JPS6287346A - Manufacture of metallic base laminated plate - Google Patents
Manufacture of metallic base laminated plateInfo
- Publication number
- JPS6287346A JPS6287346A JP22812185A JP22812185A JPS6287346A JP S6287346 A JPS6287346 A JP S6287346A JP 22812185 A JP22812185 A JP 22812185A JP 22812185 A JP22812185 A JP 22812185A JP S6287346 A JPS6287346 A JP S6287346A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- plate
- resin
- fluororesin
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
E技術分野1
本発明は絶縁層としてフッ素系樹脂を用いた金属ベース
積層板の製造り法に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field 1 The present invention relates to a method for manufacturing a metal-based laminate using a fluororesin as an insulating layer.
[背景技術1
従来上り、金属板に予めスルーホール用の貫通孔を穿設
し、次いでこの金属板の片面にエポキシ樹脂フィルムの
ような樹脂フィルムを配置し、樹!11フィルムと成形
プレートとの間に離型紙を介在させて成形して貫通孔に
樹脂を充填させると」(に絶縁樹脂層を形成し、次いで
、絶縁樹脂層に金属箔を貼着して積層板を形成している
が、01脂フイルムとして7ツ索系頓(脂を採用し、耐
湿性な商めて、吸湿処理後の絶縁劣化をn)j +l
I、ようとする場合にあっては、加熱成形温度が250
’Clシ」ユに成るため適当な離型紙が存在せず、実質
−t−7ツ素系ム1脂フイルムの採用は4;可能であっ
た。又、金属板の貫通孔周辺の樹脂が減少して樹脂絶縁
層に・\こみが発生し、平面皮が11(くなるだけでな
く、耐熱性及び耐侵食性が劣ってl、よいプリント配線
板としての信頼性が損なわれてl、ようという問題があ
った。[Background technology 1] Conventionally, through-holes are drilled in a metal plate in advance, and then a resin film such as an epoxy resin film is placed on one side of the metal plate. 11 When molding with a release paper interposed between the film and the molding plate and filling the through holes with resin, an insulating resin layer is formed, and then a metal foil is pasted on the insulating resin layer and laminated. The board is made of 01 resin film, which is made of 7 ropes.
I, if you are going to do it, the heating molding temperature is 250
Since it is a Cl film, there is no suitable release paper, so it was possible to use a substantially -t-7 silane film. In addition, the resin around the through-holes in the metal plate decreases, causing creases in the resin insulating layer, resulting in not only a flat skin but also poor heat resistance and erosion resistance, resulting in poor printed wiring. There was a problem in that the reliability of the board was impaired.
1発明の目的1
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、絶縁層の形成に77素樹脂を採用で
き、耐湿性を白土さ仕ることがでト、しかも、金属板の
貫通孔の周辺の01脂が減少して樹脂絶縁層のへこみが
発生することもなく、プリント基板として信頼性の畠い
金属ベース稜#板を製造することにある。1 Purpose of the Invention 1 The present invention has been made in view of the above circumstances, and its purpose is to make it possible to employ 77 base resin for the formation of an insulating layer and to improve moisture resistance compared to white clay. Moreover, the object is to manufacture a reliable metal base edge plate as a printed circuit board without causing a dent in the resin insulating layer due to a decrease in O1 resin around the through hole of the metal plate.
[発明の開示1
本発明の金属ベースfll1層板の製造方法は、金属−
板1にスルーホール用の貫通孔2を穿設し、この金属板
の片面に、順次フッ素系樹脂フィルム3.フッ素系樹脂
含浸基材4、次いで金属箔5を重ねて加熱加圧成形して
金属板1の貫通孔2にフッ素系樹脂を充填させると共に
絶縁樹脂層6を形成することを特徴とするものである。[Disclosure 1 of the Invention The method for manufacturing a metal-based full one-layer plate of the present invention
A through hole 2 for a through hole is bored in the plate 1, and a fluororesin film 3 is sequentially applied to one side of the metal plate. It is characterized in that a fluororesin-impregnated base material 4 and then a metal foil 5 are stacked and molded under heat and pressure to fill the through holes 2 of the metal plate 1 with the fluororesin and form an insulating resin layer 6. be.
