attached to the outer periphery of the ground conductor substrate. 1. A method of manufacturing a planar antenna, which comprises arranging an underframe made of a metal plate of the same thickness as the metal plate, and performing high-temperature pressing.