JPS6287346A - Manufacture of metallic base laminated plate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field 1 The present invention relates to a method for manufacturing a metal-based laminate using a fluororesin as an insulating layer.

[Background technology 1] Conventionally, through-holes are drilled in a metal plate in advance, and then a resin film such as an epoxy resin film is placed on one side of the metal plate. 11 When molding with a release paper interposed between the film and the molding plate and filling the through holes with resin, an insulating resin layer is formed, and then a metal foil is pasted on the insulating resin layer and laminated. The board is made of 01 resin film, which is made of 7 ropes.
I, if you are going to do it, the heating molding temperature is 250
Since it is a Cl film, there is no suitable release paper, so it was possible to use a substantially -t-7 silane film. In addition, the resin around the through-holes in the metal plate decreases, causing creases in the resin insulating layer, resulting in not only a flat skin but also poor heat resistance and erosion resistance, resulting in poor printed wiring. There was a problem in that the reliability of the board was impaired.

1 Purpose of the Invention 1 The present invention has been made in view of the above circumstances, and its purpose is to make it possible to employ 77 base resin for the formation of an insulating layer and to improve moisture resistance compared to white clay. Moreover, the object is to manufacture a reliable metal base edge plate as a printed circuit board without causing a dent in the resin insulating layer due to a decrease in O1 resin around the through hole of the metal plate.

[Disclosure 1 of the Invention The method for manufacturing a metal-based full one-layer plate of the present invention
A through hole 2 for a through hole is bored in the plate 1, and a fluororesin film 3 is sequentially applied to one side of the metal plate. It is characterized in that a fluororesin-impregnated base material 4 and then a metal foil 5 are stacked and molded under heat and pressure to fill the through holes 2 of the metal plate 1 with the fluororesin and form an insulating resin layer 6. be.

Hereinafter, the present invention will be explained in detail based on the attached drawings A.1. The metal plate 1 in the present invention includes a copper plate, an aluminum plate, a brass plate, an iron plate, a stainless steel plate, a nickel plate,
Any material such as silicon steel plate can be used, and the thickness is usually 0.5~
2. Use one in the range of 0mm.

First, make a through hole 2 for a through hole at a desired location on this metal plate 1! 1! Crotch. Next, on one side of the metal plate 1, a 72 element resin film 3, a fluororesin-impregnated base material 4, a fluororesin film 3, and then a metal foil 5 are layered and formed under heat and pressure to form the through holes 2 of the metal plate 1. is filled with a fluororesin to form an insulating resin layer 6 (Figure 1 (aHb)). As the fluororesin, E7 fluorochloroethylene resin (melting point 21
0 to 212°C), tetra7isoethylene (melting point 327°C)
, IJ! 17-fluorinated ethylene/-67-propylene copolymer resin (melting point: 270°C), 47-fluorinated ethylene-perfluorovinylederno (polymer 01 resin (melting point: 10
Melting point is 200℃, such as 2 = 31(+'c)
Preferably. J
). As the metal foil 5, any of copper foil, aluminum 1^, steel foil, iron foil, stainless steel foil, nickel foil, and silicon steel foil can be used. Heat and pressure molding 1, metal plate 1.77 cord type resin film 3.7 cord type 01 fat-impregnated Motomura 4, fluorine resin film 3, metal 9 Pf5 as a set and introduce 15lrlI through the molding plate. Place it in the dark, for example, 1-520-150 below 250℃@
/cm2.40-1 (+) Heat and pressurize for 1 minute to integrate the layers (Fig. 1(d)).

After this, on the other side of the metal plate 1, a 11t film 3 made of 7-triene-based
, fluororesin-impregnated base material 4. Fluorine resin film 3,
Next, the metal foil 5 is sequentially integrally molded under the same conditions as the pressure and heat molding described in item 1 to obtain a metal base double-sided metal clad laminate @A. Metal plate 1, 77 element OI fat film 3 and fluorine thread t
The combination with the #tIIW impregnated substrate 4 ends in FIG. 2, for example, as shown in Table 1.

Table 1 Example 12 Metal plate (copper) Thickness (Nishikiso) 0.5 0.5-thick]] [L-thread (!-thick) 1□L 1.5 Resin film a Name Trisulfuric acid chloride 4 7tethylene ethylene
-Hexa7-propylene copolymer thickness (μ) 200 200b Name: Hexa-7-propylene copolymer; Hexa-7-propylene ethylene
- 67-propylene copolymer” knee g5 - 2 la - Resin-impregnated base material composition tri7t-chloride tetra7t-ethylene ethylene
-67-propylene copolymer glass cloth (100μ) 1111---Goo? X J (Kon 9P-1 Example 3---4-11---- Metal plate (copper) Thickness (aei) 1.0
0.8J! J3. -L(M! l-
1□Ra - -1-,1-1 resin film a Name Ethylene tetra7-ethylene hexane-perfluorpropylene Olobinyl A copolymer Chill copolymer thickness (μ) 300 300b Name 4 Ethyl fluoride Ethylene par 7
Le l/perfluorovinyl ether Olovinylethyl copolymer Chill copolymer ~---1v←#]---2rah-25-O (fat-impregnated base material composition Tetrafluoroethylene 47tsu) -1j-7, -11-uj (10
The metal base laminate A obtained in 0J to above) is used as a metal base printed wiring board by forming penetrating holes on both sides, for example, by using a drill along the through holes 2, and performing through hole plating.

[Effect of the invention 1 In the present invention, nine through-holes are provided in a metal plate, and these four are sequentially coated with a fluorine-based resin film, a fluorine-based 0 (fat-impregnated base material) Then, metal foils were layered and molded under heat and pressure to form 77 cables into the four holes of the metal plate.
Since it is filled with oil, there is no need for a release paper like in the past. Therefore, by using fluororesin, which has a high molding temperature, to form the insulating resin layer, it is possible to improve the moisture resistance of the laminate. Yes, and in addition to fluororesin film, there are 7
Since we use a base material impregnated with 7 rope resin, we can reduce the amount of resin around one hole in the metal plate by using a 77 rope system O (covering with a fat film will not cause dents in the outer insulating resin layer, and it can be used as a printed circuit board. 46 Highly reliable laminates can be manufactured.

[Brief explanation of drawings]

FIGS. 1(a), (b), (c), and (d) are schematic cross-sectional views showing the steps of an embodiment of the present invention, and FIG. 2 is a schematic exploded cross-sectional view showing a laminate obtained by the above method, A is a laminate,
1 is a metal plate, 2 is a through hole, 3 is a fluororesin film,
4 is a seven-wire Mal resin-impregnated substrate, 5 is a metal foil, and 6 is an insulating resin layer. Agent Patent Attorney Ishi 1) Chief Seven Procedures -? Iti-11-Misho (Jizasai) December 1985
Month 2811

Claims (1)

[Claims] (1) A through-hole is drilled in a metal plate, and a fluororesin film, a fluororesin-impregnated base material, and then a metal foil are sequentially layered on one side of the metal plate, and the metal is heated and pressure-molded. A method for manufacturing a metal base laminate, comprising filling through holes in the plate with a fluororesin and forming an insulating resin layer.