以下本発明を添イ・1の図面に基づいて詳細に説明する
。本発明における金属板1としては銅板、アルミニウム
板、真ちゅう板、鉄板、ステンレス鋼板、ニッケル板、
ケイ素鋼板などいずれをも採用でき、通常厚み0.5〜
2.Ommの範囲のものを用いる。Hereinafter, the present invention will be explained in detail based on the attached drawings A.1. The metal plate 1 in the present invention includes a copper plate, an aluminum plate, a brass plate, an iron plate, a stainless steel plate, a nickel plate,
Any material such as silicon steel plate can be used, and the thickness is usually 0.5~
2. Use one in the range of 0mm.
まずこの金属板1の所望の箇所にスルーホール用の貫通
孔2を!1!股する。次いで、金属板1の片面に、順次
72素系樹脂フイルム3、フッ素系樹脂含浸基材4、フ
ッ素樹脂フィルム3、次いで金属箔5を重ねて加熱加圧
成形して金属板1の貫通孔2にフッ素系樹脂を充填させ
て絶縁樹脂層6を形成する(1図(aHb))。フッ素
系樹脂としては、E7フ化塩化エチレン樹脂(融点21
0〜212℃)、四7ソ化エチレン(融点327°C)
、IJ!17フ化エチレン・−゛六7ツ化プロピレン共
重合体樹脂(融点270℃)、四7フ化エチレンーパー
フルオロビニルエーデルノ(重合体01脂(融点:10
2 = 31(+’c )などのような融点が200℃
のものが好ましい。7ツ索系0(脂含浸基材4は、ガラ
ス布、アスベストペーパー、合繊布などの基材にフッ素
樹脂を含浸させ乾燥させることに上り形成したものでJ
)る。金属箔5としては銅箔、アルミニウム1^、貞も
ゆう箔、鉄箔、ステンレス鋼箔、ニッケル箔、ケイ素鋼
箔なといずれをも採用できる。加熱加圧成形1よ、金属
板1.77索系樹脂フイルム3.7ツ索系01脂含浸基
村4、フッ素系樹脂フィルム3、金属9Pf5を〜組み
として成形プレートを介してl5lrlI紹み熱盤闇に
配置し、゛例えば、250℃以1−520−150に@
/cm2.40−1 (+(1分で加熱加圧して積層一
体化さ仕る(第1図(d))。First, make a through hole 2 for a through hole at a desired location on this metal plate 1! 1! Crotch. Next, on one side of the metal plate 1, a 72 element resin film 3, a fluororesin-impregnated base material 4, a fluororesin film 3, and then a metal foil 5 are layered and formed under heat and pressure to form the through holes 2 of the metal plate 1. is filled with a fluororesin to form an insulating resin layer 6 (Figure 1 (aHb)). As the fluororesin, E7 fluorochloroethylene resin (melting point 21
0 to 212°C), tetra7isoethylene (melting point 327°C)
, IJ! 17-fluorinated ethylene/-67-propylene copolymer resin (melting point: 270°C), 47-fluorinated ethylene-perfluorovinylederno (polymer 01 resin (melting point: 10
Melting point is 200℃, such as 2 = 31(+'c)
Preferably. J
). As the metal foil 5, any of copper foil, aluminum 1^, steel foil, iron foil, stainless steel foil, nickel foil, and silicon steel foil can be used. Heat and pressure molding 1, metal plate 1.77 cord type resin film 3.7 cord type 01 fat-impregnated Motomura 4, fluorine resin film 3, metal 9 Pf5 as a set and introduce 15lrlI through the molding plate. Place it in the dark, for example, 1-520-150 below 250℃@
/cm2.40-1 (+) Heat and pressurize for 1 minute to integrate the layers (Fig. 1(d)).
この後、金属板1の他面に7ツ素系崩11tフイルム3
、フッ素系樹脂含浸基材4.フッ素系樹脂フイルム3、
次いで金属箔5を」1記の加圧加熱成形と同様の条件で
順次一体成形して金属ベース両面金属張り積層@Aを得
る。金属板1と77素系OI脂フイルム3とフッ素糸t
#tIIW含浸基材4との組合わせは、第2図において
、例えば、第1表の如くして実施で終る。After this, on the other side of the metal plate 1, a 11t film 3 made of 7-triene-based
, fluororesin-impregnated base material 4. Fluorine resin film 3,
Next, the metal foil 5 is sequentially integrally molded under the same conditions as the pressure and heat molding described in item 1 to obtain a metal base double-sided metal clad laminate @A. Metal plate 1, 77 element OI fat film 3 and fluorine thread t
The combination with the #tIIW impregnated substrate 4 ends in FIG. 2, for example, as shown in Table 1.
第1表
実施例
一12
金属板(銅)
厚(錦曽) 0.5 0.5−貫
]][L通(!竺) 1□ラ 1.5樹脂
フイルム
a
名称 三7ツ化塩化 四7ツ化エチレンエチレン
−六7ツ化プロ
ピレン共重合体
厚(μ) 200 200b
名称 玉7ツ化堪化 込;7ツ化エチレンエチレン
−六7ツ化プロ
ピレン共重合体
」ニーg5−−−− − 2ラ −樹脂含浸
基材
構成 三7ツ化塩化 四7ツ化エチレンエチレン
−六7ツ化プロ
十 ピレン共重合体
ガラス布(100μ) 十
一一一−−−−−グー? X J(坤9P−1実施例
3−−−−4−一一−−−−
金属板(銅)
厚(aei) 1.0
0.8J!J3.−L(M! l−
1□ラ − −1−,1−一樹脂フイルム
a
名称 四7ツ化エチ 四7ツ化エチレンー六7ツ化
レンーパーフル
プロピレン オロビニルエー
共重合体 チル共重合体
厚(μ) 300 300b
名称 四フッ化エチ 四7ツ化エチレレンーパー7
ル l/ンーパーフル
オロビニルエー オロビニルエー
チル共重合体 チル共重合体
〜−−−1v←#]−−−2ラーー−25−O(脂含浸
基材
構成 四7ツ化エチレン 四7ツ化−六7ツ化プロ
エチレン
ピレン共重合体 士
十 ガラス布
、 −1j−7,−リ11岨uj (10
0J〜この上)にして得た金属ベース積層板Aは、例え
ば貫通孔2に沿ってドリルなどにより両面に貫通する孔
を形成し、スルーホールめっきを行って金属ベースプリ
ント配線基板として使用する。Table 1 Example 12 Metal plate (copper) Thickness (Nishikiso) 0.5 0.5-thick]] [L-thread (!-thick) 1□L 1.5 Resin film a Name Trisulfuric acid chloride 4 7tethylene ethylene
-Hexa7-propylene copolymer thickness (μ) 200 200b Name: Hexa-7-propylene copolymer; Hexa-7-propylene ethylene
- 67-propylene copolymer” knee g5 - 2 la - Resin-impregnated base material composition tri7t-chloride tetra7t-ethylene ethylene
-67-propylene copolymer glass cloth (100μ) 1111---Goo? X J (Kon 9P-1 Example 3---4-11---- Metal plate (copper) Thickness (aei) 1.0
0.8J! J3. -L(M! l-
1□Ra - -1-,1-1 resin film a Name Ethylene tetra7-ethylene hexane-perfluorpropylene Olobinyl A copolymer Chill copolymer thickness (μ) 300 300b Name 4 Ethyl fluoride Ethylene par 7
Le l/perfluorovinyl ether Olovinylethyl copolymer Chill copolymer ~---1v←#]---2rah-25-O (fat-impregnated base material composition Tetrafluoroethylene 47tsu) -1j-7, -11-uj (10
The metal base laminate A obtained in 0J to above) is used as a metal base printed wiring board by forming penetrating holes on both sides, for example, by using a drill along the through holes 2, and performing through hole plating.
[発明の効果1
本発明にあっては、金属板にスルーホール用の貫通孔を
9設し、この4を翼板の片ItIiに、順次フッ素系樹
脂フィルム、フッ素系0(脂含浸基材、次いで金属箔を
重ねて加熱加圧成形して金属板の四通孔に77索系01
脂を充填させるので、従来のように離型紙を必要としな
く、従って絶縁樹脂層の形成に成形温度の高いフッ素樹
脂を採用で朴、積層板の耐湿性を向上させることがで外
るものであり、しかも、フッ素系樹脂フイルムの他に7
7索糸樹脂含浸基材を用いるので、金属板の1通孔の周
辺の樹脂の減少を77索系O(脂フィルムでカバーで外
絶縁樹脂層にへこみが発生することもなく、プリント基
板として46頼性の高い積層板を製造することができる
。[Effect of the invention 1 In the present invention, nine through-holes are provided in a metal plate, and these four are sequentially coated with a fluorine-based resin film, a fluorine-based 0 (fat-impregnated base material) Then, metal foils were layered and molded under heat and pressure to form 77 cables into the four holes of the metal plate.
Since it is filled with oil, there is no need for a release paper like in the past. Therefore, by using fluororesin, which has a high molding temperature, to form the insulating resin layer, it is possible to improve the moisture resistance of the laminate. Yes, and in addition to fluororesin film, there are 7
Since we use a base material impregnated with 7 rope resin, we can reduce the amount of resin around one hole in the metal plate by using a 77 rope system O (covering with a fat film will not cause dents in the outer insulating resin layer, and it can be used as a printed circuit board. 46 Highly reliable laminates can be manufactured.
第1図(a )(b )(c )(d )は本発明の一
実施例の工程を示す概略断面図、第2図は同上により得
た積層板を示す概略分解断面図であって、Aは積層板、
1は金属板、2は貫通孔、3はフッ素系樹脂フィルム、
4は7ツ索Mal脂含浸基村、5は金属箔、6は絶縁樹
脂層である。
代理人 弁理士 石 1)長 七
手続−?Iti−11−ミ書(自ざ斉)昭和60年12
月2811FIGS. 1(a), (b), (c), and (d) are schematic cross-sectional views showing the steps of an embodiment of the present invention, and FIG. 2 is a schematic exploded cross-sectional view showing a laminate obtained by the above method, A is a laminate,
1 is a metal plate, 2 is a through hole, 3 is a fluororesin film,
4 is a seven-wire Mal resin-impregnated substrate, 5 is a metal foil, and 6 is an insulating resin layer. Agent Patent Attorney Ishi 1) Chief Seven Procedures -? Iti-11-Misho (Jizasai) December 1985
Month 2811
Claims (1)
金属板の片面に、順次フッ素系樹脂フィルム、フッ素系
樹脂含浸基材、次いで金属箔を重ねて加熱加圧成形して
金属板の貫通孔にフッ素系樹脂を充填させると共に絶縁
樹脂層を形成することを特徴とする金属ベース積層板の
製造方法。(1) A through-hole is drilled in a metal plate, and a fluororesin film, a fluororesin-impregnated base material, and then a metal foil are sequentially layered on one side of the metal plate, and the metal is heated and pressure-molded. A method for manufacturing a metal base laminate, comprising filling through holes in the plate with a fluororesin and forming an insulating resin layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22812185A JPS6287346A (en) | 1985-10-14 | 1985-10-14 | Manufacture of metallic base laminated plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22812185A JPS6287346A (en) | 1985-10-14 | 1985-10-14 | Manufacture of metallic base laminated plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6287346A true JPS6287346A (en) | 1987-04-21 |
Family
ID=16871539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22812185A Pending JPS6287346A (en) | 1985-10-14 | 1985-10-14 | Manufacture of metallic base laminated plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6287346A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0297085A (en) * | 1988-10-03 | 1990-04-09 | Matsushita Electric Works Ltd | Metal base laminated board |
-
1985
- 1985-10-14 JP JP22812185A patent/JPS6287346A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0297085A (en) * | 1988-10-03 | 1990-04-09 | Matsushita Electric Works Ltd | Metal base laminated board |
